Patents by Inventor Takashi Kawamura
Takashi Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250233576Abstract: To provide a vibration element having a structure capable of efficiently performing electric field-to-magnetic field conversion. The vibration element according to the present technology includes a vibration part in which a plurality of layers is laminated, the plurality of layers including a plurality of first elastic layers that is elastically deformed by electric field application, and at least one second elastic layer that is elastically deformed by magnetic field application. In accordance with the vibration element according to the present technology, a vibration element having a structure capable of efficiently performing electric field-to-magnetic field conversion can be provided. In accordance with the vibration element according to the present technology, a vibration element having a structure capable of efficiently performing electric field-to-magnetic field conversion can be provided.Type: ApplicationFiled: February 3, 2023Publication date: July 17, 2025Inventors: TAKUMA MATSUSHITA, TAKASHI KAWAMURA
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Patent number: 12279363Abstract: Provided is an electromagnetic wave absorber capable of further expanding applicable objects while reducing a size of a unit structure, and at the same time, improving the degree of freedom in arrangement.Type: GrantFiled: September 14, 2021Date of Patent: April 15, 2025Assignee: SONY GROUP CORPORATIONInventor: Takashi Kawamura
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Publication number: 20250091994Abstract: The object of the present invention is to provide a Ras/Raf binding inhibitory compound exhibiting a Ras/Raf signaling inhibitory action even against cancer cells bearing proved drug resistance and those with a variety of Ras mutations. The Ras/Raf binding inhibitory compound of the present invention is represented by the following formula (I) (wherein A, B, X, and R1 to R4 are as defined in the present description).Type: ApplicationFiled: July 29, 2022Publication date: March 20, 2025Applicant: NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITYInventors: Fumi SHIMA, Yoko YOSHIKAWA, Shigeyuki MATSUMOTO, Yoshiteru MAKINO, Hirokazu KUBOTA, Hitomi YUKI, Takashi KUMASAKA, Takashi KAWAMURA, Ko KIKUZATO
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Publication number: 20250079707Abstract: An antenna according to an embodiment of the present technology includes a loop-shaped conductor and a structure. The loop-shaped conductor is configured in a loop shape surrounding a first direction and has a gap configured using a predetermined second direction orthogonal to the first direction as a reference. The structure is electrically connected to the loop-shaped conductor and arranged orthogonally to the second direction. Accordingly, it is possible to achieve a reduction of a distance from the human body and a reduction of a clearance from a metal part, and it is very advantageous for downsizing the electronic apparatus. Moreover, it is possible to exhibit high communication performance.Type: ApplicationFiled: September 16, 2022Publication date: March 6, 2025Inventors: YUKIO KANEKO, TAKASHI KAWAMURA, NOBUYUKI MORI
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Publication number: 20240283547Abstract: The present technology relates to a communication device and a communication system that enable favorable communication in a liquid. A communication device includes a first antenna connected to a communication network in a liquid, and a first signal processing unit that processes at least one of a signal received by the first antenna or a signal transmitted by the first antenna, in which the first antenna is a circularly polarized antenna. A second antenna connected to a communication network in gas, and a second signal processing unit that processes at least one of a signal received by the second antenna or a signal transmitted by the second antenna are further included. The present technology can be applied to, for example, a communication device installed in sea water.Type: ApplicationFiled: February 15, 2022Publication date: August 22, 2024Applicant: Sony Group CorporationInventors: Takashi KAWAMURA, Takuma MATSUSHITA, Toshinori KONDO, Futoshi TAKEUCHI
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Publication number: 20240275056Abstract: In an antenna for wireless communication via a lossy medium, a structure thereof is optimized to improve transmission characteristics such as a transmission coefficient. The antenna includes at least one pair of electrodes and a sheath portion. The sheath portion includes a wiring electrically connecting each of the at least one pair of electrodes and a corresponding power supply terminal. The sheath portion is also referred to as a sheath. In this antenna, a minimum diameter of the electrode is larger than a width of the wiring included in the sheath portion. A shape of each of the at least one pair of electrodes is, for example, substantially spherical.Type: ApplicationFiled: December 28, 2021Publication date: August 15, 2024Applicant: Sony Group CorporationInventor: Takashi KAWAMURA
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Patent number: 11908640Abstract: A push switch contains a case including a containing portion and a sealing groove; a pair of contacts disposed in the containing portion so as to be spaced apart from each other; a movable contact which is disposed above the pair of contacts in the containing portion; a cap including a base portion disposed on the case and a sealing protrusion protruding from a peripheral edge portion of the base portion toward a lower side for liquid-tightly sealing the sealing groove of the case; and a cover attached to the case from an upper side so as to hold the cap on the case. The sealing protrusion of the cap is compressively deformed in the sealing groove of the case, and thereby the sealing groove of the case is liquid-tightly sealed.Type: GrantFiled: July 15, 2022Date of Patent: February 20, 2024Assignee: MITSUMI ELECTRIC CO., LTD.Inventors: Yoichi Yasunaga, Takashi Kawamura
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Publication number: 20240006749Abstract: To provide a wave control medium that can absorb and control wave motion while achieving downsizing and wider bandwidth of a metamaterial and the like. A wave control medium 5 includes a three-dimensional microstructure having a base 2, a spiral part 3, and a matching element 6 disposed between the base 2 and the spiral part 3, in which the three-dimensional microstructure includes a material selected from any one of a metal, a dielectric, a magnetic body, a semiconductor, and a superconductor, or a combination of a plurality of these materials. The wave control medium 5 can absorb the wave motion by having the matching element 6 disposed between the base 2 and the spiral part 3 to moderate a change in the entire impedance value.Type: ApplicationFiled: October 13, 2021Publication date: January 4, 2024Inventors: Eri IGARASHI, Takashi KAWAMURA
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Patent number: 11852548Abstract: A switch according to the present invention includes a base including a recessed portion on one surface of the base; a click spring having a dome shape, the click spring being provided at the recessed portion such that the bottom of the recessed portion is contacted at a dome-shaped opening side of the click spring; a cover provided to cover the recessed portion and to house the click spring at the recessed portion; and a strain detecting element attached to another surface of the base. The strain detecting element is configured to detect strain of the base, the strain occurring in accordance with a depression amount of the click spring that is depressed.Type: GrantFiled: April 17, 2019Date of Patent: December 26, 2023Assignee: MITSUMI ELECTRIC CO., LTD.Inventors: Takashi Kawamura, Yoichi Yasunaga, Takeshi Higaki, Toshihiko Terashita, Shintaro Ogura, Shigenori Inamoto, Yuki Takahashi, Kotaro Eguchi, Kui Li, Satoshi Sato
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Publication number: 20230397324Abstract: Provided is an electromagnetic wave absorber capable of further expanding applicable objects while reducing a size of a unit structure, and at the same time, improving the degree of freedom in arrangement.Type: ApplicationFiled: September 14, 2021Publication date: December 7, 2023Inventor: TAKASHI KAWAMURA
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Publication number: 20230327342Abstract: A small-sized normal mode helical antenna is provided that is not affected by nearby conductors. The antenna is an antenna including a coil constituting a normal mode helical antenna, an area of a cross section perpendicular to an axis of the coil for a single turn at each end of the coil being less than an area of a cross section perpendicular to the axis of the coil near the coil center.Type: ApplicationFiled: August 17, 2021Publication date: October 12, 2023Inventors: YUKIO KANEKO, TAKASHI KAWAMURA, TETSUO IKEDA
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Patent number: 11784398Abstract: An antenna device includes: a first terminal to which a high-frequency signal is input; a second terminal connected to the ground; a first radiation unit that is formed in a helical shape whose maximum diameter is a first diameter; a second radiation unit that is formed in a helical shape having one end continuous with one end of the first radiation unit and whose maximum diameter is a second diameter larger than the first diameter, and having another end which is an open end; first wiring that connects another end of the first radiation unit and the first terminal; and second wiring that connects the another end of the first radiation unit and the second terminal.Type: GrantFiled: July 25, 2019Date of Patent: October 10, 2023Assignees: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, SONY CORPORATIONInventors: Takashi Kawamura, Masahiro Sato
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Publication number: 20230013822Abstract: A push switch contains a case including a containing portion and a sealing groove; a pair of contacts disposed in the containing portion so as to be spaced apart from each other; a movable contact which is disposed above the pair of contacts in the containing portion; a cap including a base portion disposed on the case and a sealing protrusion protruding from a peripheral edge portion of the base portion toward a lower side for liquid-tightly sealing the sealing groove of the case; and a cover attached to the case from an upper side so as to hold the cap on the case. The sealing protrusion of the cap is compressively deformed in the sealing groove of the case, and thereby the sealing groove of the case is liquid-tightly sealed.Type: ApplicationFiled: July 15, 2022Publication date: January 19, 2023Inventors: Yoichi YASUNAGA, Takashi KAWAMURA
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Patent number: 11458442Abstract: An ultrasonic homogenizer includes an ultrasonic transducer; an ultrasonic horn that irradiates an ultrasonic wave generated by the ultrasonic transducer; a holder that receives an irradiating surface of the ultrasonic horn; an intake port that is provided on a bottom face of the holder and intakes a mixture liquid into the holder; and an ejection port that is provided on the holder above the intake port and discharges the mixture liquid supplied inside the holder; an opening area of the intake port being smaller than an irradiating area of the ultrasonic horn and the irradiating surface of the ultrasonic horn being disposed above the intake port whereby facing the intake port.Type: GrantFiled: November 20, 2020Date of Patent: October 4, 2022Assignee: KAIJO CORPORATIONInventors: Mineyuki Sekimoto, Hitoshi Yamamoto, Hiroshi Hasegawa, Takashi Kawamura
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Patent number: 11336241Abstract: Provided is a high-frequency amplifier capable of making a circuit substrate small and reducing a cost. A high-frequency amplifier is provided with a first substrate including a matching unit, and a second substrate including a transistor and a first impedance converter connected to each other, in which the matching unit of the first substrate and the first impedance converter are connected to each other via a first connection. Furthermore, the high-frequency amplifier is further provided with a third substrate including a matching unit, in which the second substrate may further include a second impedance converter connected to the transistor, and the second impedance converter and the matching unit of the third substrate may be connected to each other via a second connection.Type: GrantFiled: September 12, 2018Date of Patent: May 17, 2022Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takashi Kawamura, Masahiro Sato
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Patent number: 11217871Abstract: A distributor and a synthesizer with low loss are disclosed. In one example, a distributor/synthesizer has a distribution line that distributes a path from an input branch unit connected to an external transmission line on an input side into n-distributed paths. An output branch unit divides the n-distributed paths into an internal side and an external transmission line on an output side. On the internal side, a phase adjustment unit is arranged between the output branch unit and a coupling terminal, and adjusts the phase. A phase rotation amount from the input branch unit to the output branch unit of each of the n-distributed paths is ?/2 [rad], and a phase rotation amount from the output branch unit to the coupling terminal is ? [rad] or a real number multiple of ? [rad]. The present disclosure can, for example, be applied to an FEM of a signal processing device.Type: GrantFiled: June 15, 2018Date of Patent: January 4, 2022Assignee: Sony Semiconductor Solutions CorporationInventors: Takashi Kawamura, Masahiro Sato, Takanori Okamura, Taichi Yamada
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Publication number: 20210391644Abstract: An antenna device includes: a first terminal to which a high-frequency signal is input; a second terminal connected to the ground; a first radiation unit that is formed in a helical shape whose maximum diameter is a first diameter; a second radiation unit that is formed in a helical shape having one end continuous with one end of the first radiation unit and whose maximum diameter is a second diameter larger than the first diameter, and having another end which is an open end; first wiring that connects another end of the first radiation unit and the first terminal; and second wiring that connects the another end of the first radiation unit and the second terminal.Type: ApplicationFiled: July 25, 2019Publication date: December 16, 2021Inventors: TAKASHI KAWAMURA, MASAHIRO SATO
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Patent number: 11178762Abstract: A connection structure for a wiring substrate and a flexible substrate including a wiring substrate and a flexible substrate, in which the wiring substrate includes an insulating member, conductor layer, and ground layer, the flexible substrate includes an insulating sheet and metal film, and the metal film includes a signal line pad joined to the conductor layer via a joining material when viewed from the back surface of the flexible substrate. When viewed from behind the flexible substrate, there is an overlap region where the signal line pad and conductor layer overlap. In a cross-section when the overlap region is cut in a direction perpendicular to a signal transmission direction, in a case where a width of the signal line pad including the overlap region is W, and a width of the conductor layer including the overlap region is W0, the connection structure satisfies W0<W.Type: GrantFiled: March 3, 2020Date of Patent: November 16, 2021Assignees: NGK Electronics Devices, Inc., NGK Insulators, Ltd.Inventors: Takashi Kawamura, Masato Ishizaki, Naoki Gotou
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Publication number: 20210265961Abstract: Provided is a high-frequency amplifier capable of making a circuit substrate small and reducing a cost. A high-frequency amplifier is provided with a first substrate including a matching unit, and a second substrate including a transistor and a first impedance converter connected to each other, in which the matching unit of the first substrate and the first impedance converter are connected to each other via a first connection. Furthermore, the high-frequency amplifier is further provided with a third substrate including a matching unit, in which the second substrate may further include a second impedance converter connected to the transistor, and the second impedance converter and the matching unit of the third substrate may be connected to each other via a second connection.Type: ApplicationFiled: September 12, 2018Publication date: August 26, 2021Inventors: TAKASHI KAWAMURA, MASAHIRO SATO
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Publication number: 20210257472Abstract: The wiring length of MOS transistors is shortened. A source region has both ends made smaller in width than a central part. A first channel region and a second channel region are adjacent to corresponding outer peripheral parts. A first drain region and a second drain region are adjacent to the first channel region and the second channel region, respectively. Gate electrodes are on respective surfaces of the first channel region and the second channel region through an insulating film, joined to each other, and connected to a gate wire. Drain electrodes are placed on the respective surfaces of the first drain region and the second drain region and joined to each other near a second end and connected to a drain wire. At least one of the gate wire or the drain wire is smaller in width than the central part of the source region.Type: ApplicationFiled: August 2, 2019Publication date: August 19, 2021Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Masahiro SATO, Takashi KAWAMURA