Patents by Inventor Takashi KUMON

Takashi KUMON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10589077
    Abstract: A microneedle device system includes a microneedle device having a sheet-like microneedle having a sheet in which one surface is a skin contact surface and the other surface is a rear surface, and in which a plurality of microneedles are formed substantially along a surface of the sheet, and in which the microneedles in the skin piercing region are raised from the skin contact surface so as to be capable of piercing skin if the sheet is bent in a thickness direction, an adhesive layer that is disposed on the sheet-like microneedle, and a liner that is attached to the adhesive layer so as to be releasable therefrom, and an auxiliary tool having a bending portion which bends the microneedle device in the thickness direction, and on which the microneedle device is mounted so as to be movable along the bending portion.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: March 17, 2020
    Assignee: HISAMITSU PHARMACEUTICAL CO., INC.
    Inventors: Makoto Ogura, Naoki Yamamoto, Takashi Kumon
  • Publication number: 20170333690
    Abstract: A microneedle device system includes a microneedle device having a sheet-like microneedle having a sheet in which one surface is a skin contact surface and the other surface is a rear surface, and in which a plurality of microneedles are formed substantially along a surface of the sheet, and in which the microneedles in the skin piercing region are raised from the skin contact surface so as to be capable of piercing skin if the sheet is bent in a thickness direction, an adhesive layer that is disposed on the sheet-like microneedle, and a liner that is attached to the adhesive layer so as to be releasable therefrom, and an auxiliary tool having a bending portion which bends the microneedle device in the thickness direction, and on which the microneedle device is mounted so as to be movable along the bending portion.
    Type: Application
    Filed: December 4, 2015
    Publication date: November 23, 2017
    Applicant: HISAMITSU PHARMACEUTICAL CO., INC.
    Inventors: Makoto OGURA, Naoki YAMAMOTO, Takashi KUMON