Patents by Inventor Takashi Moriyama

Takashi Moriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11306953
    Abstract: A compressor includes a container provided with an oil reservoir which is provided at a bottom portion of the container to allow oil to be collected in the oil reservoir. In the container, an electric motor mechanism, a rotary shaft, a compression mechanism, and a frame which fixes the compression mechanism to the container are provided. In the frame, a suction port is formed to cause refrigerant having flowed into the space to flow into the compression mechanism, and each of a suction portion and a connection port of the suction pipe, is located at a position which is higher than or the same as the level of the rotary shaft as seen in a rotation axial direction A rib in a first flow passage extends downwards in the direction of gravity from the connection port, extends through an area located above the oil reservoir, and reaches the suction port.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: April 19, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takashi Moriyama, Hiroki Murakami, Hiroshi Yamamoto, Wahei Shingu
  • Patent number: 11009378
    Abstract: Provided is a flow rate measuring device including a connector portion, a main body portion, an internal flow passage, and a flow rate detection element. The internal flow passage includes a main flow passage and a sub-flow passage. The sub-flow passage includes a flow rate detection element-side flow passage and connection flow passages. The main flow passage includes an introduction portion, a small flow passage sectional area portion, and an exit portion. The connection flow passages include an upstream-side connection flow passage and a downstream-side connection flow passage. The main flow passage and the flow rate detection element-side flow passage are formed so as to be symmetric with respect to a plane having a flow direction of the fluid to be measured flowing through the pipe as a normal. The main flow passage has a portion at the plane of symmetry as the small flow passage sectional area portion.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: May 18, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Kise, Takashi Moriyama
  • Patent number: 10634389
    Abstract: A refrigeration cycle apparatus includes: a refrigerant circuit including a compressor, a condenser, an expansion device, and an evaporator; an oil separator provided at a refrigerant discharge side of the compressor and configured to separate refrigerant and a refrigerating machine oil; a first oil return path connecting the oil separator to a refrigerant suction side of the compressor; a flow control device provided on the first oil return path and configured to reduce pressure of the refrigerant and the refrigerating machine oil; an oil reservoir provided to branch from the first oil return path between the flow control device and the refrigerant suction side of the compressor and configured to store the refrigerating machine oil; a second oil return path on which the oil reservoir is provided and through which the oil accumulated in the oil reservoir flows when being returned to the compressor.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: April 28, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takashi Moriyama, Hiroki Murakami
  • Publication number: 20200043877
    Abstract: A semiconductor device includes semiconductor substrate having outer peripheral sides in plan view, and at least a pair of first bonding pad and second bonding pad formed over the semiconductor substrate. The second bonding pad has a shape obtained by rotating the first bonding pad by 180 degrees in plan view. The first bonding pad and the second bonding pad are arranged so as to face each other in a first direction crossing the outer peripheral side. The first bonding pad has a first portion and a second portion of rectangular shape in the second direction along the outer peripheral side. A width of the first portion in the first direction is greater than a width of the second portion in the first direction.
    Type: Application
    Filed: July 2, 2019
    Publication date: February 6, 2020
    Inventors: Kentaro SAITO, Takashi MORIYAMA, Yoshinori DEGUCHI
  • Publication number: 20200003595
    Abstract: Provided is a flow rate measuring device including a connector portion, a main body portion, an internal flow passage, and a flow rate detection element. The internal flow passage includes a main flow passage and a sub-flow passage. The sub-flow passage includes a flow rate detection element-side flow passage and connection flow passages. The main flow passage includes an introduction portion, a small flow passage sectional area portion, and an exit portion. The connection flow passages include an upstream-side connection flow passage and a downstream-side connection flow passage. The main flow passage and the flow rate detection element-side flow passage are formed so as to be symmetric with respect to a plane having a flow direction of the fluid to be measured flowing through the pipe as a normal. The main flow passage has a portion at the plane of symmetry as the small flow passage sectional area portion.
    Type: Application
    Filed: December 21, 2017
    Publication date: January 2, 2020
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji KISE, Takashi MORIYAMA
  • Patent number: 10504861
    Abstract: A semiconductor device and a method for manufacturing the semiconductor device which ensure improved reliability, permit further miniaturization, and suppress the increase in manufacturing cost. The semiconductor device includes: a pad electrode formed in the uppermost wiring layer of a multilayer wiring layer formed over a semiconductor substrate; a surface protective film formed in a manner to cover the pad electrode; an opening made in the surface protective film in a manner to expose the pad electrode partially; and a conductive layer formed over the pad electrode exposed at the bottom of the opening. The thickness of the conductive layer formed over the pad electrode is smaller than the thickness of the surface protective film formed over the pad electrode.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 10, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Takashi Moriyama, Takashi Tonegawa
  • Publication number: 20190346190
    Abstract: A compressor includes a container provided with an oil reservoir which is provided at a bottom portion of the container to allow oil to be collected in the oil reservoir. The container is provided such that a rotary shaft is inclined relative to the direction of gravity or to be laid horizontal. In the container, an electric motor mechanism, the rotary shaft, a compression mechanism and a frame which fixes the compression mechanism to the container are provided. To the container, a suction pipe is connected to cause refrigerant to flow into space between the frame and the electric motor mechanism. In the frame, a suction port is formed to cause the refrigerant having flowed into the space to flow into the compression mechanism, and each of the suction portion and a connection port of the suction pipe, which connects with the container is located at a position which is higher than or the same as the level of the rotary shaft as seen in a rotation axial direction.
    Type: Application
    Filed: May 19, 2017
    Publication date: November 14, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takashi MORIYAMA, Hiroki MURAKAMI, Hiroshi YAMAMOTO, Wahei SHINGU
  • Publication number: 20190301765
    Abstract: An air-conditioning apparatus includes: a plurality of compressors included in one or more refrigerant circuits which air-condition a target space to be air-conditioned; a power converter which converts electric power supplied from a power source unit and supply the compressors with electric power for driving the compressors at an arbitrary drive rotation speed; a switching device which perform switching between a power supplying operation to cause each of the compressors to be supplied with electric power from the power converter and a power supplying operation to cause each of the compressors to be supplied with electric power directly from the power source unit; and a controller which controls the power converter and the switching device.
    Type: Application
    Filed: May 1, 2017
    Publication date: October 3, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Ryosuke KOBAYASHI, Takashi MORIYAMA, Hiroyasu IWABUKI, Hiroki MURAKAMI, Hisanori YAMASAKI
  • Patent number: 10217780
    Abstract: A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: February 26, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Moriyama, Masaaki Minowa, Takeshi Ichikawa, Masahiro Ogawa
  • Patent number: 10181450
    Abstract: A pad formed in a semiconductor chip is formed such that a thickness of an aluminum film in a wire bonding portion is smaller than that of an aluminum film in a peripheral portion covered with a protective film. On the other hand, a thickness of a wiring formed in the same step as the pad is larger than that of the pad in the wire bonding portion. The main conductive film of the pad in the wire bonding portion is comprised of only one layer of a first aluminum film, while the main conductive film of the wiring is comprised of at least two layers of aluminum films (the first aluminum film and a second aluminum film) in any region of the wiring.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: January 15, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Seiya Isozaki, Takashi Moriyama, Takehiko Maeda
  • Publication number: 20190006300
    Abstract: A semiconductor device and a method for manufacturing the semiconductor device which ensure improved reliability, permit further miniaturization, and suppress the increase in manufacturing cost. The semiconductor device includes: a pad electrode formed in the uppermost wiring layer of a multilayer wiring layer formed over a semiconductor substrate; a surface protective film formed in a manner to cover the pad electrode; an opening made in the surface protective film in a manner to expose the pad electrode partially; and a conductive layer formed over the pad electrode exposed at the bottom of the opening. The thickness of the conductive layer formed over the pad electrode is smaller than the thickness of the surface protective film formed over the pad electrode.
    Type: Application
    Filed: May 24, 2018
    Publication date: January 3, 2019
    Applicant: Renesas Electronics Corporation
    Inventors: Takashi MORIYAMA, Takashi TONEGAWA
  • Publication number: 20180328626
    Abstract: A refrigeration cycle apparatus includes: a refrigerant circuit including a compressor, a condenser, an expansion device, and an evaporator; an oil separator provided at a refrigerant discharge side of the compressor and configured to separate refrigerant and a refrigerating machine oil; a first oil return path connecting the oil separator to a refrigerant suction side of the compressor; a flow control device provided on the first oil return path and configured to reduce pressure of the refrigerant and the refrigerating machine oil; an oil reservoir provided to branch from the first oil return path between the flow control device and the refrigerant suction side of the compressor and configured to store the refrigerating machine oil; a second oil return path on which the oil reservoir is provided and through which the oil accumulated in the oil reservoir flows when being returned to the compressor.
    Type: Application
    Filed: June 28, 2016
    Publication date: November 15, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takashi MORIYAMA, Hiroki MURAKAMI
  • Patent number: 10084980
    Abstract: A solid-state image sensor includes an image sensing unit in which a plurality of pixels are arrayed, a plurality of readout units configured to read out signals from the image sensing unit, a detector configured to detect an occurrence of a latch-up in each of the plurality of readout units, and a controller configured to control power supply to the plurality of readout units. The plurality of readout units are configured to read out signals from a same pixel in the image sensing unit. The controller is configured to shut off power supply to at least part of a readout unit in which the occurrence of the latch-up has been detected out of the plurality of readout units and thereafter supply power to the at least part.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: September 25, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Moriyama, Kazuaki Tashiro, Tatsuhito Goden, Toshiaki Ono
  • Publication number: 20180261637
    Abstract: A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 13, 2018
    Inventors: Takashi Moriyama, Masaaki Minowa, Takeshi Ichikawa, Masahiro Ogawa
  • Patent number: 9947702
    Abstract: A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: April 17, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Moriyama, Masaaki Minowa, Takeshi Ichikawa, Masahiro Ogawa
  • Publication number: 20170317121
    Abstract: A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
    Type: Application
    Filed: June 29, 2017
    Publication date: November 2, 2017
    Inventors: Takashi Moriyama, Masaaki Minowa, Takeshi Ichikawa, Masahiro Ogawa
  • Publication number: 20170287868
    Abstract: A pad formed in a semiconductor chip is formed such that a thickness of an aluminum film in a wire bonding portion is smaller than that of an aluminum film in a peripheral portion covered with a protective film. On the other hand, a thickness of a wiring formed in the same step as the pad is larger than that of the pad in the wire bonding portion. The main conductive film of the pad in the wire bonding portion is comprised of only one layer of a first aluminum film, while the main conductive film of the wiring is comprised of at least two layers of aluminum films (the first aluminum film and a second aluminum film) in any region of the wiring.
    Type: Application
    Filed: February 1, 2017
    Publication date: October 5, 2017
    Inventors: Seiya ISOZAKI, Takashi MORIYAMA, Takehiko MAEDA
  • Patent number: 9774810
    Abstract: An image sensor includes a readout unit having a plurality of circuit blocks. At least a part of each of the plurality of circuit blocks is arranged in each of a plurality of regions electrically isolated from each other. When latchup has occurred in a circuit block of the plurality of circuit blocks, the voltage supply unit shuts off supply of a power supply voltage to the region in which the part is arranged, and then performs the supply of the power supply voltage to the region in which the part is arranged, and the voltage supply unit supplies the power supply voltage to the region in which the circuit block without latchup is arranged, while shutting off the supply of the power supply voltage to the region in which the part is arranged.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: September 26, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuaki Tashiro, Takashi Moriyama, Tatsuhito Goden, Toshiaki Ono
  • Patent number: 9761618
    Abstract: A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: September 12, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Moriyama, Masaaki Minowa, Takeshi Ichikawa, Masahiro Ogawa
  • Patent number: 9723232
    Abstract: A solid-state image sensor is provided. The solid-state image sensor includes a substrate. The substrate includes an electrode layer, an insulating layer arranged on the electrode layer, and a semiconductor layer arranged on the insulating layer. The semiconductor layer includes a first semiconductor region of a first conductivity type, a second semiconductor region configured to accumulate charges generated by photoelectric conversion, the second semiconductor region being arranged on the first semiconductor region and having a second conductivity type opposite to the first conductivity type, and a third semiconductor region of the second conductivity type to which the charges accumulated in the second semiconductor region are transferred.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: August 1, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Moriyama, Kiyofumi Sakaguchi