Abstract: A ULSI micro-interconnect member having a substrate and a ULSI micro-interconnect formed on the substrate, wherein the ULSI micro-interconnect includes a barrier layer formed on the substrate and a ruthenium electroplating layer formed on the barrier layer; the ULSI micro-interconnect member further including a copper electroplating layer formed using the ruthenium electroplating layer as a seed layer; and a process for fabricating the ULSI micro-interconnect members.

Abstract: The object of the present invention is to provide a silver plated and/or a silver alloy plated article with high productivity, high reflectance in the visible light range, and excellent sulfidizing resistance. The present invention provides a silver electroplated and/or silver alloy electroplated article having an oxidation layer on its surface, wherein a silver plating layer and/or silver alloy plating layer is formed on a substrate by silver electroplating and/or silver alloy electroplating, and then subjected to oxidation treatment to form an oxidation layer on the surface thereof. The thickness of the oxidation layer formed on the surface of the plating layer is 0.05 ?m or more.

Abstract: An object of the present is to provide a ULSI micro-interconnect member having a seed layer which, particularly on the inner sidewalls of vias and trenches, is formed with a sufficient coverage and a film thickness uniform with that on surface portion, and which has a low level of impurities. Further objects of the invention are to provide a ULSI micro-interconnect member in which, by utilizing such a seed layer to subsequently effect copper electroplating, micro-interconnects have been formed without generating voids; a process for forming the same; and a semiconductor wafer in which such ULSI micro-interconnects have been formed.

Abstract: There is disclosed is a method comprising surface-processing a Sn based, Sn alloy based or Sn—Zn alloy based solder particle (1), applied as a coating, such as by electrical plating or melt plating, to the surface of a metal material, such as iron, a steel plate or copper, with a phosphate and a silicium containing compound, to form a protective film (2). There are also disclosed a solder material (6) in which a protective film (2) formed of a phosphate and a silicium containing compound is formed on the surface of the Sn—Zn based solder particle (1), and a solder paste formed of this solder material (6) and the flux.

Abstract: An acidic pretreating solution for silver plating, which comprises as an agent for preventing the silver deposition by displacement, an inorganic acid and/or an organic acid, and a silver plating process which uses this pretreating solution. The pretreating solution provides long lasting preventive effect against silver deposition by displacement and the resulting silver plated layer firmly adheres to a metal substrate surface.

Abstract: A rhodium-plated article with black or blue color is obtained through electroplating by using a plating bath comprising a conventional acid rhodium bath and an additive consisting of organocarboxylic acid, aromatic sulfonic acid or salts of these, amine, gelatin, butynediol, hypophosphite or a mixture thereof.