Patents by Inventor Takashi Sakaki
Takashi Sakaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11382209Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.Type: GrantFiled: April 30, 2019Date of Patent: July 5, 2022Assignee: CANON KABUSHIKI KAISHAInventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Shingo Ishiguri
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Patent number: 11342259Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: GrantFiled: November 2, 2020Date of Patent: May 24, 2022Assignee: CANON KABUSHIKI KAISHAInventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
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Patent number: 10980160Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.Type: GrantFiled: September 23, 2019Date of Patent: April 13, 2021Assignee: Canon Kabushiki KaishaInventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Yoshitomo Fujisawa, Shingo Ishiguri
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Publication number: 20210074626Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: ApplicationFiled: November 2, 2020Publication date: March 11, 2021Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
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Patent number: 10861785Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: GrantFiled: May 30, 2019Date of Patent: December 8, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
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Publication number: 20200100408Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.Type: ApplicationFiled: September 23, 2019Publication date: March 26, 2020Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Yoshitomo Fujisawa, Shingo Ishiguri
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Publication number: 20190385940Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: ApplicationFiled: May 30, 2019Publication date: December 19, 2019Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
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Publication number: 20190342991Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.Type: ApplicationFiled: April 30, 2019Publication date: November 7, 2019Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Shingo Ishiguri
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Patent number: 10398037Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.Type: GrantFiled: February 15, 2018Date of Patent: August 27, 2019Assignee: CANON KABUSHIKI KAISHAInventors: Kunihiko Minegishi, Mitsutoshi Hasegawa, Takashi Sakaki
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Publication number: 20180242462Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.Type: ApplicationFiled: February 15, 2018Publication date: August 23, 2018Inventors: Kunihiko Minegishi, Mitsutoshi Hasegawa, Takashi Sakaki
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Patent number: 9074264Abstract: To provide a method for recovering a precious metal from a solution containing precious metal ions, an extracting agent or adsorbent used therefor, and a back-extracting agent or desorbent. An extracting agent or adsorbent in which precious metal ions are extracted or adsorbed, is brought into contact with a back-extracting agent or desorbent containing a sulfur-containing amino acid derivative represented by the following formula (I): wherein R1 is a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group, or a C6-14 aromatic hydrocarbon group, R2's are each independently a hydrogen atom, a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group or a C6-14 aromatic hydrocarbon group, and n is 0 or 1, to obtain a solution containing the precious metal ions, which is subjected to a reduction treatment to obtain a precious metal.Type: GrantFiled: December 28, 2011Date of Patent: July 7, 2015Assignee: TOSOH CORPORATIONInventors: Yukinori Sudo, Takashi Sakaki
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Publication number: 20130281726Abstract: To provide a method for recovering a precious metal from a solution containing precious metal ions, an extracting agent or adsorbent used therefor, and a back-extracting agent or desorbent. An extracting agent or adsorbent in which precious metal ions are extracted or adsorbed, is brought into contact with a back-extracting agent or desorbent containing a sulfur-containing amino acid derivative represented by the following formula (I): wherein R1 is a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group, or a C6-14 aromatic hydrocarbon group, R2's are each independently a hydrogen atom, a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group or a C6-14 aromatic hydrocarbon group, and n is 0 or 1, to obtain a solution containing the precious metal ions, which is subjected to a reduction treatment to obtain a precious metal.Type: ApplicationFiled: December 28, 2011Publication date: October 24, 2013Applicant: TOSOH CORPORATIONInventors: Yukinori Suso, Takashi Sakaki
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Patent number: 8273656Abstract: Provided are a method of forming a conductive layer on an inner portion of a through-electrode in which uniform adhesion property of plating in the inner portion of a through-hole is enhanced and a tact time is short, and a semiconductor device. The method of forming a conductive layer includes: a first plating step of forming a first plating layer on the inner portion of the through-hole; a plating suppression layer forming step of forming a plating suppression layer including a material different from a material of the first plating layer in an opening portion of the through-hole after the first plating step; and a second plating step of forming a second plating layer by plating on the inner portion of the through-hole after the plating suppression layer forming step.Type: GrantFiled: April 3, 2012Date of Patent: September 25, 2012Assignee: Canon Kabushiki KaishaInventor: Takashi Sakaki
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Publication number: 20120189781Abstract: Provided are a method of forming a conductive layer on an inner portion of a through-electrode in which uniform adhesion property of plating in the inner portion of a through-hole is enhanced and a tact time is short, and a semiconductor device. The method of forming a conductive layer includes: a first plating step of forming a first plating layer on the inner portion of the through-hole; a plating suppression layer forming step of forming a plating suppression layer including a material different from a material of the first plating layer in an opening portion of the through-hole after the first plating step; and a second plating step of forming a second plating layer by plating on the inner portion of the through-hole after the plating suppression layer forming step.Type: ApplicationFiled: April 3, 2012Publication date: July 26, 2012Applicant: CANON KABUSHIKI KAISHAInventor: Takashi Sakaki
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Patent number: 8173542Abstract: Provided are a method of forming a conductive layer on an inner portion of a through-electrode in which uniform adhesion property of plating in the inner portion of a through-hole is enhanced and a tact time is short, and a semiconductor device. The method of forming a conductive layer includes: a first plating step of forming a first plating layer on the inner portion of the through-hole; a plating suppression layer forming step of forming a plating suppression layer including a material different from a material of the first plating layer in an opening portion of the through-hole after the first plating step; and a second plating step of forming a second plating layer by plating on the inner portion of the through-hole after the plating suppression layer forming step.Type: GrantFiled: December 9, 2009Date of Patent: May 8, 2012Assignee: Canon Kabushiki KaishaInventor: Takashi Sakaki
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Publication number: 20100164122Abstract: Provided are a method of forming a conductive layer on an inner portion of a through-electrode in which uniform adhesion property of plating in the inner portion of a through-hole is enhanced and a tact time is short, and a semiconductor device. The method of forming a conductive layer includes: a first plating step of forming a first plating layer on the inner portion of the through-hole; a plating suppression layer forming step of forming a plating suppression layer including a material different from a material of the first plating layer in an opening portion of the through-hole after the first plating step; and a second plating step of forming a second plating layer by plating on the inner portion of the through-hole after the plating suppression layer forming step.Type: ApplicationFiled: December 9, 2009Publication date: July 1, 2010Applicant: CANON KABUSHIKI KAISHAInventor: Takashi Sakaki
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Patent number: 6978534Abstract: A pressure device for pressure bonding an IC chip on a circuit board includes an IC pressurizing member having a groove extending in a predetermined direction, and formed on a surface opposite to a surface abutting the IC chip. A columnar member is provided overlapped on the IC pressurizing member so as to bring an external surface thereof into contact within the groove of the IC pressurizing member. A pressure receiving member has a groove extending in a predetermined direction and overlapped on the IC pressurizing member so as to bring an external surface of the columnar member into contact within the groove thereof. An adjusting member adjusts parallelism between the IC pressurizing member and the pressure receiving member, and a fixing member fixes a relative position between the IC pressurizing member and the pressure receiving member.Type: GrantFiled: January 17, 2003Date of Patent: December 27, 2005Assignee: Canon Kabushiki KaishaInventor: Takashi Sakaki
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Publication number: 20030140484Abstract: A pressure device for pressure bonding an IC chip on a circuit board includes an IC pressurizing member having a groove extending in a predetermined direction, and formed on a surface opposite to a surface abutting the IC chip. A columnar member is provided overlapped on the IC pressurizing member so as to bring an external surface thereof into contact within the groove of the IC pressurizing member. A pressure receiving member has a groove extending in a predetermined direction and overlapped on the IC pressurizing member so as to bring an external surface of the columnar member into contact within the groove thereof. An adjusting member adjusts parallelism between the IC pressurizing member and the pressure receiving member, and a fixing member fixes a relative position between the IC pressurizing member and the pressure receiving member.Type: ApplicationFiled: January 17, 2003Publication date: July 31, 2003Inventor: Takashi Sakaki
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Patent number: 6511607Abstract: An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components. The exposed portions can also be formed to have empty holes, i.e.Type: GrantFiled: June 19, 1998Date of Patent: January 28, 2003Assignees: Canon Kabushiki Kaisha, Sumitomo Metal Industries, Ltd.Inventors: Takashi Sakaki, Tetsuo Yoshizawa, Toyohide Miyazaki, Hiroshi Kondo, Yoshimi Terayama, Yuichi Ikegami, Takahiro Okabayashi, Kazuo Kondo, Yoichi Tamura, Yasuo Nakatsuka
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Patent number: 6015081Abstract: A method for the electrical connection between electrical joints of electric circuit components includes disposing said electric circuit components so that said joints for the electrical connection are opposed to each other, and making the electrical connection between said electrical joints with a biasing force which is exerted by an elastic member from at least one side of said electric circuit component so that the biasing force is exerted consecutively from an intermediate position of connecting area where said joints are located to the periphery of said connecting area.Type: GrantFiled: March 7, 1994Date of Patent: January 18, 2000Assignees: Canon Kabushiki Kaisha, Sumitomo Metal Industries, Ltd.Inventors: Takahiro Okabayashi, Tetsuo Yoshizawa, Toyohide Miyazaki, Hiroshi Kondo, Yoshimi Terayama, Takashi Sakaki, Yuichi Ikegami, Kazuo Kondo, Yoichi Tamura, Yasuo Nakatsuka