Patents by Inventor Takashi NUNOKAWA

Takashi NUNOKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11331054
    Abstract: A biological information measuring instrument performs high precision biological information measurement on a living body. The biological information measuring instrument includes: a measuring unit and an analysis unit that measure a user in a contactless manner to acquire biological information; and a speech unit that produces an alarm for reducing body movements of the user. The measuring unit and the analysis unit start to acquire biological information at an acquisition starting time. A control unit sets the acquisition starting time so as to fall in a prescribed range of time defined using an alarm starting time for the speech unit as a reference.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: May 17, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yoshihisa Adachi, Tetsuya Okumura, Takashi Nunokawa, Rieko Ogawa, Yuki Edo
  • Patent number: 11064895
    Abstract: Pulse waves of a living body are detected with high accuracy. A pulse wave detection device includes a camera configured to capture an image of the living body a plurality of times through a first green filter and an infrared light filter having light transmission characteristics in a near-infrared light wavelength range within a wavelength range where a light absorption coefficient of oxidized hemoglobin is greater than a light absorption coefficient of reduced hemoglobin, and an image analysis unit configured to analyze a plurality of images of the living body captured by the camera and to detect the pulse waves of the living body. The image analysis unit is configured to detect the pulse waves by detecting a change in intensity of light in the near-infrared light wavelength range indicated by the plurality of images.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: July 20, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Junya Onishi, Yoshihisa Adachi, Tetsuya Okumura, Takashi Nunokawa, Rieko Ogawa
  • Publication number: 20200054222
    Abstract: Pulse waves of a living body are detected with high accuracy. A pulse wave detection device includes a camera configured to capture an image of the living body a plurality of times through a first green filter and an infrared light filter having light transmission characteristics in a near-infrared light wavelength range within a wavelength range where a light absorption coefficient of oxidized hemoglobin is greater than a light absorption coefficient of reduced hemoglobin, and an image analysis unit configured to analyze a plurality of images of the living body captured by the camera and to detect the pulse waves of the living body. The image analysis unit is configured to detect the pulse waves by detecting a change in intensity of light in the near-infrared light wavelength range indicated by the plurality of images.
    Type: Application
    Filed: November 6, 2017
    Publication date: February 20, 2020
    Inventors: Junya ONISHI, Yoshihisa ADACHI, Tetsuya OKUMURA, Takashi NUNOKAWA, Rieko OGAWA
  • Publication number: 20200046301
    Abstract: A biological information measuring instrument performs high precision biological information measurement on a living body. The biological information measuring instrument includes: a measuring unit and an analysis unit that measure a user in a contactless manner to acquire biological information; and a speech unit that produces an alarm for reducing body movements of the user. The measuring unit and the analysis unit start to acquire biological information at an acquisition starting time. A control unit sets the acquisition starting time so as to fall in a prescribed range of time defined using an alarm starting time for the speech unit as a reference.
    Type: Application
    Filed: October 31, 2017
    Publication date: February 13, 2020
    Inventors: Yoshihisa ADACHI, Tetsuya OKUMURA, Takashi NUNOKAWA, Rieko OGAWA, Yuki EDO
  • Publication number: 20200006170
    Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface; a plurality of circuit parts mounted on the first surface; an electrode layer that is disposed on the second surface and includes a plurality of electrode portions to be electrically connected to the plurality of circuit parts, at least a part of the plurality of electrode portions including a base that is long in one axis direction; a rigid member that is disposed on the first surface, includes, at least one shaft portion, and faces the base with the dielectric layer sandwiched therebetween, the at least one shaft axis extending along the one axis direction; and a sealing layer that is provided on the first surface and covers the plurality of circuit parts and the rigid member.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 2, 2020
    Inventors: Takashi NUNOKAWA, Yuichi SASAJIMA, Takayuki TAKANO
  • Publication number: 20200006255
    Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface, the first surface including a first mounting area and a second mounting area; a plurality of circuit parts that includes a first circuit part and a second circuit part, the first circuit part being mounted on the first mounting area, the second circuit part being mounted on the second mounting area; an electrode layer that is disposed on the second surface and includes a plurality of electrode portions to be electrically connected to the plurality of circuit parts; and a sealing layer that includes a first sealing resin portion and a second sealing resin portion and seals the plurality of circuit parts, the first sealing resin portion covering the first mounting area, the second sealing resin portion being formed of a resin material softer than the first sealing resin portion and covering the second mounting area.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 2, 2020
    Inventors: Takashi NUNOKAWA, Takayuki TAKANO