Abstract: A method for manufacturing a ceramic sintered body substrate includes of disposing a first metal paste on a surface of a ceramic substrate, and of firing the ceramic substrate on which the first metal paste is disposed. In the disposing the first metal paste, the first metal paste contains a plurality of first metal powders, a plurality of active metal powders, and a plurality of inorganic fillers excluding metals, and in the firing the ceramic substrate, a firing temperature is equal to or higher than a melting point of the first metal powders.

Abstract: A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.

Abstract: A controller applies a predetermined voltage to a fixed part detection excitation electrode to vibrate a movable part in a second direction and simultaneously applies a predetermined voltage to a fixed part drive electrode to vibrate the movable part in a first direction. The controller acquires, of the movable part, a first resonance frequency along the first direction and a second resonance frequency along the second direction. The controller controls a drive spring adjustment part to adjust a spring constant of the drive spring, such that the first resonance frequency is maintained constant, and controls a detection spring adjustment part to adjust a spring constant of the detection spring such that the second resonance frequency is maintained constant. The controller detects the angular velocity based on a result of synchronously detecting signal from the fixed part detection electrode with the first resonance frequency.

Abstract: A controller applies a predetermined voltage to a fixed part detection excitation electrode to vibrate a movable part in a second direction and simultaneously applies a predetermined voltage to a fixed part drive electrode to vibrate the movable part in a first direction. The controller acquires, of the movable part, a first resonance frequency along the first direction and a second resonance frequency along the second direction. The controller controls a drive spring adjustment part to adjust a spring constant of the drive spring, such that the first resonance frequency is maintained constant, and controls a detection spring adjustment part to adjust a spring constant of the detection spring such that the second resonance frequency is maintained constant. The controller detects the angular velocity based on a result of synchronously detecting signal from the fixed part detection electrode with the first resonance frequency.

Abstract: A MEMS device includes a fixed portion fixed to a pedestal, a movable portion arranged inside the fixed portion and configured to be displaceable with respect to the fixed portion, a connecting portion that connects the fixed portion and the movable portion, a piezoelectric element disposed on at least one of the fixed portion or the connecting portion, and a detection portion that output a signal corresponding to a distortion of the movable portion. A voltage is applied to the piezoelectric element on the basis of the output signal of the detection portion thereby reducing the distortion transmitted from the fixed portion to the movable portion.

Abstract: A force detection device includes: a substrate; and a force transmission block. The substrate includes: a mesa gauge arranged on a principal plane of the substrate and providing a bridge circuit; a connection region arranged on the principal plane; and a sealing portion surrounding all around the mesa gauge and connected to the force transmission block. The mesa gauge includes: a first mesa gauge extending in a first direction; and a second mesa gauge extending in a second direction and spaced apart from the first mesa gauge. The connection region electrically connects the one end of the first mesa gauge and the one end of the second mesa gauge.

Abstract: A force detection apparatus includes a substrate and a force transmission block. The substrate includes: a high-sensitive mesa gauge that is provided on a main surface, extends in a first direction to produce a relatively large change of an electric resistance in accordance with compressive stress, and includes a top surface; a low-sensitive mesa gauge that is provided on the main surface, extends in a second direction to produce a relatively small change of an electric resistance, and includes a top surface; and a mesa lead that is provided on the main surface, extends in a third direction, and includes a top surface. The force transmission block contacts the top surface of the high-sensitive mesa gauge and the top surface of the low-sensitive mesa gauge, and is non-contact with at least a part of the top surface of the mesa lead.

Abstract: A variable focus mirror includes a base portion, a first piezoelectric element, a reflection surface portion, and a second piezoelectric element. The base portion has a plate shape with a recessed portion on a back surface. The first piezoelectric element is arranged on a front surface of the base portion where the recessed portion is arranged. The reflection surface portion is arranged on the first piezoelectric element. The reflection surface portion is arranged opposite to the base portion with respect to the first piezoelectric element. The second piezoelectric element is arranged on the front surface of the base portion. The second piezoelectric element covers the part of the base portion where the recessed portion is arranged and the part of the base portion outside the recessed portion. The second piezoelectric element is separated from the first piezoelectric element.

Abstract: A force detection device includes: a substrate that includes a power supply wire, a reference wire, a first output wire, a second output wire and first to fourth mesa gauges extending along a first direction; and a force transmission block connected to the substrate. A pair of the first and second mesa gauges and a pair of the third and fourth mesa gauges are connected in parallel to each other between the power supply wire and the reference wire. The first output wire is connected between the first and second mesa gauges. The second output wire is connected between the third and fourth mesa gauges. A contact area of the force transmission block with a first pair of the first and fourth mesa gauges is different from a contact area of the force transmission block with a second pair of the second and third mesa gauges.

Abstract: A force detection device includes: a substrate that includes a power supply wire, a reference wire, a first output wire, a second output wire and first to fourth mesa gauges extending along a first direction; and a force transmission block connected to the substrate. A pair of the first and second mesa gauges and a pair of the third and fourth mesa gauges are connected in parallel to each other between the power supply wire and the reference wire. The first output wire is connected between the first and second mesa gauges. The second output wire is connected between the third and fourth mesa gauges. A contact area of the force transmission block with a first pair of the first and fourth mesa gauges is different from a contact area of the force transmission block with a second pair of the second and third mesa gauges.

Abstract: A force detection device includes: a substrate; and a force transmission block. The substrate includes: a mesa gauge arranged on a principal plane of the substrate and providing a bridge circuit; a connection region arranged on the principal plane; and a sealing portion surrounding all around the mesa gauge and connected to the force transmission block. The mesa gauge includes: a first mesa gauge extending in a first direction; and a second mesa gauge extending in a second direction and spaced apart from the first mesa gauge. The connection region electrically connects the one end of the first mesa gauge and the one end of the second mesa gauge.

Abstract: A dynamic quantity sensor includes a first substrate and a second substrate. The first substrate has one surface, another surface opposite to the one surface, and a depressed portion defining a thin portion. The second substrate has one surface attached to the first substrate and a recessed portion disposed corresponding to the depressed portion. At least a part of a first projection line obtained by projecting the recessed portion is disposed outside of a second projection line obtained by projecting a boundary line between side walls of the depressed portion and the thin portion. The thin portion disposed inside the periphery of the recessed portion provides a film portion which is displaceable corresponding to a physical quantity applied to the film portion, and a region sandwiched between the film portion and a portion connected to the periphery of the recessed portion provides a stress release region.

Abstract: A force detection apparatus includes a substrate and a force transmission block. The substrate includes: a high-sensitive mesa gauge that is provided on a main surface, extends in a first direction to produce a relatively large change of an electric resistance in accordance with compressive stress, and includes a top surface; a low-sensitive mesa gauge that is provided on the main surface, extends in a second direction to produce a relatively small change of an electric resistance, and includes a top surface; and a mesa lead that is provided on the main surface, extends in a third direction, and includes a top surface. The force transmission block contacts the top surface of the high-sensitive mesa gauge and the top surface of the low-sensitive mesa gauge, and is non-contact with at least a part of the top surface of the mesa lead.

Abstract: A dynamic quantity sensor includes a first substrate and a second substrate. The first substrate has one surface, another surface opposite to the one surface, and a depressed portion defining a thin portion. The second substrate has one surface attached to the first substrate and a recessed portion disposed corresponding to the depressed portion. At least a part of a first projection line obtained by projecting the recessed portion is disposed outside of a second projection line obtained by projecting a boundary line between side walls of the depressed portion and the thin portion. The thin portion disposed inside the periphery of the recessed portion provides a film portion which is displaceable corresponding to a physical quantity applied to the film portion, and a region sandwiched between the film portion and a portion connected to the periphery of the recessed portion provides a stress release region.

Abstract: In a method for producing a semiconductor device having a through electrode structure, a masking material is formed so as to bridge over a through hole formed in a second semiconductor substrate, and a hole is formed in the masking material at a position corresponding to the through hole. A contact hole is formed in an insulating film via this hole. In such a method, even if there is a large level difference from the surface of the second semiconductor substrate to the bottom of the through hole, only the masking material bridged over the through hole is exposed by photolithography. Therefore, photolithography for a large level difference is not necessary. As a result, the hole can be formed in the masking material successfully, and the contact hole can be formed successively by an anisotropic dry etching via this hole, even in the case where etching for a large level difference is performed.

Abstract: An angular velocity sensor includes a vibrator located along x-y plane specified by x direction and y direction that are orthogonal to each other; a substrate that is separated away from the vibrator along z direction perpendicular to the x-y plane; an anchor device extended from the substrate to the x-y plane in which the vibrator is located; a linkage beam device that links the anchor device to the vibrator, the linkage beam being able to twist about the y direction; an excitation portion that vibrates the vibrator along the z direction; and a detection portion that detects an angular velocity based on a displacement along the x direction of the vibrator. The vibrator includes a linkage region to link with the linkage beam device, and the linkage region becomes a wave node when the vibrator vibrates along the z direction.

Abstract: In a method for producing a semiconductor device having a through electrode structure, a masking material is formed so as to bridge over a through hole formed in a second semiconductor substrate, and a hole is formed in the masking material at a position corresponding to the through hole. A contact hole is formed in an insulating film via this hole. In such a method, even if there is a large level difference from the surface of the second semiconductor substrate to the bottom of the through hole, only the masking material bridged over the through hole is exposed by photolithography. Therefore, photolithography for a large level difference is not necessary. As a result, the hole can be formed in the masking material successfully, and the contact hole can be formed successively by an anisotropic dry etching via this hole, even in the case where etching for a large level difference is performed.

Abstract: An angular velocity sensor includes a vibrator, a support substrate, an anchor section, a connection beam section, a driving section, and a detection section. The vibrator includes an inner vibrator and an outer vibrator, which vibrate in opposite circumferential directions when driven by the driving section. The connection beam section couples the vibrator to the anchor section, and is elastic in a z-direction and a circumferential direction. The connection beam section includes first connection beams, each of which is coupled to the outer vibrator at one end and is coupled to the inner vibrator at the other end, and second connection beams, each of which is coupled to a vibration node of a corresponding first connection beam at one end and is coupled to the anchor section at the other end.

Abstract: In an angular velocity sensor, a vibrator is coupled with a substrate through a beam part, and is movable in a first direction and a second direction that is perpendicular to the first direction. A driving part is configured to vibrate the vibrator in the first direction. A detecting part is configured to detect displacement of the vibrator in the second direction as a change in capacitance, the displacement being caused by Coriolis force generated in the vibrator due to vibration of the vibrator and an angular velocity around a third direction that is perpendicular to the first direction and the second direction. A restricting part is configured to restrict displacement of the vibrator in the second direction based on the change in capacitance. The angular velocity sensor is configured to satisfy a condition where ? sin ? is equal to or less than 1.

Abstract: An angular velocity sensor includes a vibrator located along x-y plane specified by x direction and y direction that are orthogonal to each other; a substrate that is separated away from the vibrator along z direction perpendicular to the x-y plane; an anchor device extended from the substrate to the x-y plane in which the vibrator is located; a linkage beam device that links the anchor device to the vibrator, the linkage beam being able to twist about the y direction; an excitation portion that vibrates the vibrator along the z direction; and a detection portion that detects an angular velocity based on a displacement along the x direction of the vibrator. The vibrator includes a linkage region to link with the linkage beam device, and the linkage region becomes a wave node when the vibrator vibrates along the z direction.