Patents by Inventor Takashi Kayamoto
Takashi Kayamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9556524Abstract: A temperature regulator or the like that can circulate a desired thermal medium and efficiently transfer the heat of the thermal medium is provided. The temperature regulator includes a pipe that is made of a metal or alloy with corrosion resistance to a predetermined thermal medium and that serves as a flow path for circulating the thermal medium; and a plate in which the pipe is buried, wherein the plate is formed by accelerating powder made of aluminum (Al) or alloy together with a gas and thereafter spraying the powder remaining in a solid phase toward the pipe so that the powder is deposited on the pipe.Type: GrantFiled: April 19, 2011Date of Patent: January 31, 2017Assignee: NHK Spring Co., Ltd.Inventors: Takashi Kayamoto, Gou Takahara
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Patent number: 9524888Abstract: A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat conductivity than a material of the heating substrate; and a bonding layer formed on a side of the pipe to be bonded to the heating substrate by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon.Type: GrantFiled: April 19, 2011Date of Patent: December 20, 2016Assignee: NHK Spring Co., Ltd.Inventors: Takashi Kayamoto, Satoshi Hirano
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Patent number: 9070487Abstract: A conductive member disposed as a power supply line and the like includes: a first conductive material and a second conductive material, at least one of which includes a conductive material having electrical resistance lower than that of aluminum; and a metal film formed by depositing powder including a metal, which is accelerated together with a gas and sprayed, in a sold state, onto a surface of a butting part, where the first conductive material and the second conductive material are butted against each other.Type: GrantFiled: December 26, 2011Date of Patent: June 30, 2015Assignee: NHK Spring Co., Ltd.Inventors: Takashi Kayamoto, Shinji Saito, Yuichiro Yamauchi
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Publication number: 20130292152Abstract: A conductive member disposed as a power supply line and the like includes: a first conductive material and a second conductive material, at least one of which includes a conductive material having electrical resistance lower than that of aluminum; and a metal film formed by depositing powder including a metal, which is accelerated together with a gas and sprayed, in a sold state, onto a surface of a butting part, where the first conductive material and the second conductive material are butted against each other.Type: ApplicationFiled: December 26, 2011Publication date: November 7, 2013Applicant: NHK SPRING CO., LTD.Inventors: Takashi Kayamoto, Shinji Saito, Yuichiro Yamauchi
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Publication number: 20130072075Abstract: Provided are a conductive member that is connectable to aluminum metal and can suppress a decrease in electrical conductivity, and a method of manufacturing the same. The conductive member is formed of aluminum or an alloy containing aluminum, and includes an electrical wire connection unit and a fastening unit, which are a base provided with a connection surface to be connected to another member, and a connection layer formed on the base by accelerating a powder of a metal or alloy, which has a lower ionization tendency than the base and has electrical conductivity equal to that of the base or higher, together with gas, and spraying and depositing the powder in the solid state on the connection surface.Type: ApplicationFiled: April 19, 2011Publication date: March 21, 2013Applicant: NHK SPRING CO., LTD.Inventor: Takashi Kayamoto
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Publication number: 20130056187Abstract: A temperature regulator or the like that can circulate a desired thermal medium and efficiently transfer the heat of the thermal medium is provided. The temperature regulator includes a pipe that is made of a metal or alloy with corrosion resistance to a predetermined thermal medium and that serves as a flow path for circulating the thermal medium; and a plate in which the pipe is buried, wherein the plate is formed by accelerating powder made of aluminum (Al) or alloy together with a gas and thereafter spraying the powder remaining in a solid phase toward the pipe so that the powder is deposited on the pipe.Type: ApplicationFiled: April 19, 2011Publication date: March 7, 2013Applicant: NHK SPRING CO., LTD.Inventors: Takashi Kayamoto, Gou Takahara
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Publication number: 20130043635Abstract: A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat conductivity than a material of the heating substrate; and a bonding layer formed on a side of the pipe to be bonded to the heating substrate by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon.Type: ApplicationFiled: April 19, 2011Publication date: February 21, 2013Applicant: NHK SPRING CO., LTD.Inventors: Takashi Kayamoto, Satoshi Hirano
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Patent number: 7220319Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: GrantFiled: April 15, 2003Date of Patent: May 22, 2007Assignee: Canon Anelva CorporationInventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda, Toshihiro Tachikawa, Tadashi Inokuchi, Takashi Kayamoto
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Patent number: 6687113Abstract: An electrostatic chuck comprising a ceramic chuck body having an adsorption face and an electrode for applying a potential to the adsorption face, the chuck body including a ceramic consisting mainly of MgO. The ceramic that consists mainly of MgO is doped with one or more additives selected from a group including TiC, TiO2, ZrO2, V2O5, Nb2O5, Ta2O5, Co3O4, Cr2O3, and NiO so that its electrical resistivity in a working temperature region ranges from 1×108 to 1×1012 &OHgr;·cm. This electrostatic chuck is highly resistant to a corrosive environment such as fluoride plasma.Type: GrantFiled: April 20, 2001Date of Patent: February 3, 2004Assignee: NHK Spring Co., Ltd.Inventors: Shinji Saito, Toshihiko Hanamachi, Takashi Kayamoto
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Publication number: 20030222416Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: ApplicationFiled: April 15, 2003Publication date: December 4, 2003Inventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda, Toshihiro Tachikawa, Tadashi Inokuchi, Takashi kayamoto
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Patent number: 6535371Abstract: A combination of a ceramic layer essentially consisting of magnesia ceramic material and a metallic layer is proposed for a layered assembly for use in applications such as electrostatic chucks which are subjected to thermal stress. A combination of magnesia ceramic material and ferritic stainless steel is preferred because of the similarities of the thermal expansion coefficients of these materials. When a larger difference in the thermal expansion coefficients exists between the selected combination of materials, a damper layer having an intermediate thermal expansion coefficient may be used so as to accommodate the difference in the thermal expansion of the two layers.Type: GrantFiled: April 26, 1999Date of Patent: March 18, 2003Inventors: Takashi Kayamoto, Toshihiko Hanamachi, Tadashi Inokuchi, Ryusuke Adachi
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Publication number: 20010055190Abstract: An electrostatic chuck comprising a ceramic chuck body having an adsorption face and an electrode for applying a potential to the adsorption face, the chuck body including a ceramic consisting mainly of MgO. The ceramic that consists mainly of MgO is doped with one or more additives selected from a group including TiC, TiO2, ZrO2, V2O5, Nb2O5, Ta2O5, Co3O4, Cr2O3, and NiO so that its electrical resistivity in a working temperature region ranges from 1×108 to 1×1012 &OHgr;·cm. This electrostatic chuck is highly resistant to a corrosive environment such as fluoride plasma.Type: ApplicationFiled: April 20, 2001Publication date: December 27, 2001Applicant: NHK Spring Co., Ltd.Inventors: Shinji Saito, Toshihiko Hanamachi, Takashi Kayamoto
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Patent number: 6074604Abstract: Provided is a brazing filler metal for brazing stainless steel at low temperatures so as not to adversely affect the properties of the stainless steel, and without producing any brittleness in the brazed joint. The brazing filler metal essentially consists of 5 to 30 weight % of Mn or Sn, 20 to 70 weight % of Cu, inevitable impurities, and a balance of Ni. The brazing filler metal may further include no more than 3 weight % of Cr and/or Si.Type: GrantFiled: May 29, 1998Date of Patent: June 13, 2000Assignee: NHK Spring Co., Ltd.Inventors: Shinji Saito, Takashi Kayamoto
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Patent number: RE42175Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: GrantFiled: May 21, 2009Date of Patent: March 1, 2011Assignees: Canon Anelva Corporation, NHK Spring Co., Ltd.Inventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda, Toshihiro Tachikawa, Tadashi Inokuchi, Takashi Kayamoto