Abstract: To prevent both increase in impedance and a short circuit, a connector cable is configured such that a connector and a shielded cable are connected via a relay substrate. The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric. The inner conductor is connected to a contact of the connector at a part where the shield member and the dielectric are removed to expose the inner conductor. At least directly under a part where the shield member is removed to expose the dielectric, a ground (GND) conductor layer on a front surface of the relay substrate is arranged. The GND conductor layer on the front surface of the relay substrate, which is arranged directly under the part where the shield member is removed, is covered with an insulating member.

Abstract: Provided is a semiconductor device, comprising: a semiconductor substrate having an upper surface, a lower surface, and a center position equidistant from the upper surface and the lower surface in a depth direction of the semiconductor substrate. An N-type region with an N-type conductivity is provided in the semiconductor substrate such that the N-type region includes the center position of the semiconductor substrate. The N-type region includes an acceptor with a concentration that is a lower concentration than a carrier concentration, and is 0.001 times or more of a carrier concentration at the center position of the semiconductor substrate.

Abstract: The present invention relates to a photocurable composition having a sheet shape at 25° C. in an uncured state, the photocurable composition including a urethane-modified (meth)acrylate oligomer and a photoinitiator and being free from a film-forming component. The present invention also relates to a photocurable composition, a method for producing a photocurable composition having a sheet shape at 25° C. in an uncured state, and a laminated body.

Abstract: The present invention provides a photocurable composition containing an ultraviolet absorber, which has high photocurability and yields a cured material having a high cutting capacity against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency. The present invention relates to a sheet-shaped photocurable composition which includes the following components (A) to (D), and when a cured material obtained after photocuring the photocurable composition has a thickness of 150 ?m, a yellow index of the cured material is 4.0 or less and a light transmittance of the cured material at a wavelength of 385 nm is 5.0% or less: a component (A): a (meth)acrylate compound, a component (B): a film forming resin, a component (C): a photoinitiator, and a component (D): an ultraviolet absorber.

Abstract: The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan ?=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×105 Pa or less after curing.

Abstract: When a game object is located in an end range in a virtual space relating to a first end portion of a display range of a display image, the end range being in the display range, end control that causes the game object to remain in the end range is performed while a range of view is being moved in a first direction in the virtual space that is a direction perpendicular to the first end portion and aimed at inside of the display range and/or while the game object is performing an action of moving in a second direction opposite to the first direction. When the end control has continued for at least a waiting period, the game object is moved to a location other than the end range in a range in the virtual space relating to the display range.

Abstract: To prevent both increase in impedance and a short circuit, a connector cable is configured such that a connector and a shielded cable are connected via a relay substrate. The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric. The inner conductor is connected to a contact of the connector at a part where the shield member and the dielectric are removed to expose the inner conductor. At least directly under a part where the shield member is removed to expose the dielectric, a ground (GND) conductor layer on a front surface of the relay substrate is arranged. The GND conductor layer on the front surface of the relay substrate, which is arranged directly under the part where the shield member is removed, is covered with an insulating member.

Abstract: The sheet-shaped photocurable composition of the present invention includes components (A) to (D) as follows, and is in a sheet shape at 25° C. in a state before curing: Component (A): (meth)acrylic triblock copolymer, Component (B): (meth)acrylate oligomer (excluding the component (A)), Component (C): a monomer having a (meth)acryloyl group and having a specific structure, and Component (D): photoinitiator.

Abstract: The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan ?=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×105 Pa or less after curing.

Abstract: The present invention provides a photocurable composition containing an ultraviolet absorber, which has high photocurability and yields a cured material having a high cutting capacity against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency. The present invention relates to a sheet-shaped photocurable composition which includes the following components (A) to (D), and when a cured material obtained after photocuring the photocurable composition has a thickness of 150 ?m, a yellow index of the cured material is 4.0 or less and a light transmittance of the cured material at a wavelength of 385 nm is 5.0% or less: a component (A): a (meth)acrylate compound, a component (B): a film forming resin, a component (C): a photoinitiator, and a component (D): an ultraviolet absorber.

Abstract: The present invention provides a photocurable composition containing an ultraviolet absorber, which yields a cured material thereof having a high cutting capability against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency, both immediately after preparing the same and after a lapse of time of being left in a severe environment such as a high-temperature and high-humidity environment, an environment exposed to water or light, and the like. The present invention relates to a sheet-shaped photocurable composition including the following components (A) to (E): a component (A): a (meth)acrylate compound; a component (B): a film forming resin; a component (C): a photoinitiator; a component (D): a compound having a specific skeleton structure; a component (E): a compound having a specific group in the molecule.

Abstract: A thermoelectric conversion device including a plurality of first electrodes; a plurality of thermoelectric conversion elements, each having one end electrically connected to each of the first electrodes; a plurality of second electrodes, to which another end of each of the thermoelectric conversion elements is electrically connected; a hot-side heat exchanger connected to the first electrodes; and a cold-side heat exchanger connected to the second electrodes. Multiple springs are disposed in an interior of one of the hot-side heat exchanger and the cold-side heat exchanger at portions connected to either the first electrodes or the second electrodes, such that one spring is disposed so as to bias one thermoelectric conversion element. The one exchanger is provided with a transfer portion capable of transmitting to one thermoelectric conversion element a biasing force of one spring at a portion connected to the first electrode or the second electrode.

Abstract: A thermoelectric conversion device including a plurality of first electrodes; a plurality of thermoelectric conversion elements, each having one end electrically connected to each of the first electrodes; a plurality of second electrodes, to which another end of each of the thermoelectric conversion elements is electrically connected; a hot-side heat exchanger connected to the first electrodes; and a cold-side heat exchanger connected to the second electrodes. Multiple springs are disposed in an interior of one of the hot-side heat exchanger and the cold-side heat exchanger at portions connected to either the first electrodes or the second electrodes, such that one spring is disposed so as to bias one thermoelectric conversion element. The one exchanger is provided with a transfer portion capable of transmitting to one thermoelectric conversion element a biasing force of one spring at a portion connected to the first electrode or the second electrode.

Abstract: A thermoelectric conversion module has a plurality of cold side substrates, a plurality of first electrodes, a plurality of thermoelectric conversion elements, a plurality of second electrodes, X-axis connectors, and Y-axis connectors. The second electrodes are disposed on the cold side substrates six at a time. Between adjacent cold side substrates, two of X-axis connectors as inter-substrate connectors or Y-axis connectors are disposed. One of the plurality of inter-substrate connectors is connected from one of the first electrodes positioned on one of the cold side substrates to one of the second electrodes positioned on another one of the cold side substrates. The other inter-substrate connector is connected from the other one of the first electrodes on the another one of the cold side substrates to the second electrode on the one cold side substrate.

Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.

Abstract: A thermoelectric conversion module has a plurality of cold side substrates, a plurality of first electrodes, a plurality of thermoelectric conversion elements, a plurality of second electrodes, X-axis connectors, and Y-axis connectors. The second electrodes are disposed on the cold side substrates six at a time. Between adjacent cold side substrates, two of X-axis connectors as inter-substrate connectors or Y-axis connectors are disposed. One of the plurality of inter-substrate connectors is connected from one of the first electrodes positioned on one of the cold side substrates to one of the second electrodes positioned on another one of the cold side substrates. The other inter-substrate connector is connected from the other one of the first electrodes on the another one of the cold side substrates to the second electrode on the one cold side substrate.

Abstract: Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

Abstract: An object of the present invention is to provide a photocurable sheet-type adhesive composition for optical use, which is used for bonding cover glass and a touch panel, a touch panel and a display module, or the like, and has high appearance reliability and storage stability even under high temperature and high humidity. The present invention is a photocurable sheet-shape adhesive for optical use, which contains the following components (A) to (D): (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight average molecular weight of 20,000 to 100,000; (B) 3 to 70 parts by mass of a phenoxy resin having a glass transition temperature of 50 to 120° C.; (C) 0.1 to 10 parts by mass of a photopolymerization initiator; and (D) 1 to 50 parts by mass of a (meth)acrylate monomer which has 8 to 30 repeated blocks having an ether linkage in the molecule and containing at least one (meth)acryloyl group in the molecule.

Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.

Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.