Abstract: A coil apparatus having a divided winding conformation and a manufacturing method of the coil apparatus which can prevent a winding from collapsing while achieving a reduction in size of a core and simplification of a structure. A coil apparatus includes a ferrite core and a coil provided around the core. The coil includes at least a first coil portion and a second coil portion, and a boundary end surface of the first coil portion on the second coil portion side is inclined in such a manner that its inner peripheral side is closer to the second coil portion than its outer peripheral side. Further, a boundary end surface of the second coil portion on the first coil portion side is inclined in such a manner that its outer peripheral side is closer to the first coil portion than its inner peripheral side.

Abstract: A coil apparatus that can increase mechanical strength of terminal portions and assure sufficient impact resistant properties and vibration resistant properties even in an application in a severe use environment such as an in-vehicle coil apparatus. Terminals are formed of one metal sheet, and include an attachment portion, an intermediate portion, and a bottom portion. One end of the attachment portion is fixed at each terminal attachment portion of a core. One end of the intermediate portion is continuous with the other end of the attachment portion at a first bent portion. The bottom portion has a first end continuous with the other end of the intermediate portion at a second bent portion, facing the attachment portion, and a second free end. The intermediate portion has a hole in a plane thereof. In each hole, both inner edges that are opposed to each other in at least one direction have an arc shape.

Abstract: A coil apparatus that can increase mechanical strength of terminal portions and assure sufficient impact resistant properties and vibration resistant properties even in an application in a severe use environment such as an in-vehicle coil apparatus. Terminals are formed of one metal sheet, and include an attachment portion, an intermediate portion, and a bottom portion. One end of the attachment portion is fixed at each terminal attachment portion of a core. One end of the intermediate portion is continuous with the other end of the attachment portion at a first bent portion. The bottom portion has a first end continuous with the other end of the intermediate portion at a second bent portion, facing the attachment portion, and a second free end. The intermediate portion has a hole in a plane thereof. In each hole, both inner edges that are opposed to each other in at least one direction have an arc shape.

Abstract: A coil apparatus having a divided winding conformation and a manufacturing method of the coil apparatus which can prevent a winding from collapsing while achieving a reduction in size of a core and simplification of a structure. A coil apparatus includes a ferrite core and a coil provided around the core. The coil includes at least a first coil portion and a second coil portion, and a boundary end surface of the first coil portion on the second coil portion side is inclined in such a manner that its inner peripheral side is closer to the second coil portion than its outer peripheral side. Further, a boundary end surface of the second coil portion on the first coil portion side is inclined in such a manner that its outer peripheral side is closer to the first coil portion than its inner peripheral side.

Abstract: A coil-embedded dust core and a method for manufacturing the coil-embedded dust core are provided. The coil-embedded dust core comprises a coil formed from a flat conductor wound in a coil configuration, and a green body consisting of insulating material-coated ferromagnetic metal particles. This results in a coil-embedded dust core more compact in size but with larger inductance. A rectangular wire can be used as the flat conductor. In addition, parts of the coil may function as terminal sections. In this case, the terminal sections of the coil may be formed wider than other part of the coil. The coil-embedded dust core is less prone to joint failures between a coil and terminal sections and to insulation failures of the coil and the terminal section with respect to the magnetic powder. The coil-embedded dust core is more compact while achieving larger inductance.

Abstract: The adhesion between a protective layer, which covers a wiring layer, and a potting material, which covers a microchip, in a hybrid IC is improved without placing an additional material between the protective layer and the potting material. The potting material is separated from other electronic devices on the hybrid IC. To improve adhesion, the surface roughness of the protective layer is increased by adding insulating particles to the protective layer, striking the surface of the protective layer with ceramic particles, or replicating a mesh pattern of a screen mask on the surface of the protective layer. To keep the potting material separated from the other electronic devices, another potting material for covering the electronic devices, which is more viscous than the potting material for covering the microchip, is potted and hardened before the potting material for covering the microchip is potted.

Abstract: A coil-embedded dust core and a method for manufacturing the coil-embedded dust core are provided. The coil-embedded dust core comprises a coil formed from a flat conductor wound in a coil configuration, and a green body consisting of insulating material-coated ferromagnetic metal particles. This results in a coil-embedded dust core more compact in size but with larger inductance. A rectangular wire can be used as the flat conductor. In addition, parts of the coil may function as terminal sections. In this case, the terminal sections of the coil may be formed wider than other part of the coil. The coil-embedded dust core is less prone to joint failures between a coil and terminal sections and to insulation failures of the coil and the terminal section with respect to the magnetic powder. The coil-embedded dust core is more compact while achieving larger inductance.

Abstract: A coil-embedded dust core and a method for manufacturing the coil-embedded dust core are provided. The coil-embedded dust core comprises a coil formed from a flat conductor wound in a coil configuration, and a green body consisting of insulating material-coated ferromagnetic metal particles. This results in a coil-embedded dust core more compact in size but with larger inductance. A rectangular wire can be used as the flat conductor. In addition, parts of the coil may function as terminal sections. In this case, the terminal sections of the coil may be formed wider than other part of the coil. The coil-embedded dust core is less prone to joint failures between a coil and terminal sections and to insulation failures of the coil and the terminal section with respect to the magnetic powder. The coil-embedded dust core is more compact while achieving larger inductance.

Abstract: A coil-embedded dust core and a method for manufacturing the coil-embedded dust core are provided. The coil-embedded dust core comprises a coil formed from a flat conductor wound in a coil configuration, and a green body consisting of insulating material-coated ferromagnetic metal particles. This results in a coil-embedded dust core more compact in size but with larger inductance. A rectangular wire can be used as the flat conductor. In addition, parts of the coil may function as terminal sections. In this case, the terminal sections of the coil may be formed wider than other part of the coil. The coil-embedded dust core is less prone to joint failures between a coil and terminal sections and to insulation failures of the coil and the terminal section with respect to the magnetic powder. The coil-embedded dust core is more compact while achieving larger inductance.

Abstract: Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

Abstract: A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

Abstract: At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.

Abstract: The adhesion between a protective layer, which covers a wiring layer, and a potting material, which covers a microchip, in a hybrid IC is improved without placing an additional material between the protective layer and the potting material. The potting material is separated from other electronic devices on the hybrid IC. To improve adhesion, the surface roughness of the protective layer is increased by adding insulating particles to the protective layer, striking the surface of the protective layer with ceramic particles, or replicating a mesh pattern of a screen mask on the surface of the protective layer. To keep the potting material separated from the other electronic devices, another potting material for covering the electronic devices, which is more viscous than the potting material for covering the microchip, is potted and hardened before the potting material for covering the microchip is potted.

Abstract: A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

Abstract: A coil-embedded dust core and a method for manufacturing the coil-embedded dust core are provided. The coil-embedded dust core comprises a coil formed from a flat conductor wound in a coil configuration, and a green body consisting of insulating material-coated ferromagnetic metal particles. This results in a coil-embedded dust core more compact in size but with larger inductance. A rectangular wire can be used as the flat conductor. In addition, parts of the coil may function as terminal sections. In this case, the terminal sections of the coil may be formed wider than other part of the coil. The coil-embedded dust core is less prone to joint failures between a coil and terminal sections and to insulation failures of the coil and the terminal section with respect to the magnetic powder. The coil-embedded dust core is more compact while achieving larger inductance.

Abstract: A multilayer wiring substrate has a passive circuit element disposed on an insulating base substrate, and an insulating layer is disposed on the insulating base substrate with the passive circuit element interposed therebetween. The insulating layer is formed to have via holes for exposing specific portions of the passive circuit element, and a terminal electrodes are disposed in the via holes. Accordingly, the entire area of the multilayer wiring substrate can be reduced, and cracks caused by residual stress produced by a firing step can be prevented.

Abstract: In a mounting structure of a flip chip IC, the flip chip IC is mounted on an alumina laminated substrate through conductive lands of the substrate and bumps of the flip chip IC. A space between the flip chip IC and the substrate is filled with resin. Further, inspection lands are provided on the substrate for inspecting the flip chip IC, and are electrically connected to the conductive lands through vias and inside wires provided in the substrate. That is, the inspection lands are connected to the conductive lands to bypath an edge portion of the resin. As a result, separation of the resin from the substrate can be prevented.

Abstract: Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

Abstract: A mounting structure includes a laminated ceramic capacitor mounted on a mounting substrate. The laminated ceramic capacitor includes a main body chip made by a ceramic dielectric, internal layer electrodes, and pair of terminal electrodes. The mounting substrate is made by alumina substrate, and has a pair of substrate electrodes made by copper plating. The laminated ceramic capacitor is mounted on the mounting substrate by using an Ag paste. Here, the substrate electrode is set to be smaller than the Ag paste. That is, the Ag paste is extruded from the terminal electrodes and the substrate electrode so as to contact to both of the main body chip and the mounting substrate. Because the Ag paste has a high adhesive strength compared to that when it is bonded with a metal, total adhesive strength can be improved. Consequently, the reliability of mounting can be improved.