Patents by Inventor Takashi Nonogawa
Takashi Nonogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10026667Abstract: A method of manufacturing a light-emitting device that includes a circuit board with p- and n-electrodes formed on a surface of a substrate and a light-emitting element connected to the p- and n-electrodes of the circuit board via a conductor member. The method includes forming two protrusions facing each other on both sides of a gap between the p- and n-electrodes of the circuit board, and dispensing a underfill at a position on an opposite side to the light-emitting element with respect to the two protrusions, allowing the dispensed underfill to flow toward the light-emitting element by a capillary action through the gap between the p- and n-electrodes of the circuit board while contacting the protrusions, and filling, by the capillary action, a gap between the circuit board and the light-emitting element with the underfill reaching a bottom of the light-emitting element.Type: GrantFiled: June 14, 2017Date of Patent: July 17, 2018Assignee: TOYODA GOSEI CO., LTD.Inventor: Takashi Nonogawa
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Publication number: 20180033926Abstract: A method of manufacturing a light-emitting device that includes a circuit board with p- and n-electrodes formed on a surface of a substrate and a light-emitting element connected to the p- and n-electrodes of the circuit board via a conductor member. The method includes forming two protrusions facing each other on both sides of a gap between the p- and n-electrodes of the circuit board, and dispensing a underfill at a position on an opposite side to the light-emitting element with respect to the two protrusions, allowing the dispensed underfill to flow toward the light-emitting element by a capillary action through the gap between the p- and n-electrodes of the circuit board while contacting the protrusions, and filling, by the capillary action, a gap between the circuit board and the light-emitting element with the underfill reaching a bottom of the light-emitting element.Type: ApplicationFiled: June 14, 2017Publication date: February 1, 2018Inventor: Takashi Nonogawa
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Patent number: 9379094Abstract: A light emitting device includes a substrate, a light-emitting diode chip mounted on the substrate, a Zener diode chip mounted next to the light-emitting diode chip on the substrate, a frame-like dam material formed on the substrate to surround the light-emitting diode chip and the Zener diode chip, and a light-reflective resin injected inside the dam material to coat side surfaces of the light-emitting diode chip and side surfaces and an upper surface of the Zener diode chip. A part of the frame-like dam material swells outward to surround three of the side surfaces of the Zener diode chip.Type: GrantFiled: February 6, 2015Date of Patent: June 28, 2016Assignee: TOYODA GOSEI CO., LTD.Inventors: Satoshi Wada, Kosei Fukui, Takashi Nonogawa
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Patent number: 9343618Abstract: A method of manufacturing a light-emitting device includes providing a case including an annular sidewall and an LED chip including a chip substrate and a crystal layer and mounted in a region surrounded by the sidewall of the case, and dripping a droplet of an electrically-charged phosphor-containing resin so as to fill a space between the sidewall and the LED chip. The droplet is attracted toward the sidewall by an electrostatic force during the dripping.Type: GrantFiled: February 12, 2014Date of Patent: May 17, 2016Assignee: TOYODA GOSEI CO., LTD.Inventors: Takashi Nonogawa, Takashi Terayama, Toshimasa Hayashi
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Publication number: 20150364657Abstract: A method of manufacturing a light-emitting device includes providing an LED chip mounted on a base substrate, and dripping a droplet of a phosphor-containing resin to cover the LED chip. The droplet is dot-printed on the base substrate and/or the LED chip by inkjet printing.Type: ApplicationFiled: May 28, 2015Publication date: December 17, 2015Inventors: Takashi NONOGAWA, Masakata KOSEKI, Kosei FUKUI, Toshimasa HAYASHI
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Patent number: 9184354Abstract: A light-emitting device includes a plurality of LED chips arranged in series and each including a chip substrate and a crystal layer including a light-emitting layer. One of the plurality of LED chips is configured such that the chip substrate thereof includes a side surface facing another adjacent LED chip of the plurality of LED chips. The side surface has a highest cleavability among all side surfaces of the chip substrate of the one of the plurality of LED chips.Type: GrantFiled: January 30, 2014Date of Patent: November 10, 2015Assignee: TOYODA GOSEI CO., LTD.Inventors: Kosei Fukui, Toshimasa Hayashi, Takashi Nonogawa, Takashi Terayama, Satoshi Wada
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Publication number: 20150262987Abstract: A light emitting device includes a substrate, a light-emitting diode chip mounted on the substrate, a Zener diode chip mounted next to the light-emitting diode chip on the substrate, a frame-like dam material formed on the substrate to surround the light-emitting diode chip and the Zener diode chip, and a light-reflective resin injected inside the dam material to coat side surfaces of the light-emitting diode chip and side surfaces and an upper surface of the Zener diode chip. A part of the frame-like dam material swells outward to surround three of the side surfaces of the Zener diode chip.Type: ApplicationFiled: February 6, 2015Publication date: September 17, 2015Inventors: Satoshi WADA, Kosei FUKUI, Takashi NONOGAWA
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Patent number: 9065023Abstract: The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the LED chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the LED chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator.Type: GrantFiled: December 16, 2013Date of Patent: June 23, 2015Assignee: Toyoda Gosei, Co., Ltd.Inventors: Satoshi Wada, Kosei Fukui, Toshimasa Hayashi, Takashi Nonogawa
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Publication number: 20140295591Abstract: A method of manufacturing a light-emitting device includes providing a case including an annular sidewall and an LED chip including a chip substrate and a crystal layer and mounted in a region surrounded by the sidewall of the case, and dripping a droplet of an electrically-charged phosphor-containing resin so as to fill a space between the sidewall and the LED chip. The droplet is attracted toward the sidewall by an electrostatic force during the dripping.Type: ApplicationFiled: February 12, 2014Publication date: October 2, 2014Applicant: TOYODA GOSEI CO., LTD.Inventors: Takashi NONOGAWA, Takashi TERAYAMA, Toshimasa HAYASHI
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Publication number: 20140231821Abstract: A light-emitting device includes a plurality of LED chips arranged in series and each including a chip substrate and a crystal layer including a light-emitting layer. One of the plurality of LED chips is configured such that the chip substrate thereof includes a side surface facing another adjacent LED chip of the plurality of LED chips. The side surface has a highest cleavability among all side surfaces of the chip substrate of the one of the plurality of LED chips.Type: ApplicationFiled: January 30, 2014Publication date: August 21, 2014Applicant: TOYODA GOSEI CO., LTD.Inventors: Kosei FUKUI, Toshimasa HAYASHI, Takashi NONOGAWA, Takashi TERAYAMA, Satoshi WADA
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Publication number: 20140167087Abstract: The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the LED chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the LED chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator.Type: ApplicationFiled: December 16, 2013Publication date: June 19, 2014Applicant: Toyoda Gosei Co., Ltd.Inventors: Satoshi Wada, Kosei Fukui, Toshimasa Hayashi, Takashi Nonogawa
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Patent number: 7989236Abstract: A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.Type: GrantFiled: December 22, 2008Date of Patent: August 2, 2011Assignees: Toyoda Gosei Co., Ltd., Sumita Optical Glass, Inc.Inventors: Seiji Yamaguchi, Takashi Nonogawa, Yoshinobu Suehiro, Hiroki Watanabe, Kazuya Aida
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Publication number: 20100230691Abstract: A ferrous-metal-alkaline-earth-metal mixed silicate based phosphor is used in form of a single component or a mixture as a light converter for a primarily visible and/or ultraviolet light emitting device. The phosphor has a rare earth element as an activator. The rare earth element is europium (Eu). Alternatively, the phosphor may have a coactivator formed of a rare earth element and at least one of Mn, Bi, Sn, and Sb.Type: ApplicationFiled: March 26, 2007Publication date: September 16, 2010Inventors: Mitsuhiro Inoue, Akio Namiki, Makoto Ishida, Takashi Nonogawa, Koichi Ota, Atsuo Hirano, Walter Tews, Gundula Roth, Stefan Tews
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Publication number: 20090186433Abstract: A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.Type: ApplicationFiled: December 22, 2008Publication date: July 23, 2009Applicants: TOYODA GOSEI CO., LTD., SUMITA OPTICAL GLASS, INC.Inventors: Seiji Yamaguchi, Takashi Nonogawa, Yoshinobu Suehiro, Hiroki Watanabe, Kazuya Aida