Patents by Inventor Takashi OINOUE

Takashi OINOUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200083262
    Abstract: The present technology relates to a solid-state image sensing device and an electronic device for reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 12, 2020
    Inventors: HIROSHI TAYANAKA, KENTARO AKIYAMA, YORITO SAKANO, TAKASHI OINOUE, YOSHIYA HAGIMOTO, YUSUKE MATSUMURA, NAOYUKI SATO, YUKI MIYANAMI, YOICHI UEDA, RYOSUKE MATSUMOTO
  • Publication number: 20200049959
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 10, 2019
    Publication date: February 13, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Patent number: 10515988
    Abstract: The present technology relates to a solid-state image sensing device and an electronic device capable of reducing noises. The solid-state image sensing device includes a photoelectric conversion unit, a charge holding unit for holding charges transferred from the photoelectric conversion unit, a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit, and a light blocking part including a first light blocking part and a second light blocking part. The first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: December 24, 2019
    Assignee: SONY CORPORATION
    Inventors: Hiroshi Tayanaka, Kentaro Akiyama, Yorito Sakano, Takashi Oinoue, Yoshiya Hagimoto, Yusuke Matsumura, Naoyuki Sato, Yuki Miyanami, Yoichi Ueda, Ryosuke Matsumoto
  • Patent number: 10379323
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: August 13, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke Moriya, Masanori Iwasaki, Takashi Oinoue, Yoshiya Hagimoto, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Publication number: 20180259749
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 15, 2016
    Publication date: September 13, 2018
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Patent number: 10070086
    Abstract: The present disclosure relates to a solid-state imaging device capable of receiving light entering a gap between pixel regions of imaging units by the pixel region when a plurality of imaging units is arranged, a method of manufacturing the same, and an electronic device. A CMOS image sensor includes a pixel region formed of a plurality of pixels. A convex lens is provided for each of a plurality of CMOS image sensors. A plurality of CMOS image sensors is arranged on a supporting substrate. The present disclosure is applicable to a solid-state imaging device and the like in which a plurality of CMOS image sensors is arranged on the supporting substrate, for example.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: September 4, 2018
    Assignee: Sony Corporation
    Inventor: Takashi Oinoue
  • Publication number: 20180197906
    Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
    Type: Application
    Filed: July 19, 2016
    Publication date: July 12, 2018
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masanari YAMAGUCHI, Taizo TAKACHI, Shunsuke FURUSE, Takashi OINOUE, Yuki IKEBE
  • Publication number: 20180114807
    Abstract: This technology relates to a solid-state imaging device and an electronic apparatus by which image quality can be enhanced. The solid-state imaging device includes a pixel region in which a plurality of pixels are arranged, a first wiring, a second wiring, and a shield layer. The second wiring is formed in a layer lower than that of the first wiring, and the shield layer is formed in a layer lower at least than that of the first wiring. This technology is applicable to a CMOS image sensor, for example.
    Type: Application
    Filed: March 11, 2016
    Publication date: April 26, 2018
    Applicant: Sony Corporation
    Inventors: HAJIME YAMAGISHI, KIYOTAKA TABUCHI, MASAKI OKAMOTO, TAKASHI OINOUE, MINORU ISHIDA, SHOTA HIDA, KAZUTAKA YAMANE
  • Publication number: 20180033809
    Abstract: The present technology relates to a solid-state image sensing device and an electronic device capable of reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.
    Type: Application
    Filed: February 12, 2016
    Publication date: February 1, 2018
    Inventors: Hiroshi TAYANAKA, Kentaro AKIYAMA, Yorito SAKANO, Takashi OINOUE, Yoshiya HAGIMOTO, Yusuke MATSUMURA, Naoyuki SATO, Yuki MIYANAMI, Yoichi UEDA, Ryosuke MATSUMOTO
  • Publication number: 20170359541
    Abstract: The present disclosure relates to a solid-state imaging device capable of receiving light entering a gap between pixel regions of imaging units by the pixel region when a plurality of imaging units is arranged, a method of manufacturing the same, and an electronic device. A CMOS image sensor includes a pixel region formed of a plurality of pixels. A convex lens is provided for each of a plurality of CMOS image sensors. A plurality of CMOS image sensors is arranged on a supporting substrate. The present disclosure is applicable to a solid-state imaging device and the like in which a plurality of CMOS image sensors is arranged on the supporting substrate, for example.
    Type: Application
    Filed: October 29, 2015
    Publication date: December 14, 2017
    Inventor: Takashi OINOUE
  • Publication number: 20170263665
    Abstract: A semiconductor device includes a first semiconductor substrate in which a pixel region where pixel portions performing photoelectric conversion are two-dimensionally arranged is formed and a second semiconductor substrate in which a logic circuit processing a pixel signal output from the pixel portion is formed, the first and second semiconductor substrates being laminated. A protective substrate protecting an on-chip lens is disposed on the on-chip lens in the pixel region of the first semiconductor substrate with a sealing resin interposed therebetween.
    Type: Application
    Filed: May 23, 2017
    Publication date: September 14, 2017
    Inventors: Naoki KOMAI, Naoto SASAKI, Naoki OGAWA, Takashi OINOUE, Hayato IWAMOTO, Yutaka OOKA, Masaya NAGATA
  • Publication number: 20160284753
    Abstract: A semiconductor device includes a first semiconductor substrate (12) in which a pixel region (21) where pixel portions (51) performing photoelectric conversion are two-dimensionally arranged is formed and a second semiconductor substrate (11) in which a logic circuit processing a pixel signal output from the pixel portion is formed, the first and second semiconductor substrates being laminated. A protective substrate (18) protecting an on-chip lens (16) is disposed on the on-chip lens in the pixel region of the first semiconductor substrate with a sealing resin (17) interposed therebetween.
    Type: Application
    Filed: December 12, 2014
    Publication date: September 29, 2016
    Inventors: Naoki KOMAI, Naoto SASAKI, Naoki OGAWA, Takashi OINOUE, Hayato IWAMOTO, Yutaka OOKA, Masaya NAGATA