Patents by Inventor Takashi Koida

Takashi Koida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220102565
    Abstract: The purpose of the present invention is to improve the reliability of a photovoltaic cell. In the present invention, a photovoltaic cell (CL) comprises a back electrode (BE), a p-type semiconductor layer (semiconductor substrate 1S) disposed on the back electrode (BE), and an n-type semiconductor layer (NL) disposed on the semiconductor substrate (1S). The photovoltaic cell (CL) furthermore comprises: an anti-reflection film (ARF) disposed on the n-type semiconductor layer (NL), the anti-reflection film (ARF) being made of an insulating film; surface electrodes (SE) penetrating the anti-reflection film (ARF) to reach the n-type semiconductor layer (NL); and an electroconductive film (CF) disposed on the anti-reflection film (ARF) so as to cover the surface electrodes (SE), the electroconductive film (CF) being transparent and being electrically connected to the n-type semiconductor layer (NL).
    Type: Application
    Filed: August 26, 2019
    Publication date: March 31, 2022
    Inventors: Sachiko JONAI, Atsushi MASUDA, Takashi KOIDA, Hajime SHIBATA
  • Patent number: 11117345
    Abstract: The problem of the present invention is to offer a nonwoven fabric for reinforcing foam molded articles that enables cushion materials to be efficiently foam molded by improving adhesiveness of the reinforcing nonwoven fabric to a mold. The present invention is a nonwoven fabric for reinforcing foam molded articles, having a reinforcing nonwoven layer and at least one resin layer, wherein the reinforcing nonwoven layer and the at least one resin layer are laminated, the reinforcing nonwoven layer has a discontinuous part including a magnetic material, the at least one resin layer has a resin having softening point A of 20° C. or higher and 60° C. or lower, and the nonwoven fabric has an air permeability of 30 cc/cm2/sec or more and 300 cc/cm2/sec or less.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: September 14, 2021
    Assignee: TOYOBO CO., LTD.
    Inventors: Hiroaki Nishimura, Takashi Koida, Shinichiro Inatomi, Mariko Matsui
  • Patent number: 10583043
    Abstract: The present invention relates to a backing having a three-layer structure prepared by sticking together an inner fiber layer for holding a pasty preparation, a film layer having through-holes, and an air-permeable outer fiber layer which prevents leaking out of the pasty preparation or a liquid component exuded from the pasty preparation, and also relates to an aqueous patch using the backing which can be applied for a long time.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: March 10, 2020
    Assignees: TEIKOKU SEIYAKU CO., LTD., TOYOBO CO., LTD.
    Inventors: Sadanobu Shirai, Masahiro Inazuki, Miho Ishigure, Hideo Isoda, Hiroyuki Sakamoto, Takashi Koida, Hiroyasu Sakaguchi
  • Patent number: 10266976
    Abstract: It is provided that a nonwoven fabric for reinforcing foam molded articles which is excellent in the dimensional stability in a cutting/sewing step, in the followability to a mold in a foam molding step, and gives a foam molded article with excellent appearance and durability. A nonwoven fabric for reinforcing foam molded articles formed by interlacing at least 2 filament nonwoven fabric layers with different apparent density, wherein the nonwoven fabric has base weight of 50-110 g/m2, thickness of 0.5-1.2 mm, 23 to 50 N/5 cm stress at the time of 5% elongation in longitudinal direction, 15 N/5 cm or lower stress at the time of 5% elongation in transverse direction, and air permeability of 50 to 250 cm3/cm2·sec.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: April 23, 2019
    Assignee: TOYOBO CO., LTD.
    Inventors: Takashi Koida, Shinichiro Inatomi
  • Publication number: 20190071803
    Abstract: It is provided that a nonwoven fabric for reinforcing foam molded articles which is excellent in the dimensional stability in a cutting/sewing step, in the followability to a mold in a foam molding step, and gives a foam molded article with excellent appearance and durability. A nonwoven fabric for reinforcing foam molded articles formed by interlacing at least 2 filament nonwoven fabric layers with different apparent density, wherein the nonwoven fabric has dry heat shrinkage rate of ?1 to 2% in both longitudinal and transverse directions at the time of heat treatment at 80° C. for 30 minutes and tear strength of 20 N or higher in both longitudinal and transverse directions.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 7, 2019
    Inventors: Takashi Koida, Shinichiro Inatomi
  • Publication number: 20190054715
    Abstract: The problem of the present invention is to offer a nonwoven fabric for reinforcing foam molded articles that enables cushion materials to be efficiently foam molded by improving adhesiveness of the reinforcing nonwoven fabric to a mold. The present invention is a nonwoven fabric for reinforcing foam molded articles, having a reinforcing nonwoven layer and at least one resin layer, wherein the reinforcing nonwoven layer and the at least one resin layer are laminated, the reinforcing nonwoven layer has a discontinuous part including a magnetic material, the at least one resin layer has a resin having softening point A of 20° C. or higher and 60° C. or lower, and the nonwoven fabric has an air permeability of 30 cc/cm2/sec or more and 300 cc/cm2/sec or less.
    Type: Application
    Filed: February 28, 2017
    Publication date: February 21, 2019
    Applicant: TOYOBO CO., LTD.
    Inventors: Hiroaki Nishimura, Takashi Koida, Shinichiro Inatomi, Mariko Matsui
  • Patent number: 9982375
    Abstract: Provided is a thermocompression-bonding filament nonwoven fabric, which is inexpensive, has excellent molding properties and design properties, and is suitable as surface materials for automotive acoustic absorbing materials. The thermocompression-bonding filament nonwoven fabric comprising a polyester-based resin having a melting point of 250° C. or more, wherein the filament nonwoven fabric has a weight of 20 to 80 g/m2, a sum of 5% tensile loads in a MD and CD per weight of 1.0 to 1.9 (N/5 cm)/(g/m2), and a 180° C. dry heat shrinkage of 3.5% or less in both the MD and CD, and is not mechanically interlaced.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: May 29, 2018
    Assignee: Toyobo Co., Ltd.
    Inventors: Hideo Yoshida, Hiroyuki Sakamoto, Naofumi Minagawa, Takashi Koida
  • Publication number: 20180073174
    Abstract: It is provided that a nonwoven fabric for reinforcing foam molded articles which is excellent in the dimensional stability in a cutting/sewing step, in the followability to a mold in a foam molding step, and gives a foam molded article with excellent appearance and durability. A nonwoven fabric for reinforcing foam molded articles formed by interlacing at least 2 filament nonwoven fabric layers with different apparent density, wherein the nonwoven fabric has dry heat shrinkage rate of ?1 to 2% in both longitudinal and transverse directions at the time of heat treatment at 80° C. for 30 minutes and tear strength of 20 N or higher in both longitudinal and transverse directions.
    Type: Application
    Filed: November 14, 2017
    Publication date: March 15, 2018
    Inventors: Takashi Koida, Shinichiro Inatomi
  • Patent number: 9884030
    Abstract: The present invention relates to a backing for a water-based patch consisting of the following constituents, wherein the backing is excellent in pasty preparation retention and moisture retention, improves the persistence of drug efficacy by inhibiting the sublimation of the drug, gives neither restrained feeling nor rough feeling due to a thin thickness and an excellent elasticity, controls the moisture permeability, gives almost no sticky feeling and thereby gives an excellent feeling in application. A patch backing for a water-based pasty preparation consisting of a laminate, wherein the laminate consists of three layers, a film layer having through-holes is laminated between a nonwoven fabric layer A and a nonwoven fabric layer B, said film layer consists of a resin containing an olefin elastomer, the through-hole area per a hole is 0.02-0.18 mm2, and the opening ratio of the through-hole is 1-10%.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: February 6, 2018
    Assignees: TOYOBO CO., LTD., TEIKOKU SEIYAKU CO., LTD.
    Inventors: Hideo Isoda, Hiroyuki Sakamoto, Takashi Koida, Hiroyasu Sakaguchi, Sadanobu Shirai, Masahiro Inazuki, Miho Ishigure
  • Publication number: 20170282490
    Abstract: [PROBLEM] An object is to provide a reinforcing nonwoven for a foam-molded article, which makes it possible to further improve a mold-setting-property of the reinforcing nonwoven, and makes it possible to foam-mold a seat efficiently. [SOLUTION] A nonwoven for reinforcing a foam-molded article, the nonwoven comprising: a reinforcing nonwoven layer, and a resin layer; wherein, the resin layer overlaps the reinforcing nonwoven layer, a resin for the resin layer has a softening point A of not lower than 20° C. and not higher than 60° C., and the nonwoven has an air permeability of not lower than 30 cc/cm2/sec and not higher than 300 cc/cm2/sec.
    Type: Application
    Filed: August 31, 2015
    Publication date: October 5, 2017
    Applicant: Toyobo Co., Ltd.
    Inventors: Takashi Koida, Shinichiro Inatomi, Hideo Yoshida
  • Publication number: 20170043509
    Abstract: A three-dimensional network structure is impregnated with a foam material through an osmosis membrane. The foam material is then solidified. The foam material with which the three-dimensional network structure is impregnated is in contact with resin wires of the three-dimensional network on a wide area and is solidified. Thus, a bonded body that comprises the three-dimensional network structure and a foam and has improved connection strength can be manufactured.
    Type: Application
    Filed: April 14, 2015
    Publication date: February 16, 2017
    Applicant: Nagase & Co., Ltd.
    Inventors: Hajime Kitamoto, Takuya Nagase, Takashi Koida
  • Publication number: 20150345054
    Abstract: Provided is a thermocompression-bonding filament nonwoven fabric, which is inexpensive, has excellent molding properties and design properties, and is suitable as surface materials for automotive acoustic absorbing materials. The thermocompression-bonding filament nonwoven fabric comprising a polyester-based resin having a melting point of 250° C. or more, wherein the filament nonwoven fabric has a weight of 20 to 80 g/m2, a sum of 5% tensile loads in a MD and CD per weight of 1.0 to 1.9 (N/5 cm)/(g/m2), and a 180° C. dry heat shrinkage of 3.5% or less in both the MD and CD, and is not mechanically interlaced.
    Type: Application
    Filed: October 31, 2013
    Publication date: December 3, 2015
    Inventors: Hideo Yoshida, Hiroyuki Sakamoto, Naofumi Minagawa, Takashi Koida
  • Publication number: 20150132559
    Abstract: It is provided that a nonwoven fabric for reinforcing foam molded articles which is excellent in the dimensional stability in a cutting/sewing step, in the followability to a mold in a foam molding step, and gives a foam molded article with excellent appearance and durability. A nonwoven fabric for reinforcing foam molded articles formed by interlacing at least 2 filament nonwoven fabric layers with different apparent density, wherein the nonwoven fabric has base weight of 50-110 g/m2, thickness of 0.5-1.2 mm, 23 to 50 N/5 cm stress at the time of 5% elongation in longitudinal direction, 15 N/5 cm or lower stress at the time of 5% elongation in transverse direction, and air permeability of 50 to 250 cm3/cm2·sec.
    Type: Application
    Filed: May 30, 2013
    Publication date: May 14, 2015
    Applicant: Toyobo Co., Ltd.
    Inventors: Takashi Koida, Shinichiro Inatomi
  • Publication number: 20140305486
    Abstract: A multi-junction photovoltaic device and an integrated multi-junction photovoltaic device, having a two-terminal structure, in which subsequent layers can be stacked under conditions with minimal restrictions imposed by previously stacked layers. A plurality of photovoltaic cells having different spectral sensitivity levels are stacked such that at least the photovoltaic cells at the light-incident end and the opposite end have a conductive thin-film layer as the outermost layer that undergoes connection, the remaining photovoltaic cell has conductive thin-film layers as the outermost layers that undergo connection, and the outermost layers are bonded via anisotropic conductive adhesive layers containing conductive microparticles within a transparent insulating material.
    Type: Application
    Filed: June 27, 2014
    Publication date: October 16, 2014
    Inventors: Michio KONDO, Takashi KOIDA, Yoshiaki TAKEUCHI, Satoshi SAKAI, Yasuhiro YAMAUCHI
  • Publication number: 20130164495
    Abstract: The present invention relates to a backing for a water-based patch consisting of the following constituents, wherein the backing is excellent in pasty preparation retention and moisture retention, improves the persistence of drug efficacy by inhibiting the sublimation of the drug, gives neither restrained feeling nor rough feeling due to a thin thickness and an excellent elasticity, controls the moisture permeability, gives almost no sticky feeling and thereby gives an excellent feeling in application. A patch backing for a water-based pasty preparation consisting of a laminate, wherein the laminate consists of three layers, a film layer having through-holes is laminated between a nonwoven fabric layer A and a nonwoven fabric layer B, said film layer consists of a resin containing an olefin elastomer, the through-hole area per a hole is 0.02-0.18 mm2, and the opening ratio of the through-hole is 1-10%.
    Type: Application
    Filed: July 11, 2011
    Publication date: June 27, 2013
    Applicant: TOYOBO CO., LTD.
    Inventors: Hideo Isoda, Hiroyuki Sakamoto, Takashi Koida, Hiroyasu Sakaguchi, Sadanobu Shirai, Masahiro Inazuki, Miho Ishigure
  • Publication number: 20130138057
    Abstract: The present invention relates to a backing having a three-layer structure prepared by sticking together an inner fiber layer for holding a pasty preparation, a film layer having through-holes, and an air-permeable outer fiber layer which prevents leaking out of the pasty preparation or a liquid component exuded from the pasty preparation, and also relates to an aqueous patch using the backing which can be applied for a long time.
    Type: Application
    Filed: July 11, 2011
    Publication date: May 30, 2013
    Applicants: TOYOBO CO., LTD., TEIKOKU SEIYAKU CO., LTD.
    Inventors: Sadanobu Shirai, Masahiro Inazuki, Miho Ishigure, Hideo Isoda, Hiroyuki Sakamoto, Takashi Koida, Hiroyasu Sakaguchi
  • Publication number: 20120152340
    Abstract: A multi junction photovoltaic device and an integrated multi junction photovoltaic device, having a two-terminal structure, in which subsequent layers can be stacked under conditions with minimal restrictions imposed by previously stacked layers. Also, processes for producing these photovoltaic devices. A plurality of photovoltaic cells having different spectral sensitivity levels are stacked such that at least the photovoltaic cells (2, 4) at the light-incident end and the opposite end have a conductive thin-film layer (5a, 5d) as the outermost layer that undergoes connection, the remaining photovoltaic cell (3) has conductive thin-film layers (5b, 5c) as the outermost layers that undergo connection, and the outermost layers are bonded via anisotropic conductive adhesive layers (6a, 6b) containing conductive microparticles within a transparent insulating material.
    Type: Application
    Filed: June 10, 2010
    Publication date: June 21, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Michio Kondo, Takashi Koida, Yoshiaki Takeuchi, Satoshi Sakai, Yasuhiro Yamauchi
  • Publication number: 20070117489
    Abstract: A nonwoven fabric for forming vehicle molded articles which has a tensile stress of 0.1-20 N/5 cm at 5% elongation at 120° C. The nonwoven fabric may have a basis weight of 100 g/m2 or less and an apparent density of 0.08 to 0.04 g/cm3. The fiber(s) used in the nonwoven fabric may have a fiber diameter of 1 to 100 ?m. The nonwoven fabric may comprise fibers comprising a polyester material selected from the group consisting of polytrimethylene terephthalate, polybutylene terephthalate, polytetramethylene oxide glycol/polybutylene terephthalate copolymer, polyester elastomers, and amorphous polyesters.
    Type: Application
    Filed: December 16, 2004
    Publication date: May 24, 2007
    Inventors: Toshiya Yamamoto, Takashi Koida