Abstract: An object of the present invention is to provide a phycocyanin pigment composition insoluble in water and provide food, cosmetics, a coating material or a printing marker for pharmaceuticals or agricultural chemicals, a stationery product, a writing tool, a printing ink, an inkjet ink, a metal ink, a paint, a plastic coloring agent, a color toner, a fluorescent labeling agent, a fluorescent probe, or a chemical sensor, each containing the pigment composition. It was found that the phycocyanin pigment composition containing phycocyanin and a metal or a metal compound was insoluble in water, and thus the present invention was accomplished.

Abstract: An object of the present invention is to provide a phycocyanin pigment composition insoluble in water and provide food, cosmetics, a coating material or a printing marker for pharmaceuticals or agricultural chemicals, a stationery product, a writing tool, a printing ink, an inkjet ink, a metal ink, a paint, a plastic coloring agent, a color toner, a fluorescent labeling agent, a fluorescent probe, or a chemical sensor, each containing the pigment composition. It was found that the phycocyanin pigment composition containing phycocyanin and a metal or a metal compound was insoluble in water, and thus the present invention was accomplished.

Abstract: A semiconductor relay includes two MOSFETs; a light emitting element; a light-receiving drive element for switching on and off the two MOSFETs; two output and two input conductor plates electrically connected to the two MOSFETs and the light emitting element, respectively; and an encapsulating resin encapsulating the two MOSFETs, the light emitting element, the light-receiving drive element, the two output and the two input conductor plates. The two output and two input conductor plates includes terminal portions which protrude outside the encapsulating resin and are mounted on a common printed circuit board. Further, the two output conductor plates includes mount portions on which the two MOSFETs are mounted or on which drain electrodes of the two MOSFETs are connected, and the mount portions are encapsulated by the encapsulating resin in such an orientation that a thickness direction of the mount portions intersects that of the printed circuit board.

Abstract: A synthetic resin packed coil assembly formed by a wound spiral of a number of bundled turns of insulated wire comprises at least one layer enveloping the bundled turns of insulated wire of the wound spiral. This layer is composed of a synthetic resin reinforced by a high strength fibrous material and is formed by first winding the high strength fibrous material around the bundled turns of insulated wire of the wound spiral, subsequently impregnating a solution of the synthetic resin and finally allowing the synthetic resin to harden.

Abstract: There is provided a method of insulating electromagnetic coils comprising coating an electromagnetic coil with epoxy resin containing a cross linking agent consisting essentially of an acid anhydride, said coil having a bonding layer consisting of epoxy resin having a melting point of higher than 60.degree. C, and then subjecting to bridging said epoxy resin containing a cross linking agent by heating.

Abstract: The method of the present disclosure includes preparing a coil which is impregnated with resin to form a resin packed coil, in which the resin is still in a liquid phase, immersing the resin packed coil into a wax in the liquid state, hardening the wax adhering around the resin packed coil, hardening the resin which is impregnated in the coil, and removing the wax, thus obtaining a resin packed coil assembly where the resin is hardened and surrounds the coil.

Abstract: Encapsulation method not requiring molds and according to which curing of a thermosetting substance which when hardened provides requisite protection to an electrical or other assembly consisting of one or a plurality of elements is effected while the assembly is surrounded by a substance which remains solid and prevents movement of the thermosetting substance out of contact with the assembly during thermoplastic stages of curing thereof, and melts when the thermosetting substance has hardened, whereby the assembly may be moved out of contact therewith.