Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C.

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Abstract: The present invention aims to provide a resin composition for toners which enables to obtain a toner having excellent low temperature fixability and high temperature offset resistance, and a toner. The resin composition for toners is obtained by reacting a mixture of a branched polyester (A) having a number average molecular weight of 2,000 to 7,000 and a hydroxyl value of 20 to 80, and a low molecular weight linear polyester (B) having a number average molecular weight of 2,000 to 5,000 and a hydroxyl number of 20 to 55, with an isocyanate compound containing two or more isocyanate groups in one molecule, which comprises a crosslinked structure of said branched polyester (A), a structure in which said branched polyester (A) and said low molecular weight linear polyester (B) are bonded by said isocyanate compound, and an unreacted portion of said low molecular weight linear polyester (B).

Abstract: It is an object of the present invention to provide a resin composition for a toner and a toner excellent in low temperature fixation property, high temperature offset resistance, blocking resistance, and excellent in coloration. The present invention relates to a resin composition for a toner, which contains a crystalline polymer having a melting point of 180 to 280° C. and heat absorption of 25 to 150 mJ/mg at a melting point measured by a differential scanning calorimeter (DSC) and a non-crystalline polyester having a glass transition temperature of 30 to 80° C.

Abstract: It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate. A photoreactive hot-melt adhesive composition containing: (a) a bisphenol F epoxy resin that assumes a solid form at ordinary temperature; (b) at least one compound selected from the group consisting of a compound represented by the following formula (1), a copolymer of tetramethylene oxide and ethylene oxide and a copolymer of tetramethylene oxide and propylene oxide; and (c) a cationic photoinitiator; R1-(OR2)n—OR3??Formula (1) (In the formula, R1 and R3 independently represent any of a hydrogen atom, a glycidyl group, and a monofunctional substituted or unsubstituted hydrocarbon group having 1–8 carbon atoms; R2 represents a bifunctional, substituted or unsubstituted hydrocarbon group having 2–8 carbon atoms; and n is an integer of 2 or larger.

Abstract: It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate. A photoreactive hot-melt adhesive composition containing: (a) a bisphenol F epoxy resin that assumes a solid form at ordinary temperature; (b) at least one compound selected from the group consisting of a compound represented by the following formula (1), a copolymer of tetramethylene oxide and ethylene oxide and a copolymer of tetramethylene oxide and propylene oxide; and (c) a cationic photoinitiator; R1-(OR2)n-OR3??Formula (1) (In the formula, R1 and R3 independently represent any of a hydrogen atom, a glycidyl group, and a monofunctional substituted or unsubstituted hydrocarbon group having 1-8 carbon atoms; R2 represents a bifunctional, substituted or unsubstituted hydrocarbon group having 2-8 carbon atoms; and n is an integer of 2 or larger.

Abstract: It is an object of the present invention to provide a resin composition for a toner and a toner excellent in low temperature fixation property, high temperature offset resistance, blocking resistance, and excellent in coloration. The present invention relates to a resin composition for a toner, which contains a crystalline polymer having a melting point of 180 to 280° C. and heat absorption of 25 to 150 mJ/mg at a melting point measured by a differential scanning calorimeter (DSC) and a non-crystalline polyester having a glass transition temperature of 30 to 80° C.

Abstract: The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: 1

Abstract: It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate.

Abstract: The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: wherein in the formula (2), R5 indicates (ChH2hO)iH and R6 indicates (CkH2kO)lH or (CkH2kO)lCkH2k+1, provided that h, i, k and l each are an integer of 1 or more. The present invention provides a reactive hot melt adhesive, in which a curing reaction progresses under application of actinic radiation.

Abstract: A toner resin composition characterized as containing a vinyl copolymer prepared principally from a styrene monomer and a (meth)acrylic ester monomer and showing peaks at least in the molecular weight range of 5,000-20,000 and in the molecular weight range of not below 500,000 when its molecular weight distribution is determined by gel permeation chromatography, 2-10% by weight of Fischer-Tropsch wax, and 0.5-5% by weight of styrenic block copolymer; and a toner incorporating the toner resin composition.

Abstract: It is an object to obtain a cathode ray tube having a high resolution without decreasing electron emission property. Surface of a cathode was leveled by heating during forming a vacuum in order to oxidize a carbonate salt to an oxide as an electron emissive material, after applying a paste for printing on a metal substrate by screen printing, drying the same, and incorporating an oxide cathode in a cathode ray tube, the paste having a mixture of needle-like particles of the first group and bulk particles of the second group incorporated as an alkaline earth metal carbonate forming an electron emissive material layer.

Abstract: A cathode for an electron tube including a base body having nickel as a major component and including at least one kind of reducing agents, a metal member in a layer-like shape, which has as a major component a metal provided with a reducing power equivalent to or smaller than a reducing power of the at least one kind of reducing agents included in the base body and larger than a reducing power of nickel and which is formed on faces of the base body, an electron emitting substance layer formed by depositing alkaline earth metal oxides including barium on the metal member, wherein the metal member is formed on the faces of the base body such that the base body is restrained from deforming by thermal stresses of intermetallic compounds formed at portions of the base body bounded with the metal member.

Abstract: A large number of oxide cathodes are aligned in an oxide cathode aligning/fixing jig which is formed in a plate shape composed of an upper member and lower member. The horizontal positions of the oxide cathodes fit in the cut holes are fixed by the upper member. The height of the upper surface of the metallic body of each of the oxide cathodes, on which a carbonate paste is to be printed is fixed by the lower member of the jig. By performing the screen printing for the metallic bodies in a state where the upper surfaces thereon are at equal heights, misalignment in printing pattern or variation in the thickness of the printed carbonate films can be suppressed. Thus, the screen printing can be carried out for the large number of oxide cathodes at a time at precise positions and with a uniform thickness of the carbonate layer.

Abstract: The object is directed toward obtaining a process for preparing a solvent-type acrylic pressure-sensitive adhesive which is able to increase a conversion at polymerization in the preparation of the solvent-type acrylic pressure-sensitive adhesive to thereby solve the problems of odors associated with residual monomers and of attachment of gels on reactor walls, and further to provide improved productivity and workability.In the preparation of the solvent-type acrylic pressure-sensitive adhesives, a monomer composition containing alkyl (meth)acrylate ester as its main component is subjected to solution polymerization under a closed condition at least in a latter stage of the polymerization reaction. In the polymerization, the solution to be polymerized is maintained at temperatures not lower than a boiling point thereof under normal pressures or at 50.degree.-120.degree. C.