Abstract: A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.

Abstract: The present invention provides a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method that can suppress warpage in a semiconductor wafer due to a temperature difference between the mounting surface of a table and the semiconductor wafer. In a prober of the present invention, a semiconductor wafer is heated to have a second temperature which is equal to or lower than a first temperature in a preheating step using an oven, and then the semiconductor wafer is placed on a mounting surface of a table which is heated to the first temperature. Thus, because a temperature difference between the mounting surface of the table and the semiconductor wafer is reduced in the prober, it is possible to suppress warpage in the semiconductor wafer that occurs right after the semiconductor wafer is placed on the mounting surface.

Abstract: The present invention provides a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method that can suppress warpage in a semiconductor wafer due to a temperature difference between the mounting surface of a table and the semiconductor wafer. In a prober of the present invention, a semiconductor wafer is heated to have a second temperature which is equal to or lower than a first temperature in a preheating step using an oven, and then the semiconductor wafer is placed on a mounting surface of a table which is heated to the first temperature. Thus, because a temperature difference between the mounting surface of the table and the semiconductor wafer is reduced in the prober, it is possible to suppress warpage in the semiconductor wafer that occurs right after the semiconductor wafer is placed on the mounting surface.

Abstract: Disclosed are a sound generation system, an ultrasonic wave emitting device, and an ultrasonic wave emitting method which utilize the principle of parametric speakers (which uses the difference between frequencies of two ultrasonic waves) and which are capable of allowing target persons in a prescribed area to hear a sound only when a mobile body approaches said prescribed area. An alert system (10) has an ultrasonic wave emitting device (100) mounted on a mobile body (200), and an ultrasonic wave emitting device (300) permanently installed near an area (A101). The ultrasonic wave emitting device (300) emits a first ultrasonic wave towards an area at least including the aforementioned area (A101), and meanwhile, the ultrasonic wave emitting device (100) emits a second ultrasonic wave. The ultrasonic emitting device (100) forms the second ultrasonic wave by means of modulating the ultrasonic wave of frequency f1 with an audible signal.

Abstract: Provided are a device and a method that can classify an incoming wave and can correctly distinguish the position of an originating device, even in a multipath environment. A principal vertically polarized wave arrival direction sensing unit (104-1) and a principal horizontally polarized wave arrival direction sensing unit (104-2) respectively sense the arrival direction of a principal wave by sensing the arrival direction in which the maximum reception level is obtained. An incoming wave classifying decision unit (108) determines that a direct wave has arrived when the difference between the principal wave arrival direction sensed by the principal vertically polarized wave arrival direction sensing unit (104-1) and the principal wave arrival direction sensed by the principal horizontally polarized wave arrival direction sensing unit (104-2) is within a prescribed threshold value, and determines that a direct wave has not arrived when the difference is greater than the threshold value.

Abstract: Disclosed are a sound generation system, an ultrasonic wave emitting device, and an ultrasonic wave emitting method which utilize the principle of parametric speakers (which uses the difference between frequencies of two ultrasonic waves) and which are capable of allowing target persons in a prescribed area to hear a sound only when a mobile body approaches said prescribed area. An alert system (10) has an ultrasonic wave emitting device (100) mounted on a mobile body (200), and an ultrasonic wave emitting device (300) permanently installed near an area (A101). The ultrasonic wave emitting device (300) emits a first ultrasonic wave towards an area at least including the aforementioned area (A101), and meanwhile, the ultrasonic wave emitting device (100) emits a second ultrasonic wave. The ultrasonic emitting device (100) forms the second ultrasonic wave by means of modulating the ultrasonic wave of frequency fit with an audible signal.

Abstract: Provided are a device and a method that can classify an incoming wave and can correctly distinguish the position of an originating device, even in a multipath environment. A principal vertically polarized wave arrival direction sensing unit (104-1) and a principal horizontally polarized wave arrival direction sensing unit (104-2) respectively sense the arrival direction of a principal wave by sensing the arrival direction in which the maximum reception level is obtained. An incoming wave classifying decision unit (108) determines that a direct wave has arrived when the difference between the principal wave arrival direction sensed by the principal vertically polarized wave arrival direction sensing unit (104-1) and the principal wave arrival direction sensed by the principal horizontally polarized wave arrival direction sensing unit (104-2) is within a prescribed threshold value, and determines that a direct wave has not arrived when the difference is greater than the threshold value.