Abstract: A fiber for artificial hair with low thermal shrinkage, low luster, and excellent spinnability, structured by a resin composition containing a vinyl chloride-based resin and a maleimide-based copolymer, wherein: 50 to 99 mass % of the vinyl chloride-based resin is contained in 100 mass % of the resin composition; 1 to 50 mass % of the maleimide-based copolymer is contained in 100% of the resin composition; and when a total of an aromatic vinyl-based monomer unit, a cyanide vinyl-based monomer unit, an unsaturated acid anhydride monomer unit, and a maleimide-based monomer unit in the maleimide-based copolymer is 100 mass %, the maleimide-based copolymer has 5 to 30 mass % of the maleimide-based monomer unit.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: Disclosed is an epoxy resin composition comprising: (A) a polymerized compound including, as structural components, phosphaphenanthrene and at least one constituent selected from a structural unit of a phenolic novolak polymer and a structural unit of a phenolic novolak polymer in which a hydrogen atom of a phenolic hydroxyl group is substituted by phosphaphenanthrene; (B) an epoxy resin having two or more epoxy groups in a molecule; and (C) a curing agent that cures the epoxy resin.

Abstract: A pipe arrangement branching structure is provided with a perforated pipe having two holes partitioned by a partition wall and a plurality of branch pipes connected to the respective holes of the perforated pipe in an air-tight manner. The holes of the perforated pipe at an end thereof are formed to have shapes coincident with outer shapes of the respective branch pipes by plastic deformation work. The respective branch pipes are inserted into the holes formed by the plastic deformation work and the perforated pipe and the respective branch pipes are brazed.

Abstract: The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b).

Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.

Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.