Abstract: To provide a microfluidic device which does not apply a meandering reaction channel and thus can be reduced in size, the microfluidic device comprising a reaction channel is characterized in that a plurality of thermal cycle regions which respectively comprise at least two thermal regions with different temperatures are repeatedly provided and the reaction channel passes through the plurality of thermal cycle regions.

Abstract: A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.

Abstract: A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

Abstract: A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.

Abstract: A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.

Abstract: A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

Abstract: A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.

Abstract: A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.

Abstract: A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.

Abstract: A retainer includes: a connecting piece; one or more retaining parts provided at either end of the connecting piece and having a hole into which a terminal of an electrical component fits; an arm piece extending from near the hole; and a washer that is formed on the fore-end of the arm piece and is for fitting together with the hole over the terminal, wherein the connecting piece, the retaining part, the arm piece, and the washer are formed integrally of an insulating material having good expansion/contraction properties.

Abstract: A retainer includes: a connecting piece; one or more retaining parts provided at either end of the connecting piece and having a hole into which a terminal of an electrical component fits; an arm piece extending from near the hole; and a washer that is formed on the fore-end of the arm piece and is for fitting together with the hole over the terminal, wherein the connecting piece, the retaining part, the arm piece, and the washer are formed integrally of an insulating material having good expansion/contraction properties.

Abstract: In an IC socket for an electrical part, a contact pin electrically connecting a terminal of an electrical part and a printed circuit board is provided for a socket body of an IC socket. The contact pin comprises a sleeve having a space with one end opening, a plunger inserted into the sleeve through the end opening thereof to be vertically movable and an elastic member for urging downward the plunger. The sleeve is arranged to be vertically movable with respect to the socket body and is provided with a contact portion formed to an upper end thereof contacts a terminal of the electrical part to be electrically connected thereto and the plunger has a lower end contacting the printed circuit board to establish an electrical connection therebetween.

Abstract: In an IC socket for an electrical part, a contact pin electrically connecting a terminal of an electrical part and a printed circuit board is provided for a socket body of an IC socket. The contact pin comprises a sleeve having a space with one end opening, a plunger inserted into the sleeve through the end opening thereof to be vertically movable and an elastic member for urging downward the plunger. The sleeve is arranged to be vertically movable with respect to the socket body and is provided with a contact portion formed to an upper end thereof contacts a terminal of the electrical part to be electrically connected thereto and the plunger has a lower end contacting the printed circuit board to establish an electrical connection therebetween.

Abstract: A gyro apparatus is disclosed which includes a base table, a detecting piezoelectric element attached at its one end to the base table such that its longitudinal direction, is perpendicular to the surface of the base table, a tuning fork having a vibration surface parallel to the surface of the base table and disposed such that its axis is parallel to the surface of the detecting piezoelectric element, and an L-shaped attaching portion attached to a base portion of the tuning fork such that its one leg portion is parallel to said surface of the base table and extended in the direction to vibration mass portions of the tuning fork, wherein the one leg portion is attached with the other end of the detecting piezoelectric element.