Patents by Inventor Takashi Kume
Takashi Kume has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230415559Abstract: In a vibration damping device applying a magnetic force from a magnetic field generation unit to an orifice path communicating with fluid chambers into which a magnetic functional fluid is filled and controlling vibration damping properties. An intermediate cylindrical member to which an outer cylindrical member formed by a non-magnetic material is externally fit and fixed is formed by a ferromagnetic material. In the intermediate cylindrical member, a magnetic field acting opening part is provided at a position corresponding to the orifice path.Type: ApplicationFiled: November 8, 2022Publication date: December 28, 2023Applicant: Sumitomo Riko Company LimitedInventors: Masaaki Hirano, Takashi Kume
-
Publication number: 20230407940Abstract: In a fluid-filled cylindrical vibration damping device, an inner shaft member and an outer shaft member are elastically linked by a main rubber elastic body, and fluid chambers in which a fluid is filled are provided to be in communication with each other through an orifice path. The fluid filled in the fluid chambers is a magnetic functional fluid. The fluid-filled cylindrical vibration damping device includes a magnetic unit generating a magnetic field through power conduction. Magnetic path formation members to which the magnetic field is applied by the magnetic unit are arranged on sidewall portions on two facing sides in the orifice path. A magnetic flux concentration part 46 is provided at at least one the magnetic path formation members. A dimension of the magnetic flux concentration part in a length direction of the orifice path is reduced toward an inward side in a facing direction.Type: ApplicationFiled: September 7, 2023Publication date: December 21, 2023Applicant: Sumitomo Riko Company LimitedInventors: Masaaki HIRANO, Takashi KUME
-
Patent number: 11820431Abstract: A vehicle body damper brace including: a rod member having an elongated shape; a housing including a tubular part arranged externally about the rod member; an elastic connector including a first connection body comprising a viscoelastic material, the elastic connector elastically connecting the rod member and the housing to each other in an axis-perpendicular direction; and a regulator provided on at least one axial side of the first connection body and separately from the elastic connector, the regulator suppressing an amount of relative displacement between the rod member and the housing in a prizing direction.Type: GrantFiled: September 22, 2021Date of Patent: November 21, 2023Assignee: SUMITOMO RIKO COMPANY LIMITEDInventors: Munehiro Wada, Hiroyuki Ichikawa, Takashi Kume
-
Publication number: 20230296154Abstract: A tubular vibration-damping device including an inner shaft member and an outer tube member connected by a main rubber elastic body. The outer tube member is configured to be slidably inserted in an attachment tube in an axial direction, and is circumferentially divided so as to be radially deformable or displaceable. A pair of tighteners are disposed on axially opposite sides of the main rubber elastic body. The main rubber elastic body is fastened to an inner circumferential surface of the outer tube member. An adjustment elastic body against which the tighteners are pressed is integrally formed with axially opposite side portions of the main rubber elastic body. Sliding resistance in the axial direction between an outer circumferential surface of the outer tube member and an inner circumferential surface of the attachment tube is settable depending on a pressing force of the tighteners against the adjustment elastic body.Type: ApplicationFiled: November 18, 2022Publication date: September 21, 2023Inventors: Masaaki HIRANO, Takashi KUME
-
Publication number: 20230278413Abstract: In a fluid-filled vibration damping device in which multiple fluid chambers filled with a magnetic functional fluid communicate with each other by an orifice path, and a magnetic unit applying a magnetic field to the orifice path is provided in a state of being externally inserted to an outer cylindrical member, the magnetic unit includes a magnetic field generation part forming a magnetic field and a magnetic path formation part inducing a magnetic flux, the magnetic field is applied from a magnetic gap part of the magnetic path formation part arranged on an outer circumference of the orifice path to the orifice path, and on an outer circumferential surface of the outer cylindrical member, an installation part to which an outer mounting member realizing linking between the outer cylindrical member and a vibration damping linking target member is installed is biased from the magnetic field generation part in an axial direction.Type: ApplicationFiled: November 8, 2022Publication date: September 7, 2023Applicant: Sumitomo Riko Company LimitedInventors: Masaaki Hirano, Takashi Kume
-
Publication number: 20230067436Abstract: Provided is a sliding bushing in which sliding of an inner shaft member with respect to a main rubber elastic body is allowed. The inner shaft member includes a bulge part provided midway in an axial direction. A braided cloth-like sliding liner is arranged between the inner shaft member and the main rubber elastic body so as to be non-adhesive and slidable with respect to the inner shaft member. In a portion of the sliding liner arranged on an outer periphery with respect to a large diameter part of the bulge part of the inner shaft member, a coarse part is provided of coarser braid mesh than a portion of the sliding liner arranged on an outer periphery with respect to a small diameter part on both axial sides of the large diameter part.Type: ApplicationFiled: November 8, 2022Publication date: March 2, 2023Applicant: Sumitomo Riko Company LimitedInventor: Takashi Kume
-
Publication number: 20230029849Abstract: Provided is a sliding bushing in which an inner shaft member and an outer tube member are connected by a main rubber elastic body and sliding of the inner shaft member with respect to the main rubber elastic body is allowed. The inner shaft member includes a bulge part of a large diameter provided midway in an axial direction. The outer tube member includes a tapered part whose diameter decreases axially outward at both axial end portions. An outer peripheral surface of the bulge part in the inner shaft member includes a non-adhesive part that is non-adhesive to the main rubber elastic body and is allowed to slide with respect to the main rubber elastic body, and an outer peripheral surface axially outside the non-adhesive part in the inner shaft member includes an adhesive part to which the main rubber elastic body is adhered by vulcanization.Type: ApplicationFiled: October 7, 2022Publication date: February 2, 2023Applicant: Sumitomo Riko Company LimitedInventor: Takashi Kume
-
Patent number: 11279418Abstract: A vehicle-use resin module including a strength member made of synthetic resin and including a mounting hole, and an attachment member attached to the mounting hole and configured to be subjected to an external force. The attachment member includes an outer fitting having a tubular part arranged in the mounting hole in an inserted state. The outer fitting includes an outer circumferential projection projecting to a radially outer side of the tubular part. The strength member is an insertion-molded component having a structure in which the outer circumferential projection of the outer fitting is embedded so as to be inserted inside a circumferential wall of the mounting hole. A surface of the tubular part of the outer fitting and a surface of the outer circumferential projection are each directly fixed to the strength member with an adhesive.Type: GrantFiled: June 23, 2020Date of Patent: March 22, 2022Assignee: SUMITOMO RIKO COMPANY LIMITEDInventors: Hiroyuki Ichikawa, Takashi Kume, Munehiro Wada
-
Publication number: 20220009553Abstract: A vehicle body damper brace including: a rod member having an elongated shape; a housing including a tubular part arranged externally about the rod member; an elastic connector including a first connection body comprising a viscoelastic material, the elastic connector elastically connecting the rod member and the housing to each other in an axis-perpendicular direction; and a regulator provided on at least one axial side of the first connection body and separately from the elastic connector, the regulator suppressing an amount of relative displacement between the rod member and the housing in a prizing direction.Type: ApplicationFiled: September 22, 2021Publication date: January 13, 2022Inventors: Munehiro WADA, Hiroyuki ICHIKAWA, Takashi KUME
-
Publication number: 20210381577Abstract: A vibration isolating device is provided. An inner shaft member and an outer tube member are connected to each other with a main body rubber elastic body and plural fluid chambers filled with a fluid are provided to be separated from each other in a circumferential direction and communicates with each other through an orifice passage. The fluid is a magnetically functional fluid. The outer tube member is a non-magnetic material. A tubular cover member is disposed to be separated toward an outer circumferential side from the outer tube member. A magnetic field generating unit exerting a magnetic field on the magnetically functional fluid is assembled between the outer tube member and the tubular cover member. One side member and another side member to be connected to each other in a vibration isolating manner are configured to be attached to the inner shaft member and the tubular cover member.Type: ApplicationFiled: August 22, 2021Publication date: December 9, 2021Applicant: Sumitomo Riko Company LimitedInventors: Hiroyuki ICHIKAWA, Takashi KUME
-
Publication number: 20210094628Abstract: A vehicle-use resin module including a strength member made of synthetic resin and including a mounting hole, and an attachment member attached to the mounting hole and configured to be subjected to an external force. The attachment member includes an outer fitting having a tubular part arranged in the mounting hole in an inserted state. The outer fitting includes an outer circumferential projection projecting to a radially outer side of the tubular part. The strength member is an insertion-molded component having a structure in which the outer circumferential projection of the outer fitting is embedded so as to be inserted inside a circumferential wall of the mounting hole. A surface of the tubular part of the outer fitting and a surface of the outer circumferential projection are each directly fixed to the strength member with an adhesive.Type: ApplicationFiled: June 23, 2020Publication date: April 1, 2021Applicant: SUMITOMO RIKO COMPANY LIMITEDInventors: Hiroyuki ICHIKAWA, Takashi KUME, Munehiro WADA
-
Patent number: 10451133Abstract: A tubular vibration-damping device including: an outer tube member; an inner shaft member inserted in the outer tube member; a main rubber elastic body elastically connecting the inner shaft member and the outer tube member to each other; tapered tube parts provided on axially opposite sides of the outer tube member, each of the tapered tube parts being constricted in diameter to have a shape that gradually contracts toward an axial outside; and an extended tube part extending from the axial outside of at least one of the tapered tube parts of the outer tube member, the extended tube part including an expansion part that expands radially outward toward the axial outside.Type: GrantFiled: December 11, 2017Date of Patent: October 22, 2019Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takashi Kume, Kazuyuki Matsuoka
-
Patent number: 10037930Abstract: An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case component. In the power semiconductor module according to the present invention, a frame case includes a front surface, a back surface, and a pair of side surfaces and formed with an opening part in at least one of the front surface and the back surface. A metal base is inserted into the opening part of the frame case. A frame case is provided with a joining part FW to which the peripheral part of the metal base and the peripheral part of the opening part of the frame case are joined. A first concaved part and a second concaved part are formed respectively in each of a pair of side surfaces of the frame case.Type: GrantFiled: May 11, 2015Date of Patent: July 31, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takashi Kume, Takahiro Shimura, Akira Matsushita, Shinichi Fujino, Yusuke Takagi
-
Publication number: 20180172101Abstract: A tubular vibration-damping device including: an outer tube member; an inner shaft member inserted in the outer tube member; a main rubber elastic body elastically connecting the inner shaft member and the outer tube member to each other; tapered tube parts provided on axially opposite sides of the outer tube member, each of the tapered tube parts being constricted in diameter to have a shape that gradually contracts toward an axial outside; and an extended tube part extending from the axial outside of at least one of the tapered tube parts of the outer tube member, the extended tube part including an expansion part that expands radially outward toward the axial outside.Type: ApplicationFiled: December 11, 2017Publication date: June 21, 2018Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takashi KUME, Kazuyuki MATSUOKA
-
Patent number: 9806009Abstract: To suppress a temperature rise of a chip accompanying a production of large output by a power converter, and to reduce a size of the power converter. A power semiconductor device includes: a first power semiconductor element to configure an upper arm of an inverter circuit; a second power semiconductor element to configure a lower arm of the inverter circuit; a first lead frame to transmit power to the first power semiconductor element; a second lead frame to transmit power to the second power semiconductor element; a first gate lead frame to transmit a control signal to the first power semiconductor element; and a sealing member to seal the first power semiconductor element, the second power semiconductor element, the first lead frame, the second lead frame, and the first gate lead frame. In the power semiconductor device, a through-hole is formed in the sealing member, and a part of the first gate lead frame and a part of the second lead frame are exposed to an inner peripheral surface of the through-hole.Type: GrantFiled: November 28, 2014Date of Patent: October 31, 2017Assignee: Hitachi Automotive Systems, Ltd.Inventors: Shinichi Fujino, Takashi Kume
-
Patent number: 9752637Abstract: A manufacturing method of a vibration damping bushing wherein an outer cylindrical member arranged on an outer peripheral side of an inner axial member is provided with on its both axial sides a pair of first inclined cylindrical parts each having a diameter gradually reduced toward an axial outside and a pair of second inclined cylindrical parts each extending further toward the axial outside from an axial end of the corresponding first inclined cylindrical part with an inclination angle smaller than that of the first inclined cylindrical part. The outer cylindrical member is arranged on the outer peripheral side of the inner axial member to be connected thereto by a main rubber elastic body. Axial ends of the main rubber elastic body are deformed by increasing the inclination angle of the second inclined cylindrical parts of the outer cylindrical member through a drawing operation.Type: GrantFiled: May 14, 2015Date of Patent: September 5, 2017Assignee: SUMITOMO RIKO COMPANY LIMITEDInventors: Norimasa Kuki, Takashi Kume
-
Publication number: 20170162472Abstract: An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case component. In the power semiconductor module according to the present invention, a frame case includes a front surface, a back surface, and a pair of side surfaces and formed with an opening part in at least one of the front surface and the back surface. A metal base is inserted into the opening part of the frame case. A frame case is provided with a joining part FW to which the peripheral part of the metal base and the peripheral part of the opening part of the frame case are joined. A first concaved part and a second concaved part are formed respectively in each of a pair of side surfaces of the frame case.Type: ApplicationFiled: May 11, 2015Publication date: June 8, 2017Applicant: HItachi Automotive Systems, Ltd.Inventors: Takashi KUME, Takahiro SHIMURA, Akira MATSUSHITA, Shinichi FUJINO, Yusuke TAKAGI
-
Patent number: 9530722Abstract: The present invention relates to a power module obtained by connecting the opposite sides of a chip with solder, and prevents the side surfaces of a base portion from becoming wet with solder, which would otherwise cause connection failures of the solder or chip displacement, and also prevents peeling of molding resin, which would otherwise break the chip or shorten the life of the solder. The base portion is integrally formed with one of lead frames, and the side surfaces of the base portion and the surface of the main body of the lead frame are roughened so as to have reduced solder wettability. Meanwhile, the solder connection surface of the base portion is not roughened so as to ensure the solder wettability. Accordingly, it is possible to reduce failures that may occur during solder connection and obtain a highly reliable power module (FIG. 5).Type: GrantFiled: September 4, 2013Date of Patent: December 27, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Shiro Yamashita, Hideto Yoshinari, Takashi Kume, Shinichi Fujino, Eiichi Ide
-
Publication number: 20160322286Abstract: To suppress a temperature rise of a chip accompanying a production of large output by a power converter, and to reduce a size of the power converter. A power semiconductor device includes: a first power semiconductor element to configure an upper arm of an inverter circuit; a second power semiconductor element to configure a lower arm of the inverter circuit; a first lead frame to transmit power to the first power semiconductor element; a second lead frame to transmit power to the second power semiconductor element; a first gate lead frame to transmit a control signal to the first power semiconductor element; and a sealing member to seal the first power semiconductor element, the second power semiconductor element, the first lead frame, the second lead frame, and the first gate lead frame. In the power semiconductor device, a through-hole is formed in the sealing member, and a part of the first gate lead frame and a part of the second lead frame are exposed to an inner peripheral surface of the through-hole.Type: ApplicationFiled: November 28, 2014Publication date: November 3, 2016Inventors: Shinichi FUJINO, Takashi KUME
-
Publication number: 20150294927Abstract: The present invention relates to a power module obtained by connecting the opposite sides of a chip with solder, and prevents the side surfaces of a base portion from becoming wet with solder, which would otherwise cause connection failures of the solder or chip displacement, and also prevents peeling of molding resin, which would otherwise break the chip or shorten the life of the solder. The base portion is integrally formed with one of lead frames, and the side surfaces of the base portion and the surface of the main body of the lead frame are roughened so as to have reduced solder wettability. Meanwhile, the solder connection surface of the base portion is not roughened so as to ensure the solder wettability. Accordingly, it is possible to reduce failures that may occur during solder connection and obtain a highly reliable power module.Type: ApplicationFiled: September 4, 2013Publication date: October 15, 2015Inventors: Shiro Yamashita, Hideto Yoshinari, Takashi Kume, Shinichi Fujino, Eiichi Ide