Patents by Inventor Takashi Sampei

Takashi Sampei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10532430
    Abstract: A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb?ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: January 14, 2020
    Assignee: DISCO CORPORATION
    Inventor: Takashi Sampei
  • Patent number: 10406631
    Abstract: A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: September 10, 2019
    Assignee: Disco Corporation
    Inventors: Takashi Sampei, Yukiyasu Masuda
  • Publication number: 20180339365
    Abstract: A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 29, 2018
    Inventors: Takashi Sampei, Yukiyasu Masuda
  • Patent number: 9724783
    Abstract: A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: August 8, 2017
    Assignee: Disco Corporation
    Inventors: Wataru Odagiri, Kouichi Nehashi, Joel Koerwer, Hironari Ohkubo, Shuichiro Tsukiji, Ryugo Oba, Kentaro Odanaka, Takashi Sampei
  • Patent number: 9685378
    Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: June 20, 2017
    Assignee: Disco Corporation
    Inventors: Toshiyuki Yoshikawa, Takashi Sampei
  • Publication number: 20170076985
    Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 16, 2017
    Inventors: Toshiyuki Yoshikawa, Takashi Sampei
  • Publication number: 20160207145
    Abstract: A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb?ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 21, 2016
    Inventor: Takashi Sampei
  • Publication number: 20160151857
    Abstract: A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 2, 2016
    Inventors: Wataru Odagiri, Kouichi Nehashi, Joel Koerwer, Hironari Ohkubo, Shuichiro Tsukiji, Ryugo Oba, Kentaro Odanaka, Takashi Sampei
  • Patent number: 8403220
    Abstract: In an optical code detection system and method, infrared pulses are utilized to detect the presence of an object within the range of an optical imaging device, but the image of an infrared pulse reflected from the object is also analyzed to determine the distance between the object and the imaging device. An illumination pulse is then produced to illuminate the optical code on the object, and the characteristic of that pulse, such as duration, are controlled to provide appropriate exposure for an object at the detected distance.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: March 26, 2013
    Assignees: Optoelectronics Co., Ltd., Opticon, Inc.
    Inventors: Ken Fukuba, Satoshi Komi, Takashi Sampei, Tokuma Yamazaki
  • Publication number: 20110210174
    Abstract: In an optical code detection system and method, infrared pulses are utilized to detect the presence of an object within the range of an optical imaging device, but the image of an infrared pulse reflected from the object is also analyzed to determine the distance between the object and the imaging device. An illumination pulse is then produced to illuminate the optical code on the object, and the characteristic of that pulse, such as duration, are controlled to provide appropriate exposure for an object at the detected distance.
    Type: Application
    Filed: October 27, 2008
    Publication date: September 1, 2011
    Applicant: Optoelectronics Co., Ltd.
    Inventors: Ken Fukuba, Satoshi Komi, Takashi Sampei, Tokuma Yamazaki
  • Publication number: 20100329657
    Abstract: A relatively rapidly moving object is imaged with a sensor incorporating a rolling electronic shutter, while using flash illumination which is comparable to or dimmer than ambient light. This is achieved by utilizing a physical shutter between the object and sensor which is synchronized to the flash. Preferably, the physical shutter is also operated so as to be open for a time interval which is coextensive with the presence of the flash. Preferably, an optical mechanism is provided between the object and sensor which causes the image to be focused when the light is flashed and blurred otherwise. Preferably, an optical filter is positioned between the object and sensor, and this filter is constructed to transmit to the CMOS sensor light at the wavelength of the flashing light source but to attenuate ambient light.
    Type: Application
    Filed: April 18, 2007
    Publication date: December 30, 2010
    Applicants: Optoelectronics Co., Ltd., Opticon, Inc.
    Inventors: Kazukuni Hosoi, Tohru Takahashi, Ken Fukuba, Tokuma Yamazaki, Takashi Sampei, Satoshi Komi, Nobuhiro Ebara
  • Patent number: 7799700
    Abstract: A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: September 21, 2010
    Assignee: Disco Corporation
    Inventors: Kentaro Iizuka, Takashi Sampei, Nobuyasu Kitahara, Yohei Yamashita
  • Publication number: 20070054498
    Abstract: A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer.
    Type: Application
    Filed: September 5, 2006
    Publication date: March 8, 2007
    Inventors: Kentaro Iizuka, Takashi Sampei, Nobuyasu Kitahara, Yohei Yamashita