Abstract: An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.

Abstract: An object of the invention is to provide an electrical contact of a low surge type which is easily manufactured, has a small environmental influence, and has a small chopping current value, a manufacturing method of the same, a vacuum interrupter using the same, and a vacuum circuit-breaker using the same. The invention provides an electrical contact having a high conductive metal, and a refractory element constituted by a metal nitrogen or a metal oxide. The high conductive metal can employ Ag or Cu or alloys mainly containing either Ag or Cu, the metal nitride can employ one or mixture of two or more of Mg3N2, AlN, TiN, ZrN, CrN, Cr2N, NbN, BN and Si3N4, and the metal oxide can employ one or mixture of two or more of MgO, Al2O3, TiO2, Ti2O3, ZrO2, ThO2, Cr2O3, Nb2O5, Y2O3 and ZnO. Accordingly, it is possible to secure an improved resistance welding performance.

Abstract: An upper shearing blade 3 equipped with a protrusion 30 of a triangle-columnar shape and a lower shearing blade 4 equipped with a protrusion 40 of the same shape are applied onto the overlapped portion of metal plates 1 and 2 to be bonded, and then pressed into the metal plates 1 and 2 in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates 1 and 2 are not completely cut off. The operating loci of the upper shearing blade 3 and the lower shearing blade 4 are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates 1 and 2 are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.

Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.

Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.

Abstract: A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

Abstract: A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

Abstract: A feeding tooth of a one-tooth sprocket retracts from a film so that the film can be prevented from being damaged by the feeding tooth of the one-tooth sprocket when the film is rewound. When a motor rotates in a film winding direction, a rewinding fork becomes free and a spool and the one-tooth sprocket rotates in a winding direction. As a result, the feeding tooth of the one-tooth sprocket engages with a perforation of the film to feed the end of the film up to the spool. On the other hand, when the motor rotates in the film rewinding direction, the one-tooth sprocket becomes free and the spool and the rewinding fork rotate in the rewinding direction. As a result, the film is wound around a rotation axis of a patrone. In this case, the feeding tooth of the one-tooth sprocket retracts from the film.

Abstract: A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

Abstract: A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

Abstract: The present invention provides a camera enabling effective use of parts retrieved from a used lens-mounted film. Members retrieved from a lens-mounted film and responsible for film feed and release operation; such as, a sprocket, a sprocket axis with a charge cam attached, a drive lever, and a locking lever are mounted in a camera as they are. A release mechanism is included to release a frame stop state set for frame-by-frame film feed and a state in which the turn of a film wind knob is disabled, whereby film rewind is enabled. A strobe circuit board containing a strobe flashing unit and a control circuit is recycled for a camera permitting film rewind. In this case, a flashing capacitor mounted on the retrieved strobe circuit board is angled at lead wires so that the flashing capacitor can be placed in any state different from the one in a lens-mounted film.

Abstract: A film loading apparatus for enabling a smooth initial film feeding operation by preventing a planet gear from being sent flying to a rewinding gear. The rewinding gear is connected to a fork gear which engages a take-up shaft of a patrone, and the feeding gear is connected to a one-tooth sprocket having a pawl tooth which engages a perforation of a film at the time of initial film feeding. A sun gear and the planet gear are connected to the pinion of the motor for taking up a film, and the planet gear moves between the position at which the planet gear meshes with the feeding gear and the position at which the planet gear meshes with the rewinding gear.

Abstract: A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.