Patents by Inventor Takashi Nakatani

Takashi Nakatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150018470
    Abstract: The present invention provides a hot melt adhesive composition comprising (A) an ethylene copolymer obtained by copolymerizing ethylene and ?-olefin using a single-site catalyst and (B) a rosin ester, in a hydrolyzate of which a dehydroabietic acid content is 30 wt % or less and an abietic acid content is 10 wt % or less, and in a methylated product of the hydrolyzate of which a content of components having a molecular weight of 320 is equal to or greater than 10 wt % of a total amount of components having a molecular weight of 314 to 320.
    Type: Application
    Filed: March 8, 2013
    Publication date: January 15, 2015
    Applicant: ARAKAWA CHEMICAL INDUSTRIES, LTD.
    Inventor: Takashi Nakatani
  • Patent number: 8829077
    Abstract: A thermally decomposable binder resin containing, as an active ingredient, a rosin derivative (A) that is obtained by subjecting a rosin (a) to distillation and a disproportionation treatment and/or hydrogenation treatment, wherein the rosin derivative (A) has a 99 wt % weight loss temperature of 500° C. or lower in thermogravimetric measurement, under an air atmosphere at a heating rate of 5° C./min, a binder resin composition containing the resin, and a use of the binder resin composition.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: September 9, 2014
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventor: Takashi Nakatani
  • Patent number: 8368512
    Abstract: An RFID tag is characterized in that it includes: a dielectric substrate; a ground conductor portion disposed on one main surface of this dielectric substrate; a patch conductor portion disposed on another main surface of the above-mentioned dielectric substrate and forming a slot; electrical connecting portions internally extending from opposing sides of the above-mentioned slot, respectively; and an IC chip placed in the above-mentioned slot and connected to the above-mentioned electrical connecting portions.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: February 5, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hirokatsu Okegawa, Takanori Miyamae, Masataka Ohtsuka, Yasuhiro Nishioka, Toru Fukasawa, Osamu Murakami, Takashi Nakatani, Masashi Kawanami
  • Publication number: 20120296007
    Abstract: The present invention provides an easily thermally decomposable binder resin containing, as an active ingredient, a rosin derivative (A) that is obtained by subjecting a rosin (a) to distillation and a disproportionation treatment and/or hydrogenation treatment and that has a 99 wt % weight loss temperature in thermogravimetric measurement under an air atmosphere at a heating rate of 5° C./min of 500° C. or lower, a binder resin composition containing the resin, and a use of the binder resin composition.
    Type: Application
    Filed: January 19, 2011
    Publication date: November 22, 2012
    Inventor: Takashi Nakatani
  • Publication number: 20110288208
    Abstract: The present invention provides a resin modifier comprising as an active ingredient a hydrogenated rosin ester in which a component having a molecular weight of 320 of a methylation product of a hydrolyzate of the hydrogenated rosin ester as measured by gas chromatography-mass spectrometry accounts for 95 wt % or greater of the total amount of the components having a molecular weight of 314 to 320; a modifier that is an optical embrittlement inhibitor for use in an adhesive polymer resin; an adhesive composition comprising the optical embrittlement inhibitor; a modifier that is a melt fluidity and adhesion improver for a thermoplastic resin; and a thermoplastic resin composition comprising the melt fluidity and adhesion improver.
    Type: Application
    Filed: March 11, 2010
    Publication date: November 24, 2011
    Inventors: Takashi Nakatani, Takumi Okazaki
  • Publication number: 20080252425
    Abstract: An RFID tag is characterized in that it includes: a dielectric substrate; a ground conductor portion disposed on one main surface of this dielectric substrate; a patch conductor portion disposed on another main surface of the above-mentioned dielectric substrate and forming a slot; electrical connecting portions internally extending from opposing sides of the above-mentioned slot, respectively; and an IC chip placed in the above-mentioned slot and connected to the above-mentioned electrical connecting portions.
    Type: Application
    Filed: February 28, 2007
    Publication date: October 16, 2008
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hirokatsu Okegawa, Takanori Miyamae, Masataka Ohtsuka, Yasuhiro Nishioka, Toru Fukasawa, Osamu Murakami, Takashi Nakatani, Masashi Kawanami
  • Patent number: 6281934
    Abstract: A data slicing device includes an A/D converter for converting a video signal applied thereto into an equivalent digital signal, a sequential integrating circuit for averaging the amplitude of a dc component included in the digital signal obtained by the A/D converter, and a comparator for comparing a value of the digital signal obtained by the A/D converter with the average of the amplitude of the dc component obtained by the sequential integrating circuit so as to extract data from the digital signal.
    Type: Grant
    Filed: October 7, 1998
    Date of Patent: August 28, 2001
    Assignees: Mitsubishi Electric System LSI Design Corporation, Mitsubishi Denki Kabushiki Kaisha
    Inventor: Takashi Nakatani
  • Patent number: 6188258
    Abstract: Clock generating circuitry comprises a first frequency multiplier for multiplying the frequency of a reference clock applied thereto by 2n, where n is a natural integer, and for furnishing the frequency-multiplied clock, a frequency divider for dividing the frequency of the frequency-multiplied clock furnished by the first frequency multiplier by 227, and for furnishing the frequency-divided clock, and a second frequency multiplier for multiplying the frequency of the frequency-divided clock from the frequency divider by 128, and for furnishing the frequency-multiplied clock. The reference clock can have a frequency of about 4.43 MHz.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: February 13, 2001
    Assignees: Mitsubishi Electric System LSI Design Corporation, Mitsubishi Denki Kabushiki Kaisha
    Inventor: Takashi Nakatani
  • Patent number: 5900754
    Abstract: A D flip-flop latches a reference clock signal in response to an output signal fed back from an output circuit. A pulse generating circuit generates a pulse in response to the output signal fedback from the output circuit. From the latched signal and the pulse generated by the pulse generating circuit, a count pulse is generated. The count pulse is output to an up/down counter. Based on the counting result of the up/down counter, a digital-to-analog conversion circuit generates a delay control signal. Using this delay control signal, the delay circuit synchronizes its output signal with the reference clock signal. It is possible to synchronize the output data signal with the reference clock signal regardless of variations in the reference clock signal, source voltage, and ambient temperature.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: May 4, 1999
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Semiconductor Software Co., Ltd.
    Inventor: Takashi Nakatani