Patents by Inventor Takashi Onaga

Takashi Onaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8609009
    Abstract: A method of producing a microproduct comprises: providing a resin composition including 30 to 90 wt % of a polypropylene-based resin and 10 to 70 wt % of a hydrogenated derivative of a block copolymer shown by “X-Y” (X represents a polymer block immiscible with the polypropylene-based resin, Y represents an elastomeric polymer block of a conjugated diene that's miscible with the polypropylene-based resin after hydrogenation); attaching a silicon stamper to a mold cavity of an injection molding machine, the silicon stamper having micromachined features formed by etching the surface of a silicon plate; and precisely transferring the micromachined features of the silicon stamper to the resin composition by injecting the resin composition into the mold cavity, a resulting molded surface having recesses and/or protrusions that are 0.3 to 200 ?m deep or tall and 0.3 to 100 ?m wide.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: December 17, 2013
    Assignees: Richell Co., Ltd., Toyama Prefecture, National University Corporation Toyama University
    Inventors: Kazuyuki Yamashita, Takashi Onaga, Satoshi Fujiki, Hideki Morimoto, Tutomu Obata, Masayasu Suzuki
  • Patent number: 7897245
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: March 1, 2011
    Assignees: Richell Corporation, Toyama Prefecture
    Inventors: Kazuyuki Yamashita, Mieko Omotani, Takashi Onaga, Kiyokazu Himi
  • Publication number: 20100123273
    Abstract: A method of producing a microproduct comprises: providing a resin composition including 30 to 90 wt % of a polypropylene-based resin and 10 to 70 wt % of a hydrogenated derivative of a block copolymer shown by “X-Y” (X represents a polymer block immiscible with the polypropylene-based resin, Y represents an elastomeric polymer block of a conjugated diene that's miscible with the polypropylene-based resin after hydrogenation); attaching a silicon stamper to a mold cavity of an injection molding machine, the silicon stamper having micromachined features formed by etching the surface of a silicon plate; and precisely transferring the micromachined features of the silicon stamper to the resin composition by injecting the resin composition into the mold cavity, a resulting molded surface having recesses and/or protrusions that are 0.3 to 200 ?m deep or tall and 0.3 to 100 ?m wide.
    Type: Application
    Filed: January 27, 2010
    Publication date: May 20, 2010
    Applicants: RICHELL CO., LTD., TOYAMA PREFECTURE, NATIONAL UNIVERSITY CORPORATION TOYAMA UNIVERSITY
    Inventors: Kazuyuki YAMASHITA, Takashi ONAGA, Satoshi FUJIKI, Hideki MORIMOTO, Tutomu OBATA, Masayasu SUZUKI
  • Publication number: 20090252928
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Application
    Filed: June 15, 2009
    Publication date: October 8, 2009
    Applicants: Richell Corporation, Toyama Prefecture
    Inventors: Kazuyuki YAMASHITA, Mieko OMOTANI, Takashi ONAGA, Kiyokazu HIMI
  • Patent number: 7566503
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: July 28, 2009
    Assignees: Richell Corporation, Toyama Prefecture
    Inventors: Kazuyuki Yamashita, Mieko Omotani, Takashi Onaga, Kiyokazu Himi
  • Publication number: 20070196674
    Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.
    Type: Application
    Filed: March 16, 2007
    Publication date: August 23, 2007
    Inventors: Kazuyuki Yamashita, Mieko Omotani, Takashi Onaga, Kiyokazu Himi
  • Publication number: 20060127282
    Abstract: A microproduct includes a resin composition including a polypropylene-based resin and a hydrogenated derivative of a block copolymer shown by the general formula “X-Y”. The microproduct has micromachined features of a stamper precisely transferred by injection molding and a molded surface has a plurality of recesses and/or protrusions. In this case, X represents a polymer block immiscible with the polypropylene-based resin, and Y represents an elastomeric polymer block of a conjugated diene.
    Type: Application
    Filed: November 10, 2005
    Publication date: June 15, 2006
    Inventors: Kazuyuki Yamashita, Takashi Onaga, Satoshi Fujiki, Hideki Morimoto, Tutomu Obata, Masayasu Suzuki