Abstract: A skin cleansing composition, comprising (A) an alkyl ether carboxylic acid or a salt thereof represented by formula (1): wherein, R1 represents an alkyl group having 8 to 18 carbon atoms, n represents a number of from 0 to 20, and M represents a hydrogen atom, alkali metal, alkaline earth metal, ammonium, or organic ammonium, wherein, R1 has an average carbon number of from 10.8 to 12.8 and the average value of n is from 2.5 to 3.4, and wherein, the alkyl ether carboxylic acid or a salt thereof contains a component in which n=0 in an amount of from 9.

Abstract: A cleansing composition containing the following components (A) and (B): (A) an ether carboxylate of Formula (1) R1—O—(CH2CH2O)n—CH2—COOX (1) wherein —R1 represents a linear or branched C4-C10 alkyl or alkenyl group, —n represents a number from 0.5 to 20, and —X represents a hydrogen atom or a cation selected from the group consisting of an alkali metal, an alkaline earth metal, ammonium, an alkylammonium, an alkanolammonium, and a glucammonium; and (B) an ether carboxylate of Formula (2) R2—O—(CH2CH2O)m-CH2—COOY (2) wherein —R2 represents a linear or branched C12-C22 alkyl or alkenyl group, —m represents a number from 0.5 to 20, and —Y represents a hydrogen atom or a cation, selected from the group consisting of an alkali metal, an alkaline earth metal, ammonium, an alkylammonium, an alkanolammonium, and a glucammonium.

Abstract: A skin cleansing composition, comprising (A) an alkyl ether carboxylic acid or a salt thereof represented by formula (1): wherein, R1 represents an alkyl group having 4 to 22 carbon atoms, n represents a number of from 0 to 20, and M represents a hydrogen atom, alkali metal, alkaline earth metal, ammonium, or organic ammonium, wherein, R1 has an average carbon number of from 10.8 to 12.8, and wherein, the alkyl ether carboxylic acid or a salt thereof contains a component in which n=0 in an amount of more than 9.

Abstract: A skin cleansing composition, comprising (A) an alkyl ether carboxylic acid or a salt thereof represented by formula (1): wherein, R1 represents an alkyl group having 8 to 18 carbon atoms, n represents a number of from 0 to 20, and M represents a hydrogen atom, alkali metal, alkaline earth metal, ammonium, or organic ammonium, wherein, R1 has an average carbon number of from 10.8 to 12.8 and the average value of n is from 2.5 to 3.4, and wherein, the alkyl ether carboxylic acid or a salt thereof contains a component in which n=0 in an amount of from 9.

Abstract: A cleansing composition containing the following components (A) and (B): (A) an ether carboxylate of Formula (1) R1—O—(CH2CH2O)n—CH2—COOX (1) wherein R1 represents a linear or branched C4-C10 alkyl or alkenyl group, n represents a number from 0.5 to 20, and X represents a hydrogen atom or a cation selected from the group consisting of an alkali metal, an alkaline earth metal, ammonium, an alkylammonium, an alkanolammonium, and a glucammonium; and (B) an ether carboxylate of Formula (2) R2—O—(CH2CH2O)m-CH2—COOY (2) wherein R2 represents a linear or branched C12-C22 alkyl or alkenyl group, m represents a number from 0.5 to 20, and Y represents a hydrogen atom or a cation, selected from the group consisting of an alkali metal, an alkaline earth metal, ammonium, an alkylammonium, an alkanolammonium, and a glucammonium.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: A rolling bearing has a metallic member sealing member at one axial end thereof. The sealing member has a first cylinder section including a first cylinder section facing surface which is in contact with an outer peripheral surface of an inner ring, a second cylinder section connected to the first cylinder section and including a second cylinder section facing surface which faces the outer peripheral surface of the inner ring, and a flange section connected to the second cylinder section via a bend section. In a state before the sealing member is press fitted in the bearing, a radial position of the second cylinder section facing surface is closer to the flange section than a radial position of the first cylinder section facing surface. The rolling bearing has another metallic member sealing member at another axial end thereof.

Abstract: A rolling bearing has a metallic member sealing member at one axial end thereof. The sealing member has a first cylinder section including a first cylinder section facing surface which is in contact with an outer peripheral surface of an inner ring, a second cylinder section connected to the first cylinder section and including a second cylinder section facing surface which faces the outer peripheral surface of the inner ring, and a flange section connected to the second cylinder section via a bend section. In a state before the sealing member is press fitted in the bearing, a radial position of the second cylinder section facing surface is closer to the flange section than a radial position of the first cylinder section facing surface. The rolling bearing has another metallic member sealing member at another axial end thereof.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: In the order receiving system of the invention, a read/record controller reads image data from a memory card, produces uniquely recognizable ID information and stores the image data in a memory in association with the ID information. An order form issue section issues the user with an order form including the ID information, a thumbnail of the image data associated with the ID information and a blank field for entry of order information on the image data corresponding to the thumbnail. A scanner reads the ID information and order information from the order form filled with the order information by the user. A readout controller stores the order information in the memory in association with the image data corresponding to the ID information.

Abstract: A polyurethane composition containing solid beads dispersed therein, is formed of a microcellular polyurethane foam, and the composition has a storage modulus of elasticity at 40° C. of 270 MPa or more as measured by means of a dynamic elasticity measuring device. Another polyurethane composition of this invention contains solid beads dispersed therein, that are capable of swelling with or are soluble in an aqueous medium. The former composition has excellent flattening capability, and the latter composition can provide a polished surface which combines good flatness and good uniformity and can also reduce scratches on the surface.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprising an isocyanate compound and a second ingredient comprising a compound containing an active hydrogen group, characterized by comprising adding a nonionic silicone surfactant containing no hydroxyl group to at least one of the first ingredient and the second ingredient in an amount of 0.1 to 5 wt %, excluding 5 wt %, based on the total amount of the first ingredient and the second ingredient, subsequently agitating the surfactant containing ingredient together with an unreactive gas, which has no reactivity to isocyanate group or active hydrogen group, to disperse the unreactive gas as fine bubbles to prepare a bubble dispersion and then mixing the bubble dispersion with the remaining ingredient to cure the resultant mixture and forming finely cellular structure into the resultant polyurethane foam by the fine bubbles of the bubble dispersion.

Abstract: In a self-aligning bearing positioning and supporting one end of a rotation shaft in an axial direction and allowing the rotation shaft to bend, the bearing is structured as a double row cylindrical roller bearing with aligning ring, a first row of cylindrical roller group is positioned by being held in an axial direction between a radially inward flange provided in an intermediate portion in an axial direction of an outer ring having an outer peripheral surface formed in a spherical surface shape, and a flange provided in one outer end of two inner rings, and a second row of cylindrical roller group is positioned by being held in the axial direction between the flange of the outer ring and a flange provided in another outer ends of the two inner rings.

Abstract: A roll apparatus provided at a continuous caster for transferring a cast piece to a predetermined location includes: at least three divided rolls arranged to align concentrically and in an axial direction thereof to constitute a roll forming a cast piece transfer path. At least one end portion of at least of the divided rolls is supported by a cylindrical roller bearing of a full roller type.

Abstract: In the order receiving system of the invention, a read/record controller reads image data from a memory card, produces uniquely recognizable ID information and stores the image data in a memory in association with the ID information. An order form issue section issues the user with an order form including the ID information, a thumbnail of the image data associated with the ID information and a blank field for entry of order information on the image data corresponding to the thumbnail. A scanner reads the ID information and order information from the order form filled with the order information by the user. A readout controller stores the order information in the memory in association with the image data corresponding to the ID information.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: A process for producing a finely cellular polyurethane foam by mixing a first ingredient comprising an isocyanate compound and a second ingredient comprising a compound containing an active hydrogen group, characterized by comprising adding a nonionic silicone surfactant containing no hydroxyl group to at least one of the first ingredient and the second ingredient in an amount of 0.1 to 5 wt %, excluding 5 wt %, based on the total amount of the first ingredient and the second ingredient, subsequently agitating the surfactant containing ingredient together with an unreactive gas, which has no reactivity to isocyanate group or active hydrogen group, to disperse the unreactive gas as fine bubbles to prepare a bubble dispersion and then mixing the bubble dispersion with the remaining ingredient to cure the resultant mixture and forming finely cellular structure into the resultant polyurethane foam by the fine bubbles of the bubble dispersion.

Abstract: In a self-aligning bearing positioning and supporting one end of a rotation shaft in an axial direction and allowing the rotation shaft to bend, the bearing is structured as a double row cylindrical roller bearing with aligning ring, a first row of cylindrical roller group is positioned by being held in an axial direction between a radially inward flange provided in an intermediate portion in an axial direction of an outer ring having an outer peripheral surface formed in a spherical surface shape, and a flange provided in one outer end of two inner rings, and a second row of cylindrical roller group is positioned by being held in the axial direction between the flange of the outer ring and a flange provided in another outer ends of the two inner rings.