Abstract: A recording device 11 has a control unit 20 that executes multiple restore processes. The control unit restores a backbone system based on a restore file stored in a USB memory UM if the recording device 11 is started with the USB memory UM already connected. The control unit initializes the backbone system based on an initialization file in the USB memory UM when the USB memory UM is newly connected while the recording device 11 is already running. The control unit creates a restore file to restore the backbone system, and saves the created restore file to the USB memory UM if an initialization file is not already stored in the USB memory UM.

Abstract: A recording device transmits attribute information. A management device receives the attribute information transmitted by the recording device, and sends environmental settings information stored relationally to the attribute information to the recording device. The recording device receives the environmental settings information sent by the management device, configures environmental settings based on the environmental settings information, and sends a configuration completion report indicating configuration was completed to the management device when configuration is completed. The management device receives the configuration completion report sent by the recording device, and stores the environmental settings information sent to the recording device relationally to the identification information of the recording device.

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Abstract: A method for producing a semiconductor device having a semiconductor element obtained by dividing a semiconductor wafer comprises a temporary securing step of arranging a temporary securing film between a support member and the semiconductor wafer so as to temporarily secure the support member and the semiconductor wafer to each other; a grinding step of grinding a surface on the side opposite from the temporary securing film of the semiconductor wafer temporarily secured to the support member, and a semiconductor wafer peeling step of peeling the temporary securing film from the ground semiconductor wafer, wherein a semiconductor wafer edge-trimmed on an outer peripheral part of a surface opposing the support member is used as the semiconductor wafer, and the temporary securing step arranges the temporary securing film on the inside of the edge-trimmed part.

Abstract: Provided is a method for manufacturing a semiconductor device through which improvement of production efficiency can be achieved. In the method of manufacturing the semiconductor device (1), a sealing material (7) is attached to seal a semiconductor element (3), a release film (F) is provided in a mold facing the semiconductor element (3), and the sealing material (7) is cured by an upper mold (22) and a lower mold (24). A metal layer (9) that shields electromagnetic waves is previously provided on a side of the release film (F) coming in contact with the sealing material (7). In the curing of the sealing material (7), the metal layer (9) is transferred to the sealing material (7).

Abstract: The relationship between sending devices and receiving devices can be controlled with a high degree of freedom when sending and receiving data between multiple devices. A POS system 1 has a control tablet 101 that transmits data, a host device 11, and a display tablet 102. The host device 11 has a storage unit 25 with a data storage box 26 that is related to the display tablet 102 and stores data, and a device control unit 20 that stores data sent by the control tablet 101 in the data storage box 26, sends the data to the display tablet 102, and processes a report sent from the display tablet 102.

Abstract: Devices can be controlled by group even when multiple devices compatible with different interface standards are connected. An iProduct identifier enabling recognition by the host side as interfaces in the same group is set in the USB 2.0 hub and USB 3.0 hub in the same publisher. The host side determines if the hubs belong to the same group based on the iProduct identifier, and coordinates operation of the USB devices to connected to the USB 2.0 hub and USB 3.0 hub determined to be in the same group.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract: A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract: A method for manufacturing a semiconductor device 1, comprising a first step of providing a photosensitive adhesive (insulating resin layer 7) on a board 3 which has a connecting terminal, a second step of patterning the photosensitive adhesive by light exposure and development so that openings 13 are formed where the connecting terminal is exposed, a third step of filling the openings 13 with a conductive material to form a conductive layer 9, and a fourth step of directly bonding a semiconductor chip 5 having a connecting electrode section to the photosensitive adhesive while electrically connecting the connecting terminal of the board 3 and the connecting electrode section of the semiconductor chip 5 via the conductive layer 9.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract: A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.

Abstract: Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm2 or less at 30° C. and 200 gf/cm2 or more at 120° C.

Abstract: The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.

Abstract: The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.