Patents by Inventor Takashi KASHIMURA

Takashi KASHIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED package and LED package mounting structure
    Patent number: 8716741
    Abstract: A highly reliable LED package mounting structure which can realize improvement in solder fatigue life at low costs is provided. An LED package has a light-emitting surface which is perpendicular to a mounting surface of a circuit board, comprises connection terminal portions on the side face or on the side face and the bottom face of the package, and is joined with the circuit board by soldering via the connection terminal portion. Furthermore, the shape of the solder is optimized by defining the relative position relation between the end of an electrode on the central side of the LED package on the bottom face of an LED package body and the end of a component mounting pad on the circuit board.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: May 6, 2014
    Assignee: Hitachi Consumer Electronics Co., Ltd.
    Inventors: Takashi Kashimura, Tetsuya Yamazaki
  • LED Package and LED Package Mounting Structure
    Publication number: 20110242450
    Abstract: A highly reliable LED package mounting structure which can realize improvement in solder fatigue life at low costs is provided. An LED package has a light-emitting surface which is perpendicular to a mounting surface of a circuit board, comprises connection terminal portions on the side face or on the side face and the bottom face of the package, and is joined with the circuit board by soldering via the connection terminal portion. Furthermore, the shape of the solder is optimized by defining the relative position relation between the end of an electrode on the central side of the LED package on the bottom face of an LED package body and the end of a component mounting pad on the circuit board.
    Type: Application
    Filed: October 20, 2010
    Publication date: October 6, 2011
    Applicant: Hitachi Consumer Electronics Co., Ltd.
    Inventors: Takashi KASHIMURA, Tetsuya Yamazaki