Abstract: A fixing plate includes a first region and a second region. A vibrator assembly includes a plurality of piezoelectric vibrators, a drive electrode formed on each of the piezoelectric vibrators, and a common electrode formed commonly to the piezoelectric vibrators. The vibrator assembly is bonded onto the first region in a cantilevered manner. A sheet-shaped wiring board supplies a drive signal to the drive electrode and applies a bias potential which is higher than a ground potential to the common electrode. A controller IC controls the drive signal. The controller IC has a first face mounted on the wiring board, and a second face opposing to the first face in which a semiconductor surface is exposed. An insulating layer is interposed between the second region of the fixing plate and the second face of the controller IC.

Abstract: A fixing plate includes a first region and a second region. A vibrator assembly includes a plurality of piezoelectric vibrators, a drive electrode formed on each of the piezoelectric vibrators, and a common electrode formed commonly to the piezoelectric vibrators. The vibrator assembly is bonded onto the first region in a cantilevered manner. A sheet-shaped wiring board supplies a drive signal to the drive electrode and applies a bias potential which is higher than a ground potential to the common electrode. A controller IC controls the drive signal. The controller IC has a first face mounted on the wiring board, and a second face opposing to the first face in which a semiconductor surface is exposed. An insulating layer is interposed between the second region of the fixing plate and the second face of the controller IC.