Patents by Inventor Takashi Shigeno
Takashi Shigeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11056422Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.Type: GrantFiled: May 29, 2018Date of Patent: July 6, 2021Assignees: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., KATOH ELECTRIC CO., LTD.Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
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Publication number: 20210134709Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region an an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.Type: ApplicationFiled: May 29, 2018Publication date: May 6, 2021Applicants: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., KATOH ELECTRIC CO., LTD.Inventors: Hiroyoshi URUSHIHATA, Takashi SHIGENO, Eiki ITO, Wataru KIMURA, Hirotaka ENDO, Toshio KOIKE, Toshiki KOUNO
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Patent number: 10784186Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semicType: GrantFiled: October 16, 2018Date of Patent: September 22, 2020Assignee: KATOH ELECTRIC CO., LTD.Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
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Patent number: 10777489Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.Type: GrantFiled: October 16, 2018Date of Patent: September 15, 2020Assignee: KATOH ELECTRIC CO., LTD.Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
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Patent number: 10600725Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin.Type: GrantFiled: May 29, 2018Date of Patent: March 24, 2020Assignees: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., KATOH ELECTRIC CO., LTD.Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
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Publication number: 20200015400Abstract: ‘Tochigi i37 Go’ is a new variety of strawberry bred by crossbreeding variety ‘Tochigi 32 Go’ and ‘09-48-5’ in 2012. The plant may be used, e.g., for cultivation of fruit for consumption. ‘Tochigi i37 Go’ is a high-quality, high-yielding variety having early maturing and high-yielding characteristic, fruit with a taste similar to those of ‘Tochiotome’, a large fruit size, a firm fruit firmness, and adaptability to forcing culture.Type: ApplicationFiled: April 5, 2019Publication date: January 9, 2020Inventors: Kobayashi Yasuhiro, Takashi Shigeno, Takashi Ohashi, Akitsugu Hatakeyama, Kazunari Iimura, Tatsuro Nakanishi, Masaaki Ueki, Akina Toyoda, Asami Nagashima, Yoshinori Saito, Risa Tsurumi, Natsumi Kojima, Yukio Ohashi
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Publication number: 20190371709Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semicType: ApplicationFiled: October 16, 2018Publication date: December 5, 2019Applicant: KATOH ELECTRIC CO., LTD.Inventors: Hiroyoshi URUSHIHATA, Takashi SHIGENO, Eiki ITO, Wataru KIMURA, Hirotaka ENDO, Toshio KOIKE, Toshiki KOUNO
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Publication number: 20190371710Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first dip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame and a sealing resin.Type: ApplicationFiled: May 29, 2018Publication date: December 5, 2019Applicants: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., KATOH ELECTRIC CO., LTD.Inventors: Hiroyoshi URUSHIHATA, Takashi SHIGENO, Eiki ITO, Wataru KIMURA, Hirotaka ENDO, Toshio KOIKE, Toshiki KOUNO
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Publication number: 20190371712Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.Type: ApplicationFiled: October 16, 2018Publication date: December 5, 2019Applicant: Katoh Electric Co., Ltd.Inventors: Hiroyoshi Urushihata, Takashi Shigeno, Eiki Ito, Wataru Kimura, Hirotaka Endo, Toshio Koike, Toshiki Kouno
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Patent number: D821595Type: GrantFiled: March 13, 2017Date of Patent: June 26, 2018Assignee: OMRON HEALTHCARE Co., Ltd.Inventors: Tamaki Ito, Tsuyoshi Ogihara, Takashi Shigeno, Kazuya Andachi
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Patent number: D845951Type: GrantFiled: October 20, 2017Date of Patent: April 16, 2019Assignee: Canon Denshi Kabushiki KaishaInventors: Takashi Shigeno, Manabu Ikarashi, Shinobu Kato, Takashi Machida, Tatsuya Nishi
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Patent number: D863573Type: GrantFiled: April 2, 2018Date of Patent: October 15, 2019Assignee: OMRON HEALTHCARE Co., Ltd.Inventors: Tamaki Ito, Tsuyoshi Ogihara, Gen Suzuki, Takashi Shigeno, Kazuya Andachi
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Patent number: D884615Type: GrantFiled: April 2, 2018Date of Patent: May 19, 2020Assignee: OMRON HEALTHCARE Co., Ltd.Inventors: Tamaki Ito, Tsuyoshi Ogihara, Gen Suzuki, Takashi Shigeno, Kazuya Andachi
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Patent number: PP32077Abstract: ‘Tochigi i37 Go’ is a new variety of strawberry bred by crossbreeding variety ‘Tochigi 32 Go’ and ‘09-48-5’ in 2012. The plant may be used, e.g., for cultivation of fruit for consumption. ‘Tochigi i37 Go’ is a high-quality, high-yielding variety having early maturing and high-yielding characteristic, fruit with a taste similar to those of ‘Tochiotome’, a large fruit size, a firm fruit firmness, and adaptability to forcing culture.Type: GrantFiled: April 5, 2019Date of Patent: August 18, 2020Assignee: TOCHIGI PREFECTUREInventors: Yasuhiro Kobayashi, Takashi Shigeno, Takashi Ohashi, Akitsugu Hatakeyama, Kazunari Iimura, Tatsuro Nakanishi, Masaaki Ueki, Akina Toyoda, Asami Nagashima, Yoshinori Saito, Risa Tsurumi, Natsumi Kojima, Yukio Ohashi
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Patent number: D923803Type: GrantFiled: January 28, 2020Date of Patent: June 29, 2021Inventors: Tamaki Ito, Tsuyoshi Ogihara, Kosuke Inoue, Takashi Shigeno, Kazuya Andachi
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Patent number: D926966Type: GrantFiled: April 22, 2019Date of Patent: August 3, 2021Assignee: MEDRX CO., LTD.Inventors: Takashi Shigeno, Manabu Ikarashi, Kazuya Adachi, Katsunori Kobayashi, Hidetoshi Hamamoto
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Patent number: D931851Type: GrantFiled: December 6, 2018Date of Patent: September 28, 2021Assignee: KING JIM CO., LTD.Inventors: Takashi Shigeno, Mari Muranaka, Shinji Higashiyama
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Patent number: D933242Type: GrantFiled: January 28, 2020Date of Patent: October 12, 2021Inventors: Tamaki Ito, Tsuyoshi Ogihara, Kosuke Inoue, Takashi Shigeno, Kazuya Andachi
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Patent number: D934476Type: GrantFiled: March 22, 2018Date of Patent: October 26, 2021Assignee: KING JIM CO., LTD.Inventors: Takashi Shigeno, Mari Muranaka, Jumpei Watanabe
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Patent number: D946776Type: GrantFiled: May 24, 2021Date of Patent: March 22, 2022Inventors: Tamaki Ito, Tsuyoshi Ogihara, Kosuke Inoue, Takashi Shigeno, Kazuya Andachi