Patents by Inventor Takashi Kousaka
Takashi Kousaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8668983Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.Type: GrantFiled: December 12, 2007Date of Patent: March 11, 2014Assignee: The Yokohama Rubber Co., Ltd.Inventors: Masayuki Kawazoe, Hiroyuki Okuhira, Koichiro Miyoshi, Tomohiro Ito, Takashi Kousaka, Mitsuhiro Iwata
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Patent number: 8153229Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150° C., per 100 parts by weight of an epoxy resin (A).Type: GrantFiled: April 24, 2007Date of Patent: April 10, 2012Assignee: The Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Mitsuhiro Iwata, Tomohiro Ito
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Patent number: 8142875Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing: an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90° C.; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90° C. and has a softening point of not less than 120° C.; and a curing agent (D).Type: GrantFiled: April 24, 2007Date of Patent: March 27, 2012Assignee: The Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Mitsuhiro Iwata, Tomohiro Ito
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Patent number: 8137786Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face sheet of a honeycomb panel. The epoxy resin composition, which comprises: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D), is characterized in that the epoxy resin composition after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases.Type: GrantFiled: April 24, 2007Date of Patent: March 20, 2012Assignee: The Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Tomohiro Ito, Mitsuhiro Iwata, Koichiro Miyoshi
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Publication number: 20100062211Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.Type: ApplicationFiled: December 12, 2007Publication date: March 11, 2010Inventors: Masayuki Kawazoe, Hiroyuki Okuhira, Koichiro Miyoshi, Tomohiro Ito, Takashi Kousaka, Mitsuhiro Iwata
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Publication number: 20090130379Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150° C., per 100 parts by weight of an epoxy resin (A).Type: ApplicationFiled: April 24, 2007Publication date: May 21, 2009Applicant: The Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Mitsuhiro Iwata, Tomohiro Ito
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Publication number: 20090098335Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face sheet of a honeycomb panel. The epoxy resin composition, which comprises: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D), is characterized in that the epoxy resin composition after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases.Type: ApplicationFiled: April 24, 2007Publication date: April 16, 2009Applicant: T Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Tomohiro Ito, Mitsuhiro Iwata, Koichiro Miyoshi
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Publication number: 20090068395Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90° C.; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90° C. and has a softening point of not less than 120° C.; and a curing agent (D).Type: ApplicationFiled: April 24, 2007Publication date: March 12, 2009Applicant: The Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Mitsuhiro Iwata, Tomohiro Ito
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Patent number: 6611064Abstract: In the present invention, provided are a semiconductor device having a semiconductor-element-mounting substrate on which a semiconductor element has been mounted via an adhesive having an exothermic-reaction curing start temperature of 130° C. or below as measured with a differential scanning calorimeter at a heating rate of 10° C./minute, and a process for its fabrication.Type: GrantFiled: April 5, 2001Date of Patent: August 26, 2003Assignee: Hitachi Chemical Company, Ltd.Inventors: Takashi Kousaka, Naoya Suzuki, Toshiaki Tanaka, Masaaki Yasuda, Aizou Kaneda
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Patent number: 6404068Abstract: A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.Type: GrantFiled: February 20, 2001Date of Patent: June 11, 2002Assignee: Hitachi Chemical Company, Ltd.Inventors: Toshiaki Tanaka, Takafumi Dohdoh, Tsutomu Kitakatsu, Aizou Kaneda, Masaaki Yasuda, Takashi Kousaka, Akira Kageyama