Abstract: There is provided a method of manufacturing a metal sheet having an alloy plated layer, the method including a step of passing a metal strip continuously through a plating bath to perform electroplating in the plating bath, the plating bath including a plating liquid and an anode, the plating liquid containing two or more kinds of metal ions for forming the alloy plated layer, wherein an anode obtained by mixing two or more kinds of metal pellets is used as the anode, the metal pellets being formed of respective metals that form the alloy plated layer, wherein a mixing ratio of each metal pellet that constitutes the anode is determined based on a total surface area ratio of each metal pellet in the anode so that a dissolution ratio of each metal pellet that constitutes the anode is a dissolution ratio corresponding to a weight ratio of each metal that constitutes the alloy plated layer.

Abstract: A semiconductor light-emitting element includes a first layer having a first conductivity. A second layer having a second conductivity is provided between the first layer and a substrate. A third layer is between the first and second layers. A first electrode is between the substrate and the first layer and is connected to the first layer. An insulating layer is between the first electrode and the substrate and between the first electrode and the second layer. A metal film is between the insulating layer and the substrate and covers the insulating layer and the second layer. The first electrode is in a concave portion extending between the second layer and the first layer. The insulating layer has a surface having a region in which a distance between the insulating layer and the substrate is decreased in a direction from the second layer to the first electrode.

Abstract: There is provided a method of manufacturing a metal sheet having an alloy plated layer, the method including a step of passing a metal strip continuously through a plating bath to perform electroplating in the plating bath, the plating bath including a plating liquid and an anode, the plating liquid containing two or more kinds of metal ions for forming the alloy plated layer, wherein an anode obtained by mixing two or more kinds of metal pellets is used as the anode, the metal pellets being formed of respective metals that form the alloy plated layer, wherein a mixing ratio of each metal pellet that constitutes the anode is determined based on a total surface area ratio of each metal pellet in the anode so that a dissolution ratio of each metal pellet that constitutes the anode is a dissolution ratio corresponding to a weight ratio of each metal that constitutes the alloy plated layer.

Abstract: A toy device that enables a transformable toy to be played individually and in combination with another transformable toy. The toy device includes a transformable toy with a form which can be reversibly changed by turning a plurality of pivotable members, and a base unit on which the transformable toy is mountable. The transformable toy includes a pivoting mechanism for turning the plurality of pivotable members and an actuator for actuating the pivoting mechanism. The base unit includes an actuating part to which the actuator is coupled and an operating part for externally operating the actuating part. When the operating part is operated, the actuator operates via the actuating part, and the pivoting mechanism is actuated to turn the plurality of pivotable members, thereby changing the form of the transformable toy.

Abstract: A method for testing a semiconductor device, is disclosed, which comprises detecting a defect in a semiconductor wafer having a plurality of chips on each of which a plurality of semiconductor elements are formed, to detect those of the chips which have a defect, and carrying out a fist electrical characteristics test to a first chip without defect, and a second electrical characteristics test which is more detailed than the first electrical characteristics test to a second chip having the defect.

Abstract: A method for testing a semiconductor device, is disclosed, which comprises detecting a defect in a semiconductor wafer having a plurality of chips on each of which a plurality of semiconductor elements are formed, to detect those of the chips which have a defect, and carrying out a fist electrical characteristics test to a first chip without defect, and a second electrical characteristics test which is more detailed than the first electrical characteristics test to a second chip having the defect.

Abstract: A reconfigurable toy assembly which is capable of transforming into six different forms, such as a robotic humanfold form, a gun form, a jet plane form, an automobile form, an armored car form and a puma form, by changing positions of movable toy components is disclosed. The toy assembly having a base member constituting a trunk portion of the robotic humanoid form, a robotic head member, a pair of arm members, a pair of leg members, a pair of front wing members, a pair of rear wing members, a pair of hand members and at least one head member of another form such as the puma form. When configured into one particular form, the toy assembly is capable of containing the components used for the other forms within the movable components used for the particular form.