Patents by Inventor Takashi Mitani

Takashi Mitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230366472
    Abstract: A diaphragm valve 100 includes a valve body 10, a diaphragm 20, a bonnet 40, and a compressor 60. The diaphragm 20 includes a first portion 21 and a second portion 22 surrounding the first portion 21, the first portion 21 having a first thickness T1 and a curved plate shape, the second portion 22 having a second thickness T2 smaller than the first thickness T1 to form a step and having a flat plate shape. The second portion 22 includes a sealing band SB surrounding the first portion 21. The bonnet 40 has an inner step 43 that contains a part of the first portion 21 and the inner step 43 has a depth G in the Z direction larger than a difference T1-T2 between the first and second thicknesses.
    Type: Application
    Filed: January 10, 2023
    Publication date: November 16, 2023
    Inventors: Katsuaki Iimura, Takashi Mitani
  • Publication number: 20190333998
    Abstract: A high quality silicon carbide epitaxial wafer using a p-type silicon carbide single crystal substrate of low resistivity. The silicon carbide epitaxial wafer includes a p-type 4H—SiC single crystal substrate that has a first main surface having an off angle with respect to (0001) plane, and has a resistivity of less than 0.4 ?cm, and a silicon carbide epitaxial layer that is disposed on the first main surface of the p-type 4H—SiC single crystal substrate, in which an off direction of the off angle is the <01-10> direction.
    Type: Application
    Filed: December 19, 2018
    Publication date: October 31, 2019
    Inventors: Keiko MASUMOTO, Takashi MITANI, Kazuma ETO, Kazutoshi KOJIMA, Tomohisa KATO
  • Patent number: 8407886
    Abstract: A lead wire implanting apparatus is provided that can fabricate high-quality brushes that are without variations in implanting height and implanting strength and free from cracks and that can make the reproducibility of set values better and improve the workability in setup changing. The lead wire implanting apparatus has a tamping member and a storing cup for storing conductive metal powder, for implanting and fixing a lead wire to a brush main body by performing a tamping action of the tamping member a predetermined number of times. The apparatus has a linear-type servo motor serving as a drive source for driving the tamping member in vertical directions, a first position detector for detecting a shift position of the tamping member, and a controller device for controlling the linear-type servo motor based on detected information by the first position detector to cause the tamping member to perform a predetermined tamping action.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: April 2, 2013
    Assignee: Totankako Co., Ltd.
    Inventors: Takashi Mitani, Masatoyo Okazaki
  • Publication number: 20110035931
    Abstract: A lead wire implanting apparatus is provided that can fabricate high-quality brushes that are without variations in implanting height and implanting strength and free from cracks and, moreover, that can make the reproducibility of set values better and improve the workability in setup changing. The lead wire implanting apparatus has a tamping member (6) and a storing cup (14) for storing conductive metal powder, for implanting and fixing a lead wire (4) to a brush main body (8) by performing a tamping action of the tamping member (6) a predetermined number of times.
    Type: Application
    Filed: April 16, 2008
    Publication date: February 17, 2011
    Applicant: TOTANKAKO CO., LTD.
    Inventors: Takashi Mitani, Masatoyo Okazaki