Patents by Inventor Takashi Sakoda

Takashi Sakoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931718
    Abstract: Water-absorbing resin particles have a repulsion rate of 5% or more according to the formula (h3?h2)/h1×100(%) when a cylinder with an inner diameter of 25.4 mm, which has a mesh-like bottom onto which 0.2 g of the water-absorbing resin particles are sprinkled, is placed in a container having ion exchange water in an amount of 30 times a mass of the water-absorbing resin particles, where h1 represents a free swelling height (mm) of the water-absorbing resin particles after 1 minute from initiation of water absorption, h2 represents a height (mm) of the water-absorbing resin particles after a load of 1.3×103 Pa is applied to the water-absorbing resin particles for 1 minute after 1 minute from initiation of the water absorption, and h3 represents a height (mm) of the water-absorbing resin particles after 1 minute from release of the load applied when measuring h2.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: March 19, 2024
    Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Takashi Ito, Miki Sakoda, Mutsumi Matsuoka
  • Patent number: D405452
    Type: Grant
    Filed: December 10, 1996
    Date of Patent: February 9, 1999
    Assignee: Harada Industry Co., Ltd.
    Inventors: Masaki Shinkawa, Ryouichi Miyakawa, Hiroshi Komachi, Takashi Sakoda