Abstract: An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

Abstract: A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump for supplying a cooling liquid; a heat-receiving jacket, being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag, having an ion exchange resin and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag is exchangeable.

Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is achieved through circulation of a liquid, in particular, for providing the structure of being high in cooling performance and reliability, wherein a heat-radiation pipe 9 is connected to a heat-radiation plate 10 disposed in a rear surface of a display 2, while thermally connecting a water-cooling jacket 8 with the heat-generating element 7, thereby circulating a coolant liquid between the water-cooling jacket 8 and the heat-radiation pipe 9 by means of a liquid driving device 11. The water-cooling jacket 8 can be formed in one body of a jacket base and a flow passage therein through the die-cast forming thereof, or can be constructed in one body with the water-cooling jacket and the flow passage of piping, through connection between the jacket base and the metal pipe.

Abstract: A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

Abstract: An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.

Abstract: A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.

Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.

Abstract: A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.

Abstract: A plurality of electronic apparatuses, each apparatus having a closed loop cooling system, are installed in a cabinet having another closed loop fluid cooling system. Each of the closed loop fluid cooling systems includes a heat receiver and a pump. A projection is mounted on the electronic apparatus and a switching valve is arranged on the cabinet to stop or start circulation of a cooling fluid.

Abstract: In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.

Abstract: A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, of the type used in an electronic apparatus that is small and thin in size, or in a personal computer equipped with such a structure therein. The system has a pump of the reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another so as to form a closed loop filled with a cooling liquid. In the system, &Dgr;Vs is equal to or greater than &Dgr;Vp, wherein the inner volume change when the pump emits pulsation therefrom is &Dgr;Vp, the pressure caused by the volume change is P, and the volume change due to the pressure P that occurs in flow passage of the cooling liquid &Dgr;Vp other than within the pump, is &Dgr;Vs.

Abstract: A plurality of electronic apparatuses, each apparatus having a closed loop cooling system, are installed in a cabinet having another closed loop fluid cooling system. Each of the closed loop fluid cooling systems includes a heat receiver and a pump. A projection is mounted on the electronic apparatus and a switching valve is arranged on the cabinet to stop or start circulation of a cooling fluid.

Abstract: A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.

Abstract: A liquid cooling system for use in an electronic apparatus having a heat generating member includes a heat-receiving member thermally connected with the heat generating member and having a first flow passage, a heat-dissipating member to dissipate heat into an outside air atmosphere, and having a second flow passage, a tube for connecting between the first flow passage and the second flow passage, and a heat transfer device including therein a liquid circulator for circulating liquid through the first and second flow passages between the heat-receiving element and the heat-dissipating element. The liquid circulator produces a liquid circulating flow rate so that a difference between a maximum temperature and a minimum temperature of the circulating liquid at least in the first and second flow passages is not greater than a difference between an upper limit temperature of the heat generating member and an outside air temperature of the electronic apparatus.

Abstract: A liquid cooling system for a personal computer is suitable for cooling a semiconductor device, etc, generating high heat and is designed to suppress undesirable influence on the personal computer following corrosion in the liquid cooling system, thereby ensuring the dependability of the system as a whole. The liquid cooling system has a pump for supplying cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body; a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket; and a passage for circulating the cooling liquid passing through the heat radiation pipe into said pump. The heat radiation pipe is made of a material having a corrosion resistance that is higher than that of the heat receiving jacket.

Abstract: There is provided an electronic apparatus having a liquid-cooled structure appropriate to downsized and thin models and a long useful life. The structure has a necessary and sufficient circulating fluid amount in correspondence with increase in heat generation amount of heat generating device accompanying improvement in processing performance of electronic device. An incoming radiational jacket is thermally connected to a heat generating device, and thermally connected to a tank, first and second pipes and a radiation panel provided on the rear surface of display. Coolant liquid is circulated between the incoming radiational jacket and a third pipe by a pump. Further, a metal radiation panel is covered with a resin display cover.

Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.

Abstract: An electronic equipment or apparatus, small-sized and thinned in the thickness thereof, having a system for cooling an semiconductor element generating high temperature, comprising: a case mounting the semiconductor element within an inside thereof; a heat-receiving member being thermally connected with the semiconductor element; a heat-radiation member being disposed on an interior surface side of the case; a liquid driving means for driving a liquid coolant between the heat-radiation member and the heat-receiving member; a tank for accumulating the liquid coolant therein; and tubes for connecting between the tank, the heat-radiation member, and the heat-receiving member, wherein the tube is made of either one of butyl rubber, nitrobutadien rubber, fluororubber, ethylene-propylene rubber, hydrinrubber, or polysulfide rubber, so that a permeation amount “q” of the coolant is determined to be equal to or less than a containing amount “Q” of the coolant.

Abstract: In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.

Abstract: An electronic apparatus has a water-cooling system suited for a construction having compact, thin design. In the electronic apparatus, a water-cooling jacket is thermally connected to a heat-generating element, a heat-dissipating pipe is thermally connected to a heat-dissipating metal sheet provided at a rear panel of a display case, and a cooling medium liquid is circulated between the water-cooling jacket and the heat-dissipating pipe by a liquid-moving device. A necessary and sufficient circulating flow rate and a necessary discharge pressure are determined by the relation between the upper limit temperature of the heat-generating element and the limit amount of heat dissipation from the surface of the housing. With this structure, heat occurring in the heat-generating element can be dissipated from the rear surface of the display case due to the necessary and sufficient liquid-circulating flow rate.