Patents by Inventor Takashi Shutou

Takashi Shutou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and manufacturing method therefor
    Publication number: 20030135994
    Abstract: The present invention relates to a method for manufacturing a printed circuit board, and the method comprises forming penetrating holes in predetermined positions of an insulating substrate, then forming resist films having a predetermined pattern on the front and the rear surfaces of the insulating substrate; plating the insulating substrate provided with the resist films so as to form conductive plating patterns on the front and the rear surfaces of the insulating substrate and conductive paths on the inside surfaces of the penetrating holes, the conductive plating patterns being connected to each other via the conductive paths; and subsequently removing the resist films.
    Type: Application
    Filed: January 15, 2003
    Publication date: July 24, 2003
    Applicant: Fujitsu Limited
    Inventors: Takashi Shutou, Yasuhito Takahashi, Kenji Iida, Kenji Takano, Yukio Miyazaki