Patents by Inventor Takashi Nakagima

Takashi Nakagima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper Ni-Si-P alloy for an electronic device
    Patent number: 5248351
    Abstract: A copper alloy for an electronic device comprises 2.0 wt% -8 wt% of Ni, 0.1 wt% -0.8 wt% of P, 0.06 wt% -1 wt% of Si and the rest being Cu and unavoidable impurities.The rest may include 0.03 wt% -2.0 wt% of Zn. The copper allow has an oxygen content of 20 ppm or less.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: September 28, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenji Kubozono, Takashi Nakagima, Takefumi Itou, Kimio Hashizume, Shinichi Iwase