Abstract: This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion PSUS of thickness TSUS of the stainless steel layer relative to thickness T and a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM200?0.0057PSUS+0.4.

Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.

Abstract: [Problem] To provide: a roll-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roll-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa1) 0.01-0.96 and a maximum waviness height (Wz1) of 0.2-5.0 ?m.

Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.

Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.

Abstract: This invention provides a roll-bonded laminate for an electronic device that exhibits high rigidity and a high elastic modulus and is suitable for housing applications. More specifically, this invention concerns a roll-bonded laminate for an electronic device composed of a stainless steel layer and an aluminum alloy layer, wherein thickness TAl (mm) and surface hardness HAl (HV) of the aluminum alloy layer and thickness TSUS (mm) and surface hardness HSUS (HV) of the stainless steel layer satisfy the correlation represented by Formula (1): HSUSTSUS2?(34.96+0.03×(HAlTAl2)2?3.57×HAlTAl2)/(?0.008×(HAlTAl2)2+0.061×HAlTAl2+1.354). This invention also concerns an electronic device housing.

Abstract: This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.

Abstract: This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion PSUS of thickness TSUS of the stainless steel layer relative to thickness T and a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM200?0.0057PSUS+0.4.

Abstract: It is an objective of the present invention to provide a metal laminate material, which has sufficient strength as well as molding processability, lightweight properties, and radiation performance, which is a metal laminate material that has a two-layer structure of a stainless steel layer and an aluminum layer or a three-layer structure of a 1st stainless steel layer, an aluminum layer, and a 2nd stainless steel layer, wherein tensile strength TS is 200?TS?550 (MPa), elongation EL is not less than 15%, and a surface hardness Hv of the stainless steel layer is not more than 300 for the metal laminate material.

Abstract: [Problem] To provide: a roil-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roil-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa1) 0.01-0.96 and a maximum waviness height (Wz1) of 0.2-5.0 ?m.

Abstract: An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.

Abstract: This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substrate 20 via RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrate 20 exhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle ? formed by a perpendicular at a film formation position 20a on the metal substrate 20 and a line from the film formation position 20a to a point 10a at which the perpendicular magnetic flux density is zero on the target 10 located at the position nearest to the film formation position 20a to 15 degrees or less.

Abstract: This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire has crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher and a ?? of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area is 6% or less.

Abstract: It is an objective of the present invention to provide a metal laminate material, which has sufficient strength as well as molding processability, lightweight properties, and radiation performance, which is a metal laminate material that has a two-layer structure of a stainless steel layer and an aluminum layer or a three-layer structure of a 1st stainless steel layer, an aluminum layer, and a 2nd stainless steel layer, wherein tensile strength TS is 200?TS?550 (MPa), elongation EL is not less than 15%, and a surface hardness Hv of the stainless steel layer is not more than 300 for the metal laminate material.

Abstract: An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum ?? of a peak based on the pole figure of the copper layer is within 5° and the tail width ?? of the peak based on the pole figure is within 15° Such a substrate for epitaxial growth is manufactured by a 1st step of performing heat treatment of a copper layer so that ?? is within 6° and the tail width ?? is within 25°, and after the 1st step, a 2nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1st step, so that ?? is within 5° and the tail width ?? is within 15°.

Abstract: An object of the present invention is to provide a method for producing a metal laminate material that maintains sufficient bonding strength and has superior production efficiency. A method for producing a metal laminate material by bonding two sheets, one sheet composed of a material M1 and the other sheet composed of a material M2, wherein each of M1 and M2 is a metal or alloy comprising any one or more selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi, comprises the steps of subjecting the faces of the two sheets to be bonded to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain; temporarily bonding the two sheets by roll pressure bonding; and conducting a thermal treatment to thereby bond the two sheets, and, when Tm1>Tm2 where Tm1 (K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.

Abstract: An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.

Abstract: This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire has crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher and a ?? of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area is 6% or less.

Abstract: This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substrate 20 via RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrate 20 exhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle ? formed by a perpendicular at a film formation position 20a on the metal substrate 20 and a line from the film formation position 20a to a point 10a at which the perpendicular magnetic flux density is zero on the target 10 located at the position nearest to the film formation position 20a to 15 degrees or less.

Abstract: An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum ?? of a peak based on the pole figure of the copper layer is within 5° and the tail width ?? of the peak based on the pole figure is within 15° Such a substrate for epitaxial growth is manufactured by a 1st step of performing heat treatment of a copper layer so that ?? is within 6° and the tail width ?? is within 25°, and after the 1st step, a 2nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1st step, so that ?? is within 5° and the tail width ?? is within 15°.