Abstract: A circuit apparatus includes a clock signal generation circuit configured to generate a clock signal by a resonator, an output circuit configured to operate in a first state or a second state in which a consumption current is different from that in the first state and output an output clock signal, and a temperature compensation circuit configured to compensate for a frequency-temperature characteristic of the clock signal based on a temperature detection signal. When the output circuit operates in the first state, the temperature compensation circuit outputs a first temperature compensation signal that compensates for a frequency-temperature characteristic when the output circuit operates in the first state, and the clock signal generation circuit generates a clock signal based on the first temperature compensation signal.

Abstract: A circuit device includes: an oscillation circuit configured to oscillate a resonator; a temperature compensation circuit configured to output a temperature compensation voltage for temperature compensating an oscillation frequency of the oscillation circuit, based on a temperature detection result of a temperature sensor; and a frequency control circuit configured to output a frequency control voltage for the oscillation frequency. The oscillation circuit includes a first variable capacitance circuit having a positive capacitance change characteristic with respect to a capacitance control voltage and a second variable capacitance circuit having a negative capacitance change characteristic with respect to the capacitance control voltage.

Abstract: A circuit device includes an oscillation circuit configured to generate an oscillation signal and a temperature compensation circuit configured to perform temperature compensation for an oscillation frequency of the oscillation signal. The temperature compensation circuit includes a first reference current generation circuit configured to generate a first reference current, a second reference current generation circuit configured to generate a second reference current, a first compensation circuit configured to perform temperature compensation for the oscillation frequency in a first temperature range based on the first reference current, and a second compensation circuit configured to perform temperature compensation for the oscillation frequency in a second temperature range, which is higher than the first temperature range in temperature, based on the second reference current.

Abstract: A circuit device includes: an oscillation circuit configured to oscillate a resonator; a temperature compensation circuit configured to output a temperature compensation voltage for temperature compensating an oscillation frequency of the oscillation circuit, based on a temperature detection result of a temperature sensor; and a frequency control circuit configured to output a frequency control voltage for the oscillation frequency. The oscillation circuit includes a first variable capacitance circuit having a positive capacitance change characteristic with respect to a capacitance control voltage and a second variable capacitance circuit having a negative capacitance change characteristic with respect to the capacitance control voltage.

Abstract: Provided is a temperature sensor including a bipolar transistor, a resistor, and a variable resistance circuit. The resistor is provided between a first node coupled to a base node of the bipolar transistor and a collector node of the bipolar transistor. The variable resistance circuit is provided between an emitter node of the bipolar transistor and a ground node.

Abstract: An integrated circuit device includes a temperature sensor, a heat generation source circuit serving as a heat generation source, a pad for external coupling, and a capacitor having the MIM structure in which one electrode is electrically coupled to the pad for external coupling. In a plan view orthogonal to the substrate on which a circuit element is formed, the capacitor having the MIM structure and the temperature sensor overlap.

Abstract: The circuit device includes a current generation circuit configured to generate a temperature compensation current based on a temperature detection voltage, and a current-voltage conversion circuit configured to perform current-voltage conversion on the temperature compensation current to output a temperature compensation voltage. The current-voltage conversion circuit includes an operational amplifier, and a feedback circuit. The operational amplifier includes a differential section having a current mirror circuit and differential pair transistors, an output section configured to output the temperature compensation voltage, and an RC low-pass filter configured to output a signal obtained by performing a low-pass filter process on an output signal of the differential section to an input node of the output section.

Abstract: The circuit device includes a current generation circuit and a current-voltage conversion circuit. The current generation circuit generates a temperature compensation current based on a temperature detection voltage from the temperature sensor and temperature compensation data. The current-voltage conversion circuit converts the temperature compensation current into the temperature compensation voltage. The current generation circuit performs a fine adjustment of the temperature compensation current based on lower bits of the temperature compensation data, and performs a coarse adjustment of the temperature compensation current based on higher bits of the temperature compensation data.

Abstract: An integrated circuit device includes a temperature sensor, a heat generation source circuit serving as a heat generation source, a pad for external coupling, and a capacitor having the MIM structure in which one electrode is electrically coupled to the pad for external coupling. In a plan view orthogonal to the substrate on which a circuit element is formed, the capacitor having the MIM structure and the temperature sensor overlap.

Abstract: The circuit device includes a current generation circuit configured to generate a temperature compensation current based on a temperature detection voltage, and a current-voltage conversion circuit configured to perform current-voltage conversion on the temperature compensation current to output a temperature compensation voltage. The current-voltage conversion circuit includes an operational amplifier, and a feedback circuit. The operational amplifier includes a differential section having a current mirror circuit and differential pair transistors, an output section configured to output the temperature compensation voltage, and an RC low-pass filter configured to output a signal obtained by performing a low-pass filter process on an output signal of the differential section to an input node of the output section.

Abstract: The circuit device includes a current generation circuit and a current-voltage conversion circuit. The current generation circuit generates a temperature compensation current based on a temperature detection voltage from the temperature sensor and temperature compensation data. The current-voltage conversion circuit converts the temperature compensation current into the temperature compensation voltage. The current generation circuit performs a fine adjustment of the temperature compensation current based on lower bits of the temperature compensation data, and performs a coarse adjustment of the temperature compensation current based on higher bits of the temperature compensation data.

Abstract: Provided is a temperature sensor including a bipolar transistor, a resistor, and a variable resistance circuit. The resistor is provided between a first node coupled to a base node of the bipolar transistor and a collector node of the bipolar transistor. The variable resistance circuit is provided between an emitter node of the bipolar transistor and a ground node.

Abstract: An electronic device includes an vibration element including an vibration body provided with an adjustment section, an electrode disposed on the vibration body, and a connection electrode electrically connected to the electrode, an IC so disposed that the IC faces the vibration element, terminals disposed on the side facing the upper surface of the IC and electrically connected to the connection electrode via a fixing member, wiring sections electrically connected to the terminals and located below the terminals, and a protective layer located above the wiring sections and disposed in a portion where the adjustment section overlaps with the wiring sections in a plan view.

Abstract: An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground).

Abstract: A detection device includes: a drive circuit which receives a feedback signal from a physical quantity transducer and drives the physical quantity transducer; a detection circuit which receives a detection signal from the physical quantity transducer and detects a desired signal; and a control unit which controls switching on/off of an AGC loop in the drive circuit. The drive circuit outputs a drive signal based on a control voltage that is set by the AGC loop in an on-period of the AGC loop to the physical quantity transducer and thus drives the physical quantity transducer in an off-period of the AGC loop.

Abstract: A detection device includes a driving circuit which drives a physical quantity transducer, a detection circuit which detects a desired signal, a power-supply terminal into which a power-supply voltage is input, a regulator circuit which performs a voltage adjustment of stepping down the power-supply voltage from the power-supply terminal, and supplies a regulated power-supply voltage obtained by the voltage adjustment to the driving circuit and the detection circuit as an operating power-supply voltage, and a buffer circuit which is supplied with the power-supply voltage, receives a drive signal from the driving circuit, and outputs an amplified drive signal in which an amplitude of the drive signal increases to the physical quantity transducer.

Abstract: An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground).

Abstract: An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground).

Abstract: A detection device includes a driving circuit that drives a vibrator, and a detection circuit that receives a detection signal from the vibrator and performs a detection process of detecting a physical quantity signal corresponding to a physical quantity from the detection signal. The driving circuit performs intermittent driving in which the vibrator is driven in a driving period, and is not driven in a non-driving period, and the detection circuit performs the detection process of the physical quantity signal in the non-driving period of the intermittent driving.

Abstract: An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground).