Patents by Inventor Takashi Sekiya

Takashi Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951550
    Abstract: A cemented carbide including tungsten carbide grains and a binder phase, in which a total content of the tungsten carbide grains and the binder phase in the cemented carbide is no less than 80 vol %, a content of the binder phase in the cemented carbide is no less than 0.1 vol % and no more than 20 vol %, in a histogram showing distribution of orientation differences between adjacent pairs each consisting of two of the tungsten carbide grains adjacent to each other in the cemented carbide, a first peak is present in a class of the orientation differences of no less than 29.5° and less than 30.5°.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yasuki Kido, Katsumi Okamura, Takashi Sekiya
  • Publication number: 20240094370
    Abstract: According to one embodiment, a radar device comprises a panel including clusters and a controller. The controller is configured to cause a first cluster of the clusters to transmit an electromagnetic wave to a target, cause the first cluster and at least one second cluster adjacent to the first cluster to receive a reflected wave from the target, and cause the first cluster and the at least one second cluster to output a reception signal. At least one cluster other than the first cluster and other than the at least one second cluster does not output the reception signal.
    Type: Application
    Filed: February 17, 2023
    Publication date: March 21, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takashi SEKI, Akira MORIYA, Kazuhiro TSUJIMURA, Ryota SEKIYA, Hiroki MORI
  • Publication number: 20240088573
    Abstract: A vehicle wireless device is used in a state being attached to an attachment surface of a vehicle. A circuit board includes a circuit that transmits or receives a radio wave at a predetermined target frequency. An antenna includes a board parallel portion parallel to the circuit board to receive a horizontally polarized wave having a vibration direction of an electric field parallel to the circuit board. A case accommodates the circuit board and the antenna. The circuit board faces the attachment surface when the vehicle wireless device is attached to the attachment surface. The circuit board may have a board region overlapping the board parallel portion without a conductor plate being provided in the board region. An inner space of the case may have a case region extending by ?/4 downward from the board parallel portion without a conductor plate being provided in the case region.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Youhei SEKIYA, Kenichiro SANJI, Takashi SAIKI
  • Publication number: 20230226617
    Abstract: A cemented carbide including tungsten carbide grains and a binder phase, in which a total content of the tungsten carbide grains and the binder phase in the cemented carbide is no less than 80 vol %, a content of the binder phase in the cemented carbide is no less than 0.1 vol % and no more than 20 vol %, in a histogram showing distribution of orientation differences between adjacent pairs each consisting of two of the tungsten carbide grains adjacent to each other in the cemented carbide, a first peak is present in a class of the orientation differences of no less than 29.5° and less than 30.5°.
    Type: Application
    Filed: January 20, 2022
    Publication date: July 20, 2023
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Yasuki KIDO, Katsumi OKAMURA, Takashi SEKIYA
  • Publication number: 20220316804
    Abstract: A heat exchanger includes a tubular refrigerant distributor having insertion holes spaced from each other in a first direction and into which ends of heat transfer tubes are inserted in a second direction. A first partition plate partitions the refrigerant distributor into a first space into which the ends of the heat transfer tubes are inserted and a second space, larger than the first space, into which the ends of the heat transfer tubes are not inserted; and an inflow pipe provided on a one side-surface side of the refrigerant distributor. The heat transfer tubes are located apart from the first partition plate in the first space. The first partition plate is provided with an orifice that is provided at a location corresponding to a space between adjacent ones of the heat transfer tubes, and that causes the first space and the second space to communicate with each other.
    Type: Application
    Filed: February 4, 2019
    Publication date: October 6, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yoji ONAKA, Takashi MATSUMOTO, Rihito ADACHI, Ryota AKAIWA, Takashi SEKIYA, Hayato TANIUE, Satomi ASAI
  • Patent number: 11189737
    Abstract: A laminated body comprising a substrate, one or more layers selected from a contact resistance reducing layer and a reduction suppressing layer, a Schottky electrode layer and a metal oxide semiconductor layer in this order.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: November 30, 2021
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Yoshihiro Ueoka, Takashi Sekiya, Shigekazu Tomai, Emi Kawashima, Yuki Tsuruma, Motohiro Takeshima
  • Patent number: 11018238
    Abstract: A structure including a metal oxide semiconductor layer and a noble metal oxide layer, wherein the metal oxide semiconductor layer and the noble metal oxide layer are adjacent to each other, and a film thickness of the noble metal oxide layer is more than 10 nm.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: May 25, 2021
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Yuki Tsuruma, Emi Kawashima, Yoshikazu Nagasaki, Takashi Sekiya, Yoshihiro Ueoka
  • Publication number: 20200266304
    Abstract: A laminated body comprising a substrate, one or more layers selected from a contact resistance reducing layer and a reduction suppressing layer, a Schottky electrode layer and a metal oxide semiconductor layer in this order.
    Type: Application
    Filed: December 26, 2016
    Publication date: August 20, 2020
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Yoshihiro UEOKA, Takashi SEKIYA, Shigekazu TOMAI, Emi KAWASHIMA, Yuki TSURUMA, Motohiro TAKESHIMA
  • Publication number: 20200208244
    Abstract: A sintered material made of an iron-based alloy is provided, wherein a content of Ni is more than 0.2 mass % and 10 mass % or less in an entire iron-based alloy; a content of C is more than 0 mass % and 2.0 mass % or less in the entire iron-based alloy; at least one element selected from Mo, Mn, Cr B and Si is more than 0 mass % and 5.0 mass % or less in total in the entire iron-based alloy; and a rest of the iron-based alloy is Fe and incidental impurities. A content of Ni in a local region of the iron-based alloy is more than 0.2 mass % and less than 21 mass %. A relative density is 97% or more.
    Type: Application
    Filed: July 19, 2018
    Publication date: July 2, 2020
    Inventors: Shigeki EGASHIRA, Tomoyuki ISHIMINE, Munehiro NODA, Takashi SEKIYA
  • Patent number: 10374045
    Abstract: A semiconductor device 1 which comprises a pair of an ohmic electrode 20 and a Schottky electrode 10 separated from each other, and a semiconductor layer 30 in contact with the ohmic electrode 20 and the Schottky electrode 10, and which satisfies the following formula (I): n < ? ? ? V e qL 2 ( I ) in which n is a carrier concentration (cm?3) of the semiconductor layer, ? is a dielectric constant (F/cm) of the semiconductor layer, Ve is a forward effective voltage (V) between the ohmic electrode and the Schottky electrode, q is an elementary charge (C), and L is a distance (cm) between the ohmic electrode and the Schottky electrode.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: August 6, 2019
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Yuki Tsuruma, Takashi Sekiya, Shigekazu Tomai, Emi Kawashima, Yoshihiro Ueoka
  • Publication number: 20190237556
    Abstract: A structure including a metal oxide semiconductor layer and a noble metal oxide layer, wherein the metal oxide semiconductor layer and the noble metal oxide layer are adjacent to each other, and a film thickness of the noble metal oxide layer is more than 10 nm.
    Type: Application
    Filed: October 11, 2017
    Publication date: August 1, 2019
    Applicant: Idemitsu Kosan Co., Ltd.
    Inventors: Yuki TSURUMA, Emi KAWASHIMA, Yoshikazu NAGASAKI, Takashi SEKIYA, Yoshihiro UEOKA
  • Patent number: 10340356
    Abstract: A laminated body comprising a substrate, an ohmic electrode layer, a metal oxide semiconductor layer, a Schottky electrode layer and a buffer electrode layer in this order, wherein a reduction suppressing layer is provided between the Schottky electrode layer and the buffer electrode layer.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: July 2, 2019
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Emi Kawashima, Takashi Sekiya, Yuki Tsuruma, Yoshihiro Ueoka, Shigekazu Tomai, Motohiro Takeshima
  • Publication number: 20190013389
    Abstract: A laminated body comprising a substrate, an ohmic electrode layer, a metal oxide semiconductor layer, a Schottky electrode layer and a buffer electrode layer in this order, wherein a reduction suppressing layer is provided between the Schottky electrode layer and the buffer electrode layer.
    Type: Application
    Filed: December 26, 2016
    Publication date: January 10, 2019
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Emi KAWASHIMA, Takashi SEKIYA, Yuki TSURUMA, Yoshihiro UEOKA, Shigekazu TOMAI, Motohiro TAKESHIMA
  • Publication number: 20190006473
    Abstract: A semiconductor device 1 which comprises a pair of an ohmic electrode 20 and a Schottky electrode 10 separated from each other, and a semiconductor layer 30 in contact with the ohmic electrode 20 and the Schottky electrode 10, and which satisfies the following formula (I): n < ? ? ? V e qL 2 ( I ) in which n is a carrier concentration (cm?3) of the semiconductor layer, ? is a dielectric constant (F/cm) of the semiconductor layer, Ve is a forward effective voltage (V) between the ohmic electrode and the Schottky electrode, q is an elementary charge (C), and L is a distance (cm) between the ohmic electrode and the Schottky electrode.
    Type: Application
    Filed: December 21, 2016
    Publication date: January 3, 2019
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Yuki TSURUMA, Takashi SEKIYA, Shigekazu TOMAI, Emi KAWASHIMA, Yoshihiro UEOKA
  • Patent number: 10135131
    Abstract: To provide an electromagnetic-wave transmitting cover which can achieve range extension and angle widening of a sensing radar and is excellent in design property. An electromagnetic-wave transmitting cover of the invention includes a base material made of an electromagnetic-wave-transmissive material, a light-transmitting base material formed on a surface of the base material and made of a light-transmissive material, and a design layer disposed between the base material and the light-transmitting base material, the electromagnetic-wave transmitting cover transmitting an electromagnetic wave, the electromagnetic-wave transmitting cover has an electromagnetic-wave transmitting area which transmits the electromagnetic wave, the base material and the light-transmitting base material in the electromagnetic-wave transmitting area has an interval of 0.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: November 20, 2018
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Kazuki Takao, Daiichiro Kawashima, Takashi Sekiya, Hideto Maeda, Koji Okumura, Kenji Suzuki
  • Publication number: 20160248152
    Abstract: To provide an electromagnetic-wave transmitting cover which can achieve range extension and angle widening of a sensing radar and is excellent in design property. An electromagnetic-wave transmitting cover of the invention includes a base material made of an electromagnetic-wave-transmissive material, a light-transmitting base material formed on a surface of the base material and made of a light-transmissive material, and a design layer disposed between the base material and the light-transmitting base material, the electromagnetic-wave transmitting cover transmitting an electromagnetic wave, the electromagnetic-wave transmitting cover has an electromagnetic-wave transmitting area which transmits the electromagnetic wave, the base material and the light-transmitting base material in the electromagnetic-wave transmitting area has an interval of 0.
    Type: Application
    Filed: December 4, 2015
    Publication date: August 25, 2016
    Inventors: Kazuki TAKAO, Daiichiro KAWASHIMA, Takashi SEKIYA, Hideto MAEDA, Koji OKUMURA, Kenji SUZUKI
  • Publication number: 20150344915
    Abstract: A process for producing a chemical product comprises a first fermentation step wherein fermentation is conducted by supplying a starting material compound and oxygen to a microorganism-containing liquid, to obtain a first fermentation broth containing a chemical product formed by the fermentation, a second fermentation step wherein the first fermentation broth is taken out and used as a second fermentation broth, and fermentation is conducted by supplying oxygen without supplying a starting material compound, so that the concentration of the starting material compound in the second fermentation broth is adjusted to be a concentration (Y) lower than a concentration (X) of the starting material compound in the first fermentation broth, and a separation step wherein the second fermentation broth is separated to obtain a separated liquid containing the chemical product.
    Type: Application
    Filed: August 10, 2015
    Publication date: December 3, 2015
    Applicant: Asahi Glass Company, Limited
    Inventors: Takashi SEKIYA, Hiroshi HATANO, Hiroki TANAKA, Nobuyuki KASAHARA
  • Patent number: 8618532
    Abstract: A bottom-contact type organic thin film transistor comprising at least a gate electrode, an insulator layer, a source electrode, a drain electrode and an organic semiconductor layer, on a substrate, wherein at least one of the source electrode and the drain electrode has a multilayer structure formed by stacking an oxide layer and a metal layer, and the metal layer is surface-modified with an organic thin film layer.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: December 31, 2013
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Takashi Sekiya, Hiroaki Nakamura
  • Patent number: 8347917
    Abstract: In a four-way valve having a simple structure, even if a high-temperature refrigerant and a low-temperature refrigerant flow close to each other, heat loss between both refrigerants is suppressed. The valve comprises a housing member including a valve chamber, a valve seat including a bearing surface portion located in the valve chamber, a first channel through which a high-temperature fluid flows and a second channel through which a low-temperature fluid flows at a predetermined time, including openings adjacent to each other at a bearing surface portion of the valve seat, passing through the valve seat and extending outside of the valve chamber, and a valve element moving to the bearing surface portion of the valve seat. A thermal resistor portion suppressing heat transfer between these channels is located near the openings, between the first and second channels.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: January 8, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Susumu Yoshimura, Shinichi Wakamoto, Shinji Nakashima, Takashi Sekiya
  • Patent number: 8333457
    Abstract: The present invention is used for a printing target having a non-flat surface portion in at least a portion of a printing surface. To form a decorative printing film on the printing surface of a base material, ink droplets of the same color as the color of the printing film are ejected from nozzles of an inkjet printer onto the printing surface. The distance from the nozzles to the printing surface is represented by X (mm). The droplet amount of the ink is represented by Y (pl). When the maximum value of the distance X is greater than 5 mm, the droplets are ejected from the nozzles each by an amount greater than the droplet amount Y represented by the equation: Y=0.9X1.5.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: December 18, 2012
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Yosuke Maruoka, Takashi Sekiya, Daiichiro Kawashima