Patents by Inventor Takashi Mizobuchi

Takashi Mizobuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240099470
    Abstract: An easy-assembly bed includes a top plate, and a leg portion having a plurality of leg members that are linked using notched joints. The top plate is constituted of a bonded material, which includes a plate-shaped foam plate formed with a foam body, and a front board member and a rear board member having an identical shape to the foam plate and that are bonded to the rear surface and the front surface of the foam plate, respectively, and a top plate molded resin portion overing the cut ends of the bonded material with a molded resin; and the leg members are each constituted of a grooved bonded material, which includes a plate-shaped grooved foam plate having locking grooves and formed with a foam body, and a grooved front board member and a grooved rear board member on the front surface and the rear surface of the grooved foam plate.
    Type: Application
    Filed: December 20, 2021
    Publication date: March 28, 2024
    Applicants: TOPPAN INC., KINKI UNIVERSITY
    Inventors: Hajime MONZEN, Mikoto TAMURA, Masaru HAYAKAWA, Manabu TSUJINO, Takashi MIZOBUCHI, Nobuo HAMA, Yuichirou FUJIKAWA
  • Patent number: 10825971
    Abstract: A light-emitting device includes a light-emitting element mounted on a base substrate, a reflective member that is formed on the base substrate and surrounds the light-emitting element, a transparent member that has a flat upper surface and is placed to cover above the light-emitting element, and a DBR film placed on the upper surface of the transparent member. A relation between an incident angle of light emitted from the light-emitting element and input into the DBR film and a transmittance of the light to pass through the DBR film is obtained such that a peak of the transmittance is in a range of the incident angle greater than 0°.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: November 3, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Masaki Oya, Takashi Mizobuchi
  • Publication number: 20190165227
    Abstract: A light-emitting device includes a light-emitting element mounted on a base substrate, a reflective member that is formed on the base substrate and surrounds the light-emitting element, a transparent member that has a flat upper surface and is placed to cover above the light-emitting element, and a DBR film placed on the upper surface of the transparent member. A relation between an incident angle of light emitted from the light-emitting element and input into the DBR film and a transmittance of the light to pass through the DBR film is obtained such that a peak of the transmittance is in a range of the incident angle greater than 0°.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 30, 2019
    Inventors: Masaki OYA, Takashi MIZOBUCHI
  • Publication number: 20180287016
    Abstract: The light-emitting device includes a dielectric multilayer film on a second surface having a rectangular shape, and DBR at an opposite surface. The length of a specific side of the rectangular shape is 50 ?m to 250 ?m. A middle point of a side perpendicular to the specific side on the rectangular shape is defined as Q1, a line connecting the center point and the middle point Q1 is defined as M1, an angle formed between the line M1 and the center plane is defined as ?. A middle point of the specific side on the rectangular shape is defined as Q3, a line connecting the center point and the middle point Q3 is defined as M2, and an angle formed between the line M2 and the center plane is defined as ?. ? and ? satisfy the following equations. 0.6?tan(?)?1.0 0.6?tan(?)?1.
    Type: Application
    Filed: February 28, 2018
    Publication date: October 4, 2018
    Inventors: Takashi MIZOBUCHI, Yohei SAMURA
  • Patent number: 8552447
    Abstract: A semiconductor light-emitting element includes a semiconductor laminated structure including a light-emitting layer sandwiched between first and second conductivity type layers for extracting an emitted light from the light-emitting layer on a side of the second conductivity type layer, a transparent electrode in ohmic contact with the second conductivity type layer, an insulation layer formed on the transparent electrode, an upper electrode for wire bonding formed on the insulation layer, a lower electrode that penetrates the insulation layer, is in ohmic contact with the transparent electrode and the electrode for wire bonding, and has an area smaller than that of the upper electrode in top view, and a reflective portion for reflecting at least a portion of light transmitted through a region of the transparent electrode not in contact with the lower electrode.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: October 8, 2013
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Kosuke Yahata, Takashi Mizobuchi, Takahiro Mori, Masashi Deguchi, Shingo Totani
  • Publication number: 20110198641
    Abstract: A semiconductor light-emitting element includes a semiconductor laminated structure including a light-emitting layer sandwiched between first and second conductivity type layers for extracting an emitted light from the light-emitting layer on a side of the second conductivity type layer, a transparent electrode in ohmic contact with the second conductivity type layer, an insulation layer formed on the transparent electrode, an upper electrode for wire bonding formed on the insulation layer, a lower electrode that penetrates the insulation layer, is in ohmic contact with the transparent electrode and the electrode for wire bonding, and has an area smaller than that of the upper electrode in top view, and a reflective portion for reflecting at least a portion of light transmitted through a region of the transparent electrode not in contact with the lower electrode.
    Type: Application
    Filed: February 16, 2011
    Publication date: August 18, 2011
    Applicant: Toyoda Gosei Co., Ltd.
    Inventors: Kosuke Yahata, Takashi Mizobuchi, Takahiro Mori, Masashi Deguchi, Shingo Totani