Abstract: A light-emitting module includes: first and second light-emitting devices each including semiconductor laser elements that emit laser beams with an interval in a slow axis direction of the laser beams; a first optical unit that includes one or more first reflective members provided with reflective surfaces on which laser beams are incident and that makes the interval of the laser beams smaller and emits the laser beams; a second optical unit that includes second reflective members provided with reflective surfaces on which laser beams are incident and that reflects, two times or more, laser beams emitted with an interval in a fast axis direction and emits the laser beams with a smaller interval and with a smaller width in the fast axis direction of the laser beams; and a condenser lens that gathers laser beams having traveled through the first optical unit and the second optical unit.

Abstract: A light-emitting module includes: first and second light-emitting devices each including semiconductor laser elements that emit laser beams with an interval in a slow axis direction of the laser beams; a first optical unit that includes one or more first reflective members provided with reflective surfaces on which laser beams are incident and that makes the interval of the laser beams smaller and emits the laser beams; a second optical unit that includes second reflective members provided with reflective surfaces on which laser beams are incident and that reflects, two times or more, laser beams emitted with an interval in a fast axis direction and emits the laser beams with a smaller interval and with a smaller width in the fast axis direction of the laser beams; and a condenser lens that gathers laser beams having traveled through the first optical unit and the second optical unit.

Abstract: A light-emitting module includes: a plurality of light-emitting elements located on a mounting surface; one or more optical members configured to control light emitted from each of the plurality of light-emitting elements, and allow output light and monitor light for controlling an output of the output light to exit; and a detection unit configured to detect the monitor light. The one or more optical members include a first optical member on which the light emitted from the plurality of light-emitting elements is incident. The plurality of light-emitting elements comprises a plurality of first light-emitting elements, which are, among the plurality of light-emitting elements, all light-emitting elements that are configured to emit light incident on the first optical member. The detection unit includes: a first condensing lens configured to condense the monitor light, and a light-receiving element configured to receive the monitor light exiting from the first condensing lens.

Abstract: A light emission module includes a first light emission unit that includes a first light emission device and emits first light. The first light emission device includes a plurality of first light emission portions, each including a light emission surface, where light from a plurality of first light emission elements is emitted, a heat dissipation surface provided opposite to the light emission surface, and a connection portion being positioned between the light emission surface and the heat dissipation surface and including a wiring mounting surface where the light emission elements are electrically connected.

Abstract: A light emitting device includes a semiconductor laser element configured to emit a first light, a wavelength converting member configured to emit a second light upon being irradiated by the first light, and a support member defining a through-hole allowing an optical path of the first light to pass through. The through-hole is defined by, in order from a light incident side to a light emitting side with respect to the first light, a lower portion with opening width decreasing from the light incident side to the light emitting side, and an upper portion where the wavelength converting member is fixed. The semiconductor laser element is disposed at a location allowing the first light to enter the lower portion of the through-hole while also allowing a part of the first light to be reflected at a wall defining the lower portion of the through-hole.

Abstract: A light-emitting device includes: a package made of a metal material and defining a recess, the package comprising a side wall defining a side of the recess; a plurality of light-emitting elements disposed in the recess; and a cover member disposed so as to close an opening of the recess, the cover member including: a light-transmitting member having a primary surface, a ceramic member having a loop-shape and having a first surface and a second surface opposite the first surface, the first surface bonded to the primary surface of the light-transmitting member via a bonding material, and a metal member having a loop-shape and including: a first portion bonded to the second surface of the ceramic member, and a second portion located outward of the first portion in a plan view and joined to an upper surface of the side wall of the package.

Abstract: A light-emitting device includes: a package made of a metal material and defining a recess, the package comprising a side wall defining a side of the recess; a plurality of light-emitting elements disposed in the recess; and a cover member disposed so as to close an opening of the recess, the cover member including: a light-transmitting member having a primary surface, a ceramic member having a loop-shape and having a first surface and a second surface opposite the first surface, the first surface bonded to the primary surface of the light-transmitting member via a bonding material, and a metal member having a loop-shape and including: a first portion bonded to the second surface of the ceramic member, and a second portion located outward of the first portion in a plan view and joined to an upper surface of the side wall of the package.

Abstract: A light emitting device includes a semiconductor laser element configured to emit a first light, a wavelength converting member configured to emit a second light upon being irradiated by the first light, and a support member defining a through-hole allowing an optical path of the first light to pass through. The through-hole is defined by, in order from a light incident side to a light emitting side with respect to the first light, a lower portion with opening width decreasing from the light incident side to the light emitting side, and an upper portion where the wavelength converting member is fixed. The semiconductor laser element is disposed at a location allowing the first light to enter the lower portion of the through-hole while also allowing a part of the first light to be reflected at a wall defining the lower portion of the through-hole.

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space to between the lateral surfaces of the recess and the support member.