Abstract: The present technology relates to an image pickup element, a control method, and an image pickup device which realize easier and more diversified data output. In one aspect of the present technology, a plurality of signal lines for transmitting a pixel signal read from a pixel is allocated to each column, and different reading modes of the pixel signals are respectively allocated to the signal lines of each column. Regarding each column of the pixel array connected to the pixel corresponding to the mode, the pixel signal is read from the pixel connected to the signal line corresponding to the reading mode of the pixel signal in the mode, and the read pixel signal is transmitted via the signal line. The present technology is applied to, for example, an image pickup element and an image pickup device.

Abstract: The present technology relates to an image pickup element, a control method, and an image pickup device which realize easier and more diversified data output. In one aspect of the present technology, a plurality of signal lines for transmitting a pixel signal read from a pixel is allocated to each column, and different reading modes of the pixel signals are respectively allocated to the signal lines of each column. Regarding each column of the pixel array connected to the pixel corresponding to the mode, the pixel signal is read from the pixel connected to the signal line corresponding to the reading mode of the pixel signal in the mode, and the read pixel signal is transmitted via the signal line. The present technology is applied to, for example, an image pickup element and an image pickup device.

Abstract: The present technology relates to an image pickup element, a control method, and an image pickup device which realize easier and more diversified data output. In one aspect of the present technology, a plurality of signal lines for transmitting a pixel signal read from a pixel is allocated to each column, and different reading modes of the pixel signals are respectively allocated to the signal lines of each column. Regarding each column of the pixel array connected to the pixel corresponding to the mode, the pixel signal is read from the pixel connected to the signal line corresponding to the reading mode of the pixel signal in the mode, and the read pixel signal is transmitted via the signal line. The present technology is applied to, for example, an image pickup element and an image pickup device.

Abstract: The present technology relates to an image pickup element, a control method, and an image pickup device which realize easier and more diversified data output. In one aspect of the present technology, a plurality of signal lines for transmitting a pixel signal read from a pixel is allocated to each column, and different reading modes of the pixel signals are respectively allocated to the signal lines of each column. Regarding each column of the pixel array connected to the pixel corresponding to the mode, the pixel signal is read from the pixel connected to the signal line corresponding to the reading mode of the pixel signal in the mode, and the read pixel signal is transmitted via the signal line. The present technology is applied to, for example, an image pickup element and an image pickup device.

Abstract: A distribution apparatus according to the present application includes an accepting unit, a determination unit, and a distribution unit. The accepting unit accepts submission of video content to be displayed in a predetermined content display frame. The determination unit determines display order of the video content based on information indicating users' reactions to the video content accepted by the accepting unit. The distribution unit distributes the video content such that the video content are displayed in the display order determined by the determination unit.

Abstract: The present invention has been made in consideration of the above-described situation, and provides a method of producing a circuit board that can bond a component to be mounted without slanting the component, and simplify the steps. The method of producing a circuit board includes forming a first adhesive layer by applying a first adhesiveness-imparting compound on the surface of terminal portions of a circuit board; attaching a core body on the first adhesive layer of the terminal portions; forming a second adhesive layer by applying a second adhesiveness-imparting compound on the surface of the core body; attaching first solder particles on the second adhesive layer of the surface of the core body; and forming a solder layer on the surface of the core body by melting the first solder particles.

Abstract: Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board.

Abstract: Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

Abstract: Disclosed herein is a solid-state imaging device including: a plurality of common pixel sections arranged in a matrix form so that pixel signals of a plurality of photoelectric conversion elements arranged in the same row can be output; a plurality of row address lines used to select some of the photoelectric conversion elements in each row; and a scan section that allows for the pixel signals of the plurality of photoelectric conversion elements to be output through addressing adapted to select the plurality of row address lines one at a time in sequence, in which the plurality of row address lines are connected to the plurality of photoelectric conversion elements arranged in the same row in each of the common pixel sections so that the scan section can individually select the plurality of photoelectric conversion elements arranged in the same row in each of the common pixel sections during addressing.

Abstract: The display device including: a display panel; a backlight; a memory for converting frame rate of an input video signal and outputting a video signal; an interpolation frame generation unit for generating an interpolation frame based on the video signal output from the memory; a histogram generator for generating a histogram based on the input video signal; and a backlight brightness calculation unit for calculating a backlight control signal, the display device further comprising: wherein image data for display, which is obtained by an N-th frame of the input video signal, and image data of the interpolation frame generated based on the N-th frame and an (N+1)-th frame of the input video signal, is input to the display panel; and wherein the backlight control signal calculated based on the histogram generated based on the image data of the N-th frame is used for displaying the image data for display.

Abstract: There is provided a radiographic imaging device including: a radiation detector; a switching power supply; a storage section; a reading section; and a control section that controls the switching power supply so as to implement switching control and cause electricity to be accumulated in the storage section at a time when charge is not being read by the reading section, and stop switching control at a time when charge is being read by the reading section.

Abstract: Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board.

Abstract: A portable radiographic imaging device includes an operation unit, a controller, and an execution unit. The operation unit is operated when a target function is selected from plural different functions relating to radiographic image capturing. When a first condition, that expresses that a predetermined region has been placed at a predetermined placement portion, is established, the controller carries out control such that a function that should be effective when the first condition is established is selected. When a second condition, that expresses that the predetermined region is not placed at the placement portion, is established, the controller carries out control such that a function that should be effective when the second condition is established is selected. When the operation unit is operated, the execution unit executes a function that is controlled by the controller to be selected.

Abstract: A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.

Abstract: Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

Abstract: The present invention has been made in consideration of the above-described situation, and provides a method of producing a circuit board that can bond a component to be mounted without slanting the component, and simplify the steps. The method of producing a circuit board includes forming a first adhesive layer by applying a first adhesiveness-imparting compound on the surface of terminal portions of a circuit board; attaching a core body on the first adhesive layer of the terminal portions; forming a second adhesive layer by applying a second adhesiveness-imparting compound on the surface of the core body; attaching first solder particles on the second adhesive layer of the surface of the core body; and forming a solder layer on the surface of the core body by melting the first solder particles.

Abstract: A signal converter to make a display module conduct an n-ply display operation divides one frame period of input display data into n subframes to obtain n-ply display data, shifts the sampling position for each n-ply display data, samples the data to convert resolution thereof, rearranges in n ways a combination of subpixels included in each pixel of output display data resultant from the sampling, and varying the sampling position and the combination of subpixels for each subframe in a cooperative fashion.

Abstract: A radiation image signal output control method in which distance information that indicates a distance between a radiation image detection cassette and a receiving unit is obtained by a distance information obtaining means, and wireless signals are controlled by an output control means to be outputted from the radiation image detection cassette if the distance indicated by the distance information obtained by the distance information obtaining means is less than or equal to a predetermined value, and not to be outputted therefrom if the distance is greater than the predetermined value.

Abstract: A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.

Abstract: A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.