Patents by Inventor Takashi Oda

Takashi Oda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200086776
    Abstract: A locking block is fixed with respect to a seat cushion. A locking pin which can advance and retract relative to the locking block is provided on a main frame side. A V groove shape receptacle is formed on the locking block. When the locking pin is advanced into the receptacle portion, the locking pin is guided by a receiving inclined surface of the receptacle portion forming the V-shape groove, and advances to a bottom of the receptacle portion. With this process, the locking block moves in a rotational direction B, and when the locking pin engages the bottom, the seat cushion is fixed.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 19, 2020
    Inventors: Tetsuya Nagai, Takashi Sugimoto, Osamu Oda, Kohshi Katoh, Akira Takinami, Masatoshi Hada
  • Patent number: 10589306
    Abstract: A control unit for an aerosol generating device includes: a sensor that outputs a value related to a temperature of a power source capable of being charged and discharged to a load for atomizing an aerosol source; and a controller configured to execute one or more functions of operating the power source when an output value of the sensor is within a first range having at least one of a first upper limit and a first lower limit. The first upper limit or the first lower limit is smaller or larger than a second upper limit or a second lower limit of a second range that is a range of a value related to a temperature at which the one or more functions can be executed, a range of a value related to a temperature at which deterioration of the power source is suppressed, a range of a value related to a temperature at which the power source deteriorates due only to a factor that is the same as normal temperature, or a range corresponding to an operating temperature of the power source.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: March 17, 2020
    Assignee: JAPAN TOBACCO INC.
    Inventors: Takashi Oda, Hiroshi Okuno, Takeshi Akao, Hajime Fujita
  • Publication number: 20200015770
    Abstract: Disclosed is a technique capable of enhancing usability of a radiographic image capturing apparatus, system, control method of the radiographic image capturing apparatus and a non-transitory computer readable recording medium recorded with a control program, for a user. A radiographic image capturing apparatus includes: an I/F unit and an imaging control unit that function as a communication unit that selectively performs communication with any one of a portable information terminal and a console which are plural control apparatuses that have different image processing capacities with respect to a radiographic image and respectively perform a control relating to capturing of the radiographic image; and an imaging control unit that functions as a selection unit that selects any one of plural imaging modes predetermined with respect to the capturing of the radiographic image according to the image processing capacity of the control apparatus that performs communication with the communication unit.
    Type: Application
    Filed: September 25, 2019
    Publication date: January 16, 2020
    Inventors: Yasufumi ODA, Jun Enomoto, Ryo Imamura, Takashi Tajima, Takeshi Koishi, Kentaro Noma, Takeshi Kuwabara, Tetsuya Tsuji, Hiroaki Yasuda, Harusayu Nakatsugawa
  • Publication number: 20200014246
    Abstract: A wireless power transmission system includes a power-supplying device including an electronic oscillator that generates electric power having a frequency of 1 MHz or more and 5 MHz or less, and a power-supplying coil member in which the electric power flows; and a power-receiving device including a power-receiving coil member that is capable of generating electric power based on the magnetic field generating from the power-supplying coil member, wherein the power-receiving coil member is a sheet coil including an insulating layer and a first coil pattern disposed at one side of the insulating layer, the first coil pattern is composed of wires, and the wires are disposed in spaced apart relation from each other with a predetermined space provided therebetween in the radial direction of the first coil pattern.
    Type: Application
    Filed: March 28, 2018
    Publication date: January 9, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Taiki SUEYOSHI, Masami INOUE, Hisashi TSUDA, Takashi ODA, Kaoru ITO, Hideshi YAMAKAWA, Daigo TSUBAI, Toru MIZUTANI, Yasuyuki OTA
  • Publication number: 20200013748
    Abstract: There is provided a bonding wire for a semiconductor device including a coating layer having Pd as a main component on a surface of a Cu alloy core material and a skin alloy layer containing Au and Pd on a surface of the coating layer, the bonding wire further improving 2nd bondability on a Pd-plated lead frame and achieving excellent ball bondability even in a high-humidity heating condition. The bonding wire for a semiconductor device including the coating layer having Pd as a main component on the surface of the Cu alloy core material and the skin alloy layer containing Au and Pd on the surface of the coating layer has a Cu concentration of 1 to 10 at % at an outermost surface thereof and has the core material containing either or both of Pd and Pt in a total amount of 0.1 to 3.0% by mass, thereby achieving improvement in the 2nd bondability and excellent ball bondability in the high-humidity heating condition.
    Type: Application
    Filed: September 19, 2019
    Publication date: January 9, 2020
    Inventors: Takashi YAMADA, Daizo ODA, Ryo OISHI, Tomohiro UNO
  • Publication number: 20200013747
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.
    Type: Application
    Filed: September 17, 2019
    Publication date: January 9, 2020
    Inventors: Takashi YAMADA, Daizo ODA, Teruo HAIBARA, Tomohiro UNO
  • Patent number: 10525555
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 ?m provides a strength ratio of 1.6 or less.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: January 7, 2020
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo Oishi, Kazuyuki Saito, Tomohiro Uno
  • Patent number: 10529683
    Abstract: A bonding wire for a semiconductor device, which is suitable for on-vehicle devices bonding wire, has excellent capillary wear resistance and surface flaw resistance while ensuring high bonding reliability and further satisfies overall performance including ball formability and wedge bondability, the bonding wire including: a Cu alloy core material; a Pd coating layer formed on a surface of the Cu alloy core material; and a Cu surface layer formed on a surface of the Pd coating layer, in which the bonding wire for semiconductor device contains Ni, a concentration of the Ni in the bonding wire is 0.1 to 1.2 wt. %, the Pd coating layer is 0.015 to 0.150 ?m in thickness, and the Cu surface layer is 0.0005 to 0.0070 ?m in thickness.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: January 7, 2020
    Assignees: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Tetsuya Oyamada, Tomohiro Uno, Daizo Oda, Takashi Yamada
  • Publication number: 20190381750
    Abstract: A carbon fiber-reinforced resin molded body of the present invention derives from kneaded materials of a thermoplastic resin and a carbon fiber and includes at least a three-dimensional complex shaped region and a substantially flat plate-shaped region arranged in a profile direction. Fluidity of the kneaded materials at predetermined temperature is such that fluidity of the kneaded material forming the substantially flat plate-shaped region is lower than fluidity of the kneaded material forming the three-dimensional complex shaped region, which makes it unlikely to cause defects in ribs, posses, and other portions. Thus, a carbon fiber-reinforced resin molded body with low cost and high strength can be provided.
    Type: Application
    Filed: March 1, 2017
    Publication date: December 19, 2019
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Takashi ODA, Katsumi MOROHOSHI
  • Publication number: 20190376409
    Abstract: An inlet guide vane includes: a movable vane that has a vane main body and a shaft portion disposed in an end portion of the vane main body; a frame that has an insertion hole into which the shaft portion is to be inserted; a plurality of bearing portions that are arranged inside the insertion hole at an interval in a direction of a central axis of the shaft portion and that support the shaft portion to be rotatable around the central axis with respect to the frame; and a seal portion that is located inside the insertion hole between the plurality of bearing portions in the direction of the central axis and that seals an area between the insertion hole and the shaft portion.
    Type: Application
    Filed: February 6, 2017
    Publication date: December 12, 2019
    Applicant: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION
    Inventor: Takashi Oda
  • Patent number: 10497663
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: December 3, 2019
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Tomohiro Uno
  • Patent number: 10485506
    Abstract: Disclosed is a technique capable of enhancing usability of a radiographic image capturing apparatus, system, control method of the radiographic image capturing apparatus and a non-transitory computer readable recording medium recorded with a control program, for a user. A radiographic image capturing apparatus includes: an I/F unit and an imaging control unit that function as a communication unit that selectively performs communication with any one of a portable information terminal and a console which are plural control apparatuses that have different image processing capacities with respect to a radiographic image and respectively perform a control relating to capturing of the radiographic image; and an imaging control unit that functions as a selection unit that selects any one of plural imaging modes predetermined with respect to the capturing of the radiographic image according to the image processing capacity of the control apparatus that performs communication with the communication unit.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: November 26, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Yasufumi Oda, Jun Enomoto, Ryou Imamura, Takashi Tajima, Kentaro Noma, Takeshi Kuwabara, Tetsuya Tsuji, Hiroaki Yasuda, Haruyasu Nakatsugawa, Takeshi Koishi
  • Patent number: 10468370
    Abstract: There is provided a bonding wire for a semiconductor device including a coating layer having Pd as a main component on a surface of a Cu alloy core material and a skin alloy layer containing Au and Pd on a surface of the coating layer, the bonding wire further improving 2nd bondability on a Pd-plated lead frame and achieving excellent ball bondability even in a high-humidity heating condition. The bonding wire for a semiconductor device including the coating layer having Pd as a main component on the surface of the Cu alloy core material and the skin alloy layer containing Au and Pd on the surface of the coating layer has a Cu concentration of 1 to 10 at % at an outermost surface thereof and has the core material containing either or both of Pd and Pt in a total amount of 0.1 to 3.0% by mass, thereby achieving improvement in the 2nd bondability and excellent ball bondability in the high-humidity heating condition.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: November 5, 2019
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Ryo Oishi, Tomohiro Uno
  • Patent number: 10461055
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: October 29, 2019
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Tomohiro Uno
  • Publication number: 20190326246
    Abstract: The present invention provides a bonding wire for a semiconductor device suitable for cutting-edge high-density LSIs and on-vehicle LSIs by improving the formation rate of Cu—Al IMC in ball bonds. A bonding wire for a semiconductor device contains Pt of 0.1 mass % to 1.3 mass %, at least one dopant selected from a first dopant group consisting of In, Ga, and Ge, for a total of 0.05 mass % to 1.25 mass %, and a balance being made up of Cu and incidental impurities.
    Type: Application
    Filed: February 14, 2018
    Publication date: October 24, 2019
    Applicants: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Tetsuya OYAMADA, Tomohiro UNO, Takashi YAMADA, Daizo ODA, Motoki ETO
  • Publication number: 20190305091
    Abstract: A crystalline oxide semiconductor film with an enhanced electrical property is provided. By use of a mist CVD apparatus, a crystalline oxide semiconductor film with a corundum structure and a principal plane that is an a-plane or an m-plane was obtained on a crystalline substrate by atomizing a raw-material solution containing a dopant that is an n-type dopant to obtain atomized droplets, carrying the atomized droplets by carrier gas onto the crystalline substrate that is an a-plane corundum-structured crystalline substrate or an m-plane corundum-structured crystalline substrate placed in a film-formation chamber, and the atomized droplets were thermally reacted to form the crystalline oxide semiconductor film on the crystalline substrate.
    Type: Application
    Filed: November 7, 2017
    Publication date: October 3, 2019
    Inventors: Isao TAKAHASHI, Takashi SHINOHE, Rie TOKUDA, Masaya ODA, Toshimi HITORA
  • Patent number: 10414002
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 ?m provides a strength ratio of 1.6 or less.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: September 17, 2019
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo Oishi, Kazuyuki Saito, Tomohiro Uno
  • Publication number: 20190256657
    Abstract: There is provided an epoxy composition which has difficulty in precipitating a crystal during storage, is homogeneous and can be stored for a long period; and a cured product of the composition having excellent transparency, heat resistance, and light resistance can be obtained on curing. An ?-type tris-(2,3-epoxypropyl)-isocyanurate crystal including ?-type tris-(2,3-epoxypropyl)-isocyanurate in the crystal in a ratio of 2% by mass to 15% by mass. A method for producing the ?-type tris-(2,3-epoxypropyl)-isocyanurate crystal including step (i) separating ?-type tris-(2,3-epoxypropyl)-isocyanurate contained in a tris-(2,3-epoxypropyl)-isocyanurate solution from the solution as a solid to obtain a crystal with an increased content ratio of ?-type tris-(2,3-epoxypropyl)-isocyanurate.
    Type: Application
    Filed: May 3, 2019
    Publication date: August 22, 2019
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Motohiko HIDAKA, Takashi ODA, Nobuyuki KAKIUCHI, Hiroki YAMAGUCHI
  • Patent number: 10364820
    Abstract: A compressor includes a casing having an upper half casing and a lower half casing and a tubular shape with both ends open, a bundle including annular heads respectively fixed on both sides in an axial direction with respect to a plurality of diaphragms and closing openings of the casing, a communication clearance seal portion sealing a communication clearance extending in the axial direction between the outer peripheral surface of the diaphragm and the inner peripheral surface of the casing such that a suction opening and a discharge opening communicate with each other, and a regulating portion regulating the position of the head in the axial direction with respect to the casing.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: July 30, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION
    Inventors: Takashi Oda, Hitoshi Shinohara
  • Publication number: 20190195284
    Abstract: A journal bearing is provided that supports a rotating shaft to be rotatable around a central axis and includes: a bearing main body that has a sliding contact surface that is in sliding contact with the rotating shaft, an outer circumferential surface that is directed outward in the radial direction to face a side opposite to the sliding contact surface, a recess that is recessed from an outer circumferential surface of the bearing main body inward in the radial direction, and a groove that continuously extends from the recess; a sensor main body that is housed in the recess; and a sensor wiring whose one end is connected to the sensor main body and in which a part thereof in a length direction is housed in the groove.
    Type: Application
    Filed: November 16, 2018
    Publication date: June 27, 2019
    Applicant: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION
    Inventor: Takashi Oda