Patents by Inventor Takashi Ohta
Takashi Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20050023767Abstract: On a radially inner surface of a sealing lip of an oil seal, radiation ray is irradiated to induce chemical reaction in the materials of the sealing lip, to form hard helical portions. The hard helical portions act like a helical groove or rib to pump oil back to oil-side to show an excellent sealing property when there is a relative rotational movement between the sealing lip and a shaft to be sealed, as well as even static sealing ability at the time there is no relative rotative movement.Type: ApplicationFiled: August 31, 2004Publication date: February 3, 2005Inventors: Takashi Ohta, Hironori Minagawa
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Patent number: 6814919Abstract: A radially inner surface of a sealing lip of an oil seal, is irradiated to induce a chemical reaction in the material of the sealing lip, to form hard helical portions. The hard helical portions act like a helical groove or rib to pump oil back to an oil-side for excellent sealing properties when there is a relative rotational movement between the sealing lip and a shaft to sealed, as well as a static sealing ability at the time there is no relative rotation movement.Type: GrantFiled: October 19, 2001Date of Patent: November 9, 2004Assignee: NOK CorporationInventors: Takashi Ohta, Hironori Minagawa
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Publication number: 20040168841Abstract: There is provided a hybrid car which includes an internal combustion engine; an electric motor disposed coaxially with a rotary shaft of the internal combustion engine; a planetary gear mechanism which is disposed coaxially with the rotary shaft of the internal combustion engine and the rotary shaft of the electric motor, and is comprised of a sun gear, a ring gear, planetary pinions, and a carrier supporting the planetary pinions; a transmission comprising an input shaft to which power is transmitted from said internal combustion engine and said electric motor via said planetary gear mechanism and an output shaft connected to driving wheels; and a rotation restricting device that properly restricts rotation of a rotor of the electric motor.Type: ApplicationFiled: February 12, 2004Publication date: September 2, 2004Inventors: Takashi Ohta, Yuji Suzuki, Kazuchika Tashima, Keiichi Kaneshige, Hatsuki Morinaga
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Publication number: 20040135976Abstract: In a projection-type display apparatus that directs light from a light source through the illumination optical system to a display panel so that an image displayed on the display panel illuminated by the light directed thereto is projected through a projection optical system onto a screen, an illumination optical system is used that has a light intensity uniformizing device of which the entrance surface is located at a first conjugate position substantially conjugate with the light source and of which the exit surface has a shape geometrically similar to the panel surface of the display panel and a reflection optical system for forming an image of the exit surface of the light intensity uniformizing device on the panel surface of the display panel. In the reflection optical system, every surface having an optical power is a reflective surface.Type: ApplicationFiled: October 20, 2003Publication date: July 15, 2004Inventors: Jun Ishihara, Yasumasa Sawai, Takashi Ohta
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Publication number: 20040129758Abstract: A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.Type: ApplicationFiled: December 19, 2003Publication date: July 8, 2004Applicant: Fujitsu Ten LimitedInventors: Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Toshimasa Akamatsu, Katsufumi Morimune
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Publication number: 20040123457Abstract: By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.Type: ApplicationFiled: October 9, 2003Publication date: July 1, 2004Applicants: FUJITSU TEN LIMITED, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takashi Ohta, Kazuaki Yamada, Kiyoshi Tsujii, Hidekazu Manabe
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Patent number: 6740814Abstract: A wiring connection method includes the steps of connecting a bus bar for wiring inside an electronic apparatus and a harness for leading out wiring to outside, placing the bus bar and the harness connected together on a notch portion of a housing, and filling a resin to fix the harness in the notch portion of the housing.Type: GrantFiled: June 10, 2002Date of Patent: May 25, 2004Assignee: Fujitsu Ten LimitedInventors: Takashi Ohta, Hiroshi Moriguchi
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Patent number: 6738487Abstract: Obtaining a satisfactory feeling of mounting an earphone regardless of the user and achieving listening to reproduced acoustics with satisfactory sound quality is provided by an elastic auricle-mounting member surrounding a sound-discharging opening formed on a housing that accommodates a speaker unit. A space formed by the eardrum membrane, the speaker unit and the auricle-mounting member when a user wears the earphone on the auricle is communicated to the outside of the earphone via a ventilation resistor. Thus, it is possible to prevent deterioration in the sound quality attributable to pooled indistinct sound generated when the space encircled by the eardrum membrane, the speaker unit and the auricle-mounting member has been sealed.Type: GrantFiled: May 31, 2000Date of Patent: May 18, 2004Assignee: Sony CorporationInventors: Koji Nageno, Hideki Seki, Naotaka Tsunoda, Takashi Ohta
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Publication number: 20040087192Abstract: A wiring connection method includes the steps of connecting a bus bar for wiring inside an electronic apparatus and a harness for leading out wiring to outside, placing the bus bar and the harness connected together on a botch portion of a housing, and filling a resin to fix the harness in the notch portion of the housing.Type: ApplicationFiled: June 25, 2003Publication date: May 6, 2004Applicant: Fujitsu Ten LimitedInventors: Takashi Ohta, Hiroshi Moriguchi
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Patent number: 6708862Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr;1, so that it is possible to suppress the occurrence of bubbles in the solder.Type: GrantFiled: July 31, 2002Date of Patent: March 23, 2004Assignee: Fujitsu Ten LimitedInventors: Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Toshimasa Akamatsu, Katsufumi Morimune
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Publication number: 20030086246Abstract: An electronic control unit 31 for mounting on a vehicle include a control portion 32 and a power portion 33 which are separate from each other, and are combined together. A control board 40 is mounted on a control connector-incorporating casing 34, having control connectors 35 and 36 formed integrally thereon, thereby forming the control portion 32. Connection terminals 41 on the control board 40 are soldered to connector connection terminals 37 and 38, embedded in the casing 34, and connection terminals 42 on the control board 40 are soldered to relay connection terminals 39 embedded in the casing 34. Power parts 57 and 58 are mounted on a power connector-incorporating casing 54, having power connectors 55 and 56 formed integrally thereon, and further a heatsink is mounted on the casing 54, thereby forming the power portion 33. An intermediate layer 51 can be provided between the control portion 32 and the power portion 33. Parts can be mounted on the intermediate layer 51.Type: ApplicationFiled: December 6, 2002Publication date: May 8, 2003Applicant: Fujitsu Ten LimitedInventors: Hiroyuki Wakabayashi, Takashi Ohta
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Patent number: 6560346Abstract: A microphone device having a tube made of an elastic material and a flexible core member having a shape-retaining property located inside the tube.Type: GrantFiled: August 30, 2001Date of Patent: May 6, 2003Assignee: Sony CorporationInventors: Takashi Ohta, Katsunori Murozaki, Koji Nageno
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Patent number: 6560115Abstract: An electronic control unit 31 for mounting on a vehicle include a control portion 32 and a power portion 33 which are separate from each other, and are combined together. A control board 40 is mounted on a control connector-incorporating casing 34, having control connectors 35 and 36 formed integrally thereon, thereby Forming the control portion 32. Connection terminals 41 on the control board 40 are soldered to connector connection terminals 37 and 38, embedded in the casing 34, and connection terminals 42 on the control board 40 are soldered to relay connection terminals 39 embedded in the casing 34. Power parts 57 and 58 are mounted on a power connector-incorporating casing 54, having power connectors 55 and 56 formed Integrally thereon, and further a heatsink is mounted on the casing 54, thereby forming the power portion 33. An intermediate layer 51 can be provided between the control portion 32 and the power portion 33. Parts can be mounted on the intermediate layer 51.Type: GrantFiled: May 10, 2000Date of Patent: May 6, 2003Assignee: Fujitsu Ten LimitedInventors: Hiroyuki Wakabayashi, Takashi Ohta
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Publication number: 20030078724Abstract: The present invention was achieved in order to provide an image display whereby one can extremely easily know the current position of one's own and also grasp the actual situation around the current position, and with which the user gets highly satisfied, having a display device to display a photo picture v1 on a prescribed reduced scale prepared based on photo data on a scale s1 read from a storage device in which photo data of two or more types on different scales to one area is stored, and a display switching device to conduct display switching to a photo picture v2 on another reduced scale prepared based on photo data on another scale s2 different from the scale s1 with a user's command.Type: ApplicationFiled: October 18, 2002Publication date: April 24, 2003Inventors: Noriyuki Kamikawa, Yasuo Matsumoto, Takashi Ohta, Takao Yamaguchi, Shoji Fujimoto, Hiroshi Takeuchi
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Publication number: 20030024963Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr; 1, so that it is possible to suppress the occurrence of bubbles in the solder.Type: ApplicationFiled: July 31, 2002Publication date: February 6, 2003Applicant: FUJITSU TEN LIMITEDInventors: Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Toshimasa Akamatsu, Katsufumi Morimune
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Publication number: 20020189840Abstract: A wiring connection method includes the steps of connecting a bus bar for wiring inside an electronic apparatus and a harness for leading out wiring to outside, placing the bus bar and the harness connected together on a notch portion of a housing, and filling a resin to fix the harness in the notch portion of the housing.Type: ApplicationFiled: June 10, 2002Publication date: December 19, 2002Applicant: FUJITSU TEN LIMITEDInventors: Takashi Ohta, Hiroshi Moriguchi
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Publication number: 20020043770Abstract: On a radially inner surface of a sealing lip of an oil seal, radiation ray is irradiated to induce chemical reaction in the materials of the sealing lip, to form hard helical portions. The hard helical portions act like a helical groove or rib to pump oil back to oil-side to show an excellent sealing property when there is a relative rotational movement between the sealing lip and a shaft to be sealed, as well as even static sealing ability at the time there is no relative rotative movement.Type: ApplicationFiled: October 19, 2001Publication date: April 18, 2002Applicant: NOK CorporationInventors: Takashi Ohta, Hironori Minagawa
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Publication number: 20020044670Abstract: In the pipe microphone device having such a construction, the pipe is made of an elastic material, and a flexible core member (wire) having a shape retaining property is passed in the inside.Type: ApplicationFiled: August 30, 2001Publication date: April 18, 2002Inventors: Takashi Ohta, Katsunori Murozaki, Koji Nageno
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Patent number: 6334618Abstract: On a radially inner surface of a sealing lip of an oil seal, radiation ray is irradiated to induce chemical reaction in the materials of the sealing lip, to form hard helical portions. The hard helical portions act like a helical groove or rib to pump oil back to oil-side to show an excellent sealing property when there is a relative rotational movement between the sealing lip and a shaft to be sealed, as well as even static sealing ability at the time there is no relative rotative movement.Type: GrantFiled: March 23, 1999Date of Patent: January 1, 2002Assignee: NOK CorporationInventors: Takashi Ohta, Hironori Minagawa
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Patent number: 6331879Abstract: A liquid crystal projector includes an illumination optical system provided with a light source, first and second lens arrays arranged in this order from the light source, a liquid crystal panel, and a polarization changing optical system arranged between the first and second lens arrays. This makes it possible to install the polarization changing optical system and the optical integrator in a smaller space.Type: GrantFiled: November 18, 1996Date of Patent: December 18, 2001Assignee: Minolta Co., Ltd.Inventors: Yasumasa Sawai, Takashi Ohta, Nobuo Mushiake, Hideki Nagata, Soh Ohzawa