Abstract: A lead frame includes a die pad on which a semiconductor chip is mounted, a plurality of leads each having an end which faces the die pad, and tie bars connecting the leads, wherein each of the tie bars is formed so as to project from a surface of each of the leads by an amount sufficient to break a boundary between a tie bar and a lead when the tie bar is pushed back so that the tie bar and lead is separated. The method for producing a semiconductor device using the above lead frame includes steps of clamping by molding dies the lead frame having the semiconductor chip mounted on the die pad so that the tie bar is pushed back and cut off and encapsulating the semiconductor chip by resin so that a package made of the resin is formed, and releasing the lead frame from clamping by the molding dies and removing the tie bar pushed back by the clamping from the lead frame.

Abstract: A lead frame includes a die pad on which a semiconductor chip is mounted, a plurality of leads each having an end which faces the die pad, and tie bars connecting the leads, wherein each of the tie bars is formed so as to project from a surface of each of the leads by an amount sufficient to break a boundary between a tie bar and a Lead when the tie bar is pushed back so that the tie bar and lead is separated. The method for producing a semiconductor device using the above lead frame includes steps of clamping by molding dies the lead frame having the semiconductor chip mounted on the die pad so that the tie bar is pushed back and cut off and encapsulating the semiconductor chip by resin so that a package made of the resin is formed, and releasing the lead frame from clamping by the molding dies and removing the tie bar pushed back by the clamping from the lead frame.

Abstract: A handler used in a testing system for semiconductors includes an arm shaped conveyer unit for conveying a semiconductor device from a first end thereof to a second end thereof and vice versa,a loader/unloader unit which is provided at the first end of the conveyer unit, a setting unit which is provided at the second end of the conveyer unit, and an adjusting unit for adjusting the setting unit on a testing position which is a predetermined position with respect to a test head. The conveyer unit includes a ring shaped conveyer belt which is rotated between the first end of the conveyer unit and the second end thereof, and a plurality of holders each of which is fixed on an outer surface of the conveyer belt and holds the semiconductor device.