Abstract: An automatic screw tightening method includes measuring a datum on time-varying screw tightening torque from a motor and a datum on time-varying motor rotational speed between a screw tightening start time point for a male thread with respect to a female threaded hole and a screw tightening completion time point; extracting a plurality of features from measurement-based data on the time-varying screw tightening torque and the time-varying motor rotational speed; and determining, with use of the features, whether a tightened state of the male thread is fit or unfit. In the determination, determining a unified numerical index from the features is included, and the numerical index is compared with a predetermined threshold in the determination of whether the tightened state is fit or unfit. The numerical index is a Taguchi (T) method-based overall evaluation measure from the features.

Abstract: The semiconductor package includes a package wiring board having an element housing recessed portion on its top surface to house a semiconductor element; multiple side electrodes which are arranged on the outer side surface of the package wiring board and soldered to multiple motherboard electrodes arranged on a motherboard; a semiconductor element fixed onto the bottom surface of the element housing recessed portion; and an element electrode arranged on the bottom of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes. The package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated, and the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles.

Abstract: In a wavelength conversion element in which a periodic poled crystal that converts an input laser light into a laser light of a predetermined wavelength is provided on a thick-film resistance substrate including a heating unit, a heat spreader having a predetermined thermal conductivity, which equalizes a temperature distribution of the periodic poled crystal, is provided between the thick-film resistance substrate and the periodic poled crystal, and the thick-film resistance substrate and the heat spreader, and the heat spreader and the periodic poled crystal are adhered by an adhesive member having a predetermined thermal conductivity.

Abstract: An imaging device comprising an imaging element having a light acceptance plane, a frame surrounding a marginal portion of said imaging element and fixing said imaging element, an image formation lens configured to form an image on said light acceptance plane, a lens-barrel configured to support said image formation lens, and a supporting member on which said lens-barrel is mounted and including legs forming an opening for accommodating said frame and said imaging element, wherein an outside of said frame includes protrusions, the legs of said supporting member include mount portions configured to mount said protrusions, and said protrusions are mounted integrally on said mount portions.

Abstract: An electron gun assembling apparatus has a cathode driving mechanism (12,13) for moving a cathode (1), a laser displacement gage (14) to measure a height of a surface of the cathode (1) in a non-contact manner at a cathode surface measuring position outside an electron gun assembly (24), an electric micrometer (11) to measure a height of an upper surface of a first electrode (3) in the electron gun assembly (24), and an electric micrometer (8) to measure a height of a lower surface of a second electrode (4) in the electron gun assembly (24).