Abstract: A heat sink having pin-shaped fins, for example, for use in disposing of heat in printed boards for computers comprises a heat dissipating base plate and a plurality of comblike fin members arranged in parallel at a predetermined spacing on one surface of the base plate approximately perpendicular thereto, each of the fin members comprising pin-shaped fins arranged in a row and connector connecting the fins together each at one end thereof, the connector of each fin member being joined to the surface of the base plate. The fins are given a greater height and arranged with a reduced pitch with a higher density for disposal of increased amounts of heat. To prepare the heat sink, the fin members are blanked out from a metal sheet, the fin members and spacer plates are arranged alternately on one surface of a heat dissipating base plate approximately perpendicular thereto, the connectors of the fin members are joined to the base plate and the spacer plates are thereafter removed.