Patents by Inventor Takashi Shigeno

Takashi Shigeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10784186
    Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semic
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: September 22, 2020
    Assignee: KATOH ELECTRIC CO., LTD.
    Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
  • Patent number: 10777489
    Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: September 15, 2020
    Assignee: KATOH ELECTRIC CO., LTD.
    Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
  • Patent number: 10600725
    Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: March 24, 2020
    Assignees: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., KATOH ELECTRIC CO., LTD.
    Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
  • Publication number: 20200015400
    Abstract: ‘Tochigi i37 Go’ is a new variety of strawberry bred by crossbreeding variety ‘Tochigi 32 Go’ and ‘09-48-5’ in 2012. The plant may be used, e.g., for cultivation of fruit for consumption. ‘Tochigi i37 Go’ is a high-quality, high-yielding variety having early maturing and high-yielding characteristic, fruit with a taste similar to those of ‘Tochiotome’, a large fruit size, a firm fruit firmness, and adaptability to forcing culture.
    Type: Application
    Filed: April 5, 2019
    Publication date: January 9, 2020
    Inventors: Kobayashi Yasuhiro, Takashi Shigeno, Takashi Ohashi, Akitsugu Hatakeyama, Kazunari Iimura, Tatsuro Nakanishi, Masaaki Ueki, Akina Toyoda, Asami Nagashima, Yoshinori Saito, Risa Tsurumi, Natsumi Kojima, Yukio Ohashi
  • Publication number: 20190371709
    Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semic
    Type: Application
    Filed: October 16, 2018
    Publication date: December 5, 2019
    Applicant: KATOH ELECTRIC CO., LTD.
    Inventors: Hiroyoshi URUSHIHATA, Takashi SHIGENO, Eiki ITO, Wataru KIMURA, Hirotaka ENDO, Toshio KOIKE, Toshiki KOUNO
  • Publication number: 20190371710
    Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first dip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame and a sealing resin.
    Type: Application
    Filed: May 29, 2018
    Publication date: December 5, 2019
    Applicants: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., KATOH ELECTRIC CO., LTD.
    Inventors: Hiroyoshi URUSHIHATA, Takashi SHIGENO, Eiki ITO, Wataru KIMURA, Hirotaka ENDO, Toshio KOIKE, Toshiki KOUNO
  • Publication number: 20190371712
    Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.
    Type: Application
    Filed: October 16, 2018
    Publication date: December 5, 2019
    Applicant: Katoh Electric Co., Ltd.
    Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
  • Patent number: 9961985
    Abstract: A case for a powered toothbrush comprises a housing having an interior for receiving a powered toothbrush, and a cover, wherein the cover substantially obfuscates the interior but is sufficiently light-transmissive to communicate the presence of an indicator from within the interior. Also provided is a powered toothbrush and case system.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: May 8, 2018
    Assignee: Colgate-Palmolive Company
    Inventors: Takashi Shigeno, Kazuya Andachi, Tamaki Ito
  • Patent number: D768571
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: October 11, 2016
    Assignees: Colgate-Palmolive Company, Omron Healthcare Co., Ltd.
    Inventors: Takashi Shigeno, Kazuya Andachi, Feilang Tseng, Tamaki Ito
  • Patent number: D768866
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: October 11, 2016
    Assignee: OMRON HEALTHCARE Co., Ltd.
    Inventors: Takashi Shigeno, Kazuya Andachi, Tamaki Ito
  • Patent number: D780456
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: March 7, 2017
    Assignees: COLGATE-PALMOLIVE COMPANY, OMRON HEALTHCARE CO, LTD
    Inventors: Takashi Shigeno, Kazuya Andachi, Feilang Tseng, Tamaki Ito
  • Patent number: D794640
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 15, 2017
    Assignee: Canon Denshi Kabushiki Kaisha
    Inventors: Takashi Shigeno, Manabu Ikarashi, Asako Chiba, Shinobu Kato, Tatsuya Nishi
  • Patent number: D798060
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: September 26, 2017
    Assignee: COLGATE-PALMOLIVE COMPANY
    Inventors: Takashi Shigeno, Kazuya Andachi, Tamaki Ito
  • Patent number: D813806
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: March 27, 2018
    Assignee: OMRON HEALTHCARE Co., Ltd.
    Inventors: Tamaki Ito, Tsuyoshi Ogihara, Takashi Shigeno, Kazuya Andachi
  • Patent number: D821595
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: June 26, 2018
    Assignee: OMRON HEALTHCARE Co., Ltd.
    Inventors: Tamaki Ito, Tsuyoshi Ogihara, Takashi Shigeno, Kazuya Andachi
  • Pad
    Patent number: D821596
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: June 26, 2018
    Assignee: OMRON HEALTHCARE Co., Ltd.
    Inventors: Tamaki Ito, Tsuyoshi Ogihara, Takashi Shigeno, Kazuya Andachi
  • Patent number: D845951
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: April 16, 2019
    Assignee: Canon Denshi Kabushiki Kaisha
    Inventors: Takashi Shigeno, Manabu Ikarashi, Shinobu Kato, Takashi Machida, Tatsuya Nishi
  • Patent number: D863573
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: October 15, 2019
    Assignee: OMRON HEALTHCARE Co., Ltd.
    Inventors: Tamaki Ito, Tsuyoshi Ogihara, Gen Suzuki, Takashi Shigeno, Kazuya Andachi
  • Patent number: D884615
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: May 19, 2020
    Assignee: OMRON HEALTHCARE Co., Ltd.
    Inventors: Tamaki Ito, Tsuyoshi Ogihara, Gen Suzuki, Takashi Shigeno, Kazuya Andachi
  • Patent number: PP32077
    Abstract: ‘Tochigi i37 Go’ is a new variety of strawberry bred by crossbreeding variety ‘Tochigi 32 Go’ and ‘09-48-5’ in 2012. The plant may be used, e.g., for cultivation of fruit for consumption. ‘Tochigi i37 Go’ is a high-quality, high-yielding variety having early maturing and high-yielding characteristic, fruit with a taste similar to those of ‘Tochiotome’, a large fruit size, a firm fruit firmness, and adaptability to forcing culture.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: August 18, 2020
    Assignee: TOCHIGI PREFECTURE
    Inventors: Yasuhiro Kobayashi, Takashi Shigeno, Takashi Ohashi, Akitsugu Hatakeyama, Kazunari Iimura, Tatsuro Nakanishi, Masaaki Ueki, Akina Toyoda, Asami Nagashima, Yoshinori Saito, Risa Tsurumi, Natsumi Kojima, Yukio Ohashi