Patents by Inventor Takashi Nawata

Takashi Nawata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 11733738
    Abstract: According to one embodiment, an electronic device includes a housing including a mounting part, installation component installed in the mounting part, and detaching/attaching mechanism capable of detaching the installation component in a first direction. The detaching/attaching mechanism includes an operating lever including a first protrusion which includes a first abutting face and second abutting face, a second protrusion which includes a third abutting face, and a third protrusion which includes a fourth abutting face. At least one of the first abutting face and third abutting face is inclined, and at least one of the second abutting face and fourth abutting face is inclined.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: August 22, 2023
    Assignee: DYNABOOK INC.
    Inventor: Takashi Nawata
  • ELECTRONIC DEVICE
    Publication number: 20230056820
    Abstract: According to one embodiment, an electronic device includes a housing including a mounting part, installation component installed in the mounting part, and detaching/attaching mechanism capable of detaching the installation component in a first direction. The detaching/attaching mechanism includes an operating lever including a first protrusion which includes a first abutting face and second abutting face, a second protrusion which includes a third abutting face, and a third protrusion which includes a fourth abutting face. At least one of the first abutting face and third abutting face is inclined, and at least one of the second abutting face and fourth abutting face is inclined.
    Type: Application
    Filed: April 13, 2022
    Publication date: February 23, 2023
    Inventor: Takashi Nawata
  • Magnetic head assembly with slider and spring having a predetermined thermal expansion coefficient
    Patent number: 5896244
    Abstract: A slider is attached to a spring with an epoxy adhesive. The thermal expansion coefficient of the spring is set greater than that of the slider by 10% to 60%. In this range, the deformation of the slider is reduced more effectively than when the thermal expansion coefficients of the slider and the spring are set substantially identical. The slider has a crown. The crown is formed by attaching a face of the slider to a concave surface, forming flat another face of the slider opposing the attached face, and disengaging the slider from the concave surface.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: April 20, 1999
    Assignee: NEC Corporation
    Inventors: Makoto Watanabe, Takashi Nawata
  • Magnetic head assembly and a magnetic disk apparatus using the same
    Patent number: 5761001
    Abstract: A slider is attached to a spring with an epoxy adhesive. The thermal expansion coefficient of the spring is set greater than that of the slider by 10% to 60%. In this range, the deformation of the slider is reduced more effectively than when the thermal expansion coefficients of the slider and the spring are set substantially identical. The slider has a crown. The crown is formed by attaching a face of the slider to a concave surface, forming flat another face of the slider opposing the attached face, and disengaging the slider from the concave surface.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: June 2, 1998
    Assignee: NEC Corporation
    Inventors: Makoto Watanabe, Takashi Nawata