Abstract: An object is to provide a separator excellent in adhesiveness to electrodes and a separator for an electricity storage device also excellent in handling performance. A separator for an electricity storage device having a polyolefin microporous film and a thermoplastic polymer coating layer covering at least a part of at least one of surfaces of the polyolefin microporous film, in which the thermoplastic polymer coating layer, on the polyolefin microporous film, has a portion containing a thermoplastic polymer and a portion not containing the thermoplastic polymer in a sea-island configuration, the thermoplastic polymer coating layer contains the thermoplastic polymer having at least two glass-transition temperatures, at least one of the glass-transition temperatures is in a range of less than 20° C. and at least one of the glass-transition temperatures is in a range of 20° C. or more.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: An object is to provide a separator excellent in adhesiveness to electrodes and a separator for an electricity storage device also excellent in handling performance. A separator for an electricity storage device having a polyolefin microporous film and a thermoplastic polymer coating layer covering at least a part of at least one of surfaces of the polyolefin microporous film, in which the thermoplastic polymer coating layer, on the polyolefin microporous film, has a portion containing a thermoplastic polymer and a portion not containing the thermoplastic polymer in a sea-island configuration, the thermoplastic polymer coating layer contains the thermoplastic polymer having at least two glass-transition temperatures, at least one of the glass-transition temperatures is in a range of less than 20° C. and at least one of the glass-transition temperatures is in a range of 20° C. or more.

Abstract: An object is to provide a separator excellent in adhesiveness to electrodes and a separator for an electricity storage device also excellent in handling performance. A separator for an electricity storage device having a polyolefin microporous film and a thermoplastic polymer coating layer covering at least a part of at least one of surfaces of the polyolefin microporous film, in which the thermoplastic polymer coating layer, on the polyolefin microporous film, has a portion containing a thermoplastic polymer and a portion not containing the thermoplastic polymer in a sea-island configuration, the thermoplastic polymer coating layer contains the thermoplastic polymer having at least two glass-transition temperatures, at least one of the glass-transition temperatures is in a range of less than 20° C. and at least one of the glass-transition temperatures is in a range of 20° C. or more.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: A method including clamping an integrated circuit package substrate between first and second supporting substrates; exposing the clamped package substrate to a heat source from a single direction; and modifying a shape of the package substrate. An apparatus including a first and second supporting substrates, the first supporting substrate including a two-dimensional area that is 75 percent to 95 percent of the area of the first side of the package substrate and the second supporting substrate including a two-dimensional area that is at least equivalent to the area of a package substrate and each of the first supporting substrate and the second supporting substrate include a body having a cavity therein such that when assembled on opposite sides of a package substrate, each cavity has a volume dimension such that the body of the supporting substrate is not in contact with an area of a package substrate.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: A method including clamping an integrated circuit package substrate between first and second supporting substrates; exposing the clamped package substrate to a heat source from a single direction; and modifying a shape of the package substrate. An apparatus including a first and second supporting substrates, the first supporting substrate including a two-dimensional area that is 75 percent to 95 percent of the area of the first side of the package substrate and the second supporting substrate including a two-dimensional area that is at least equivalent to the area of a package substrate and each of the first supporting substrate and the second supporting substrate include a body having a cavity therein such that when assembled on opposite sides of a package substrate, each cavity has a volume dimension such that the body of the supporting substrate is not in contact with an area of a package substrate.

Abstract: An object is to provide a separator excellent in adhesiveness to electrodes and a separator for an electricity storage device also excellent in handling performance. A separator for an electricity storage device having a polyolefin microporous film and a thermoplastic polymer coating layer covering at least a part of at least one of surfaces of the polyolefin microporous film, in which the thermoplastic polymer coating layer, on the polyolefin microporous film, has a portion containing a thermoplastic polymer and a portion not containing the thermoplastic polymer in a sea-island configuration, the thermoplastic polymer coating layer contains the thermoplastic polymer having at least two glass-transition temperatures, at least one of the glass-transition temperatures is in a range of less than 20° C. and at least one of the glass-transition temperatures is in a range of 20° C. or more.

Abstract: Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: The method of manufacturing a circuit board is capable of preventing deformation of a core substrate, ensuring size thereof and highly concentrating cable patterns so as to realize compact and high-performance semiconductor devices. The method of manufacturing a circuit board of the present invention comprises the steps of: forming a multilayered body, in which cable patterns on different layers insulated by an insulating layer are electrically connected, on a core substrate by a buildup process; and separating the multilayered body from the core substrate. A metal layer is vacuum-adhered on the core substrate.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: A multilayer wiring board is composed of a core portion, a first wiring portion and a second wiring portion. The core portion includes a core insulating layer containing a carbon fiber material. The first wiring portion is bonded to the core portion and has a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth. The second wiring portion is bonded to the first wiring portion and has a laminated structure including at least a second insulating layer and a second wiring pattern. The core portion, the first wiring portion and the second wiring portion are arranged in a stack.