Patents by Inventor Takashi Shinoki

Takashi Shinoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200031070
    Abstract: A lens manufacturing method includes dropping a coating liquid including a resin onto a lens surface of a lens body made of a resin, the lens surface being on one side of the lens body and the lens body being retained in a stationary state, and maintaining the stationary state until the coating liquid reaches the outer edge of the lens surface, and removing an excess of the coating liquid from the lens surface by rotating the lens body around a predetermined rotational axis and forming a film of the coating liquid on the lens surface, the film becoming a covering layer. Preferably, in the dropping of the coating liquid, the stationary state is maintained until the coating liquid reaches the whole of the outer edge of the lens surface.
    Type: Application
    Filed: February 20, 2018
    Publication date: January 30, 2020
    Inventors: Takashi NAKAYAMA, Keiichiro SHINOKI, Takanori KAMOTO
  • Publication number: 20190375866
    Abstract: The invention provides a powder that is easily redispersible in a liquid medium such as water. The powder contains a fluoropolymer. The fluoropolymer contains at least one group A selected from the group consisting of —SO2Y, —COOR, —SO3X, —SO2NR12, and —COOX, wherein Y is a halogen atom; R is a C1-C4 alkyl group; X is M1/L or NR14, where M is a hydrogen atom or an L-valent metal, the L-valent metal being a metal in group 1, group 2, group 4, group 8, group 11, group 12, or group 13 of the periodic table; and R1s are each individually a hydrogen atom or a C1-C4 alkyl group. The powder exhibits a dispersion of 50% or higher. The dispersion is calculated by filtering a composition obtainable by mixing the powder with water through a mesh having an opening of 20 ?m.
    Type: Application
    Filed: October 11, 2017
    Publication date: December 12, 2019
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yuki YOTSUMOTO, Tadashi INO, Kazuhiro OHTSUKA, Noriyuki SHINOKI, Masaharu NAKAZAWA, Takashi YOSHIMURA, Masahiro KONDO
  • Patent number: 7728710
    Abstract: An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: June 1, 2010
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagome, Naoki Fukuda, Kozo Morita, Daisuke Makino
  • Publication number: 20060040094
    Abstract: An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a slider. The insulating base 10 is a synthetic resin molded piece. The flexible circuit board 20 is insert-molded to the insulating base 10. The electronic component substrate 1-1 is produced by preparing the flexible circuit board 20 and first and second mold members 41 and 45 having a cavity C1 with a shape that corresponds to the external shape of the electronic component substrate 1-1. Then, the flexible circuit board 20 is accommodated in the cavity C1 between the first and second mold members 41 and 45, and a molten molding resin is filled into the cavity C1. After the filled molding resin has been solidified, the first and second mold members 41 and 45 are removed.
    Type: Application
    Filed: February 5, 2004
    Publication date: February 23, 2006
    Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagawa, Naoki Fukuda, Kozo Morita, Daisuke Makino
  • Patent number: 6086810
    Abstract: A method of strongly affixing a molding resin to a synthetic resin film in direct fashion includes preparing a synthetic resin film and a molding resin each of which consists of a thermoplastic material, stretching a prescribed surface of the synthetic resin film, simultaneously bringing the molten, high-temperature molding resin into contact with the surface of the synthetic resin film, while stretching of the surface thereof is in progress, in such a manner that the molding resin presses directly against this surface in a state of high pressure, and subsequently cooling a surface of contact between the synthetic resin film and molding resin to a temperature at which the molten molding resin solidifies. As a result, the surfaces of contact between the synthetic resin film and molding resin are directly and strongly fused.
    Type: Grant
    Filed: February 12, 1997
    Date of Patent: July 11, 2000
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiro Inagaki, Takashi Shinoki
  • Patent number: 5613599
    Abstract: A keytop sheet of a push-button switch includes a keytop made of synthetic resin that is molded on a sheet of resin film. A portion of the film sheet surrounding the portion thereof on which the keytop is molded is provided with a curved projection protruding in a downward and/or upward direction from the surface of the film sheet. Such curved projection can be replaced by providing the portion of the film sheet surrounding the portion thereof on which the keytop is molded with a cut-out to form a hinge portion. A nameplate provided with a hole shaped so that the keytop may be passed therethrough is attached to the film sheet so as to cover the cut-out and hinge portion of the film sheet. The nameplate can have an outer diameter greater than that of the film sheet. A frame made of synthetic resin is fixed to an underside of the film sheet on an outer peripheral portion thereof. An outer peripheral portion of the nameplate is bent and fixed to an outer peripheral side surface of the frame.
    Type: Grant
    Filed: March 25, 1996
    Date of Patent: March 25, 1997
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiro Inagaki, Atsushi Hari, Nobuyuki Kikuchi, Takashi Shinoki
  • Patent number: 5589121
    Abstract: A method of enlarging a design possessed by a synthetic resin film includes a printing step of printing the design on the top side of the synthetic resin film, and an enlarging deformation step of providing a curved portion by stretching a prescribed surface of the synthetic resin film which includes a portion on which the design has been printed and curvingly deforming the prescribed surface in such a manner that the surface will protrude above the plane defined by the synthetic resin film. The design printed on the synthetic resin film beforehand in the printing step is printed in dimensions conforming to the rates of enlargement of points on the curved portion of the synthetic resin film. A portion of the design having a small rate of enlargement is printed at relatively large dimensions in comparison with other portions thereof and a portion of the design having a high rate of enlargement is printed at relatively small dimensions in comparison with other portions thereof.
    Type: Grant
    Filed: December 14, 1994
    Date of Patent: December 31, 1996
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiro Inagaki, Takashi Shinoki, Atsushi Hari
  • Patent number: 5475192
    Abstract: A keytop sheet of a push-button switch includes a keytop, which is made of synthetic resin, molded on a sheet of resin film. A portion of the film sheet surrounding the portion thereof on which the keytop is molded is provided with a curved projection protruding in a downward and/or upward direction from the surface of the film sheet. Alternatively, a cut-out separates the portion of the film sheet on which the keytop is molded from the remainder of the film sheet while leaving a hinge portion, and a nameplate through which the keytop passes is attached to the film sheet so as to over the cut-out and hinge portion of the film sheet. The nameplate may have an outer diameter greater than that of the film sheet, and a frame made of synthetic resin is fixed to an underside of the film sheet on an outer peripheral portion thereof. The outer peripheral portion of the nameplate is bent and fixed to an outer peripheral side surface of the frame.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: December 12, 1995
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiro Inagaki, Atsushi Hari, Nobuyuki Kikuchi, Takashi Shinoki
  • Patent number: 5399821
    Abstract: A push-button switch keytop includes a flexible resin film deformed in such a manner that the resin film bulges upwardly to form a curved portion that is filled with a molding resin while the resin film is being deformed. The molding resin is allowed to harden to form a keytop body, whereby the top side of the keytop body consisting of the molding resin is integrated with the resin film in a state in which the top side of the keytop body is covered by the resin film. The keytop is manufactured by clamping a resin film between upper and lower molds, charging a molten resin from a pin gate provided on the lower mold into a cavity provided in the lower mold, thereby deforming and urging the resin film upward by pressure and heat produced by the molten resin and causing the resin film to adhere to the inner surface of the upper mold, filling the cavities of the upper and lower molds with the molten resin and separating the upper and lower molds after the resin hardens.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: March 21, 1995
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiro Inagaki, Atsushi Hari, Nobuyuki Yagi, Yasutoshi Kaku, Takashi Shinoki
  • Patent number: 5362934
    Abstract: The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.
    Type: Grant
    Filed: April 14, 1993
    Date of Patent: November 8, 1994
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiroh Inagaki, Atsushi Hari, Nobuyuki Yagi, Yasutoshi Kaku, Takashi Shinoki
  • Patent number: 5362932
    Abstract: The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.
    Type: Grant
    Filed: October 12, 1993
    Date of Patent: November 8, 1994
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiroh Inagaki, Atsushi Hari, Nobuyuki Yagi, Yasutoshi Kaku, Takashi Shinoki
  • Patent number: 5280146
    Abstract: The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.
    Type: Grant
    Filed: October 29, 1991
    Date of Patent: January 18, 1994
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Jiroh Inagaki, Atsushi Hari, Nobuyuki Yagi, Yasutoshi Kaku, Takashi Shinoki