Abstract: Provided is an optical fiber which is provided with heat resistance and productivity and in which a transmission loss is suppressed even in a high-temperature environment. It has, on an outer periphery of a glass fiber composed of a core part and a cladding part, a coating layer made by crosslinking an energy-curable resin composition containing a silicon compound, in which the silicon compound contained in the energy-curable resin composition of the coating layer as an outermost layer has a specified structure having a cyclic silicone site having an epoxy group and a linear silicone site, with the content of the cyclic silicone site in the compound being from 10 to 30% by mass.

Abstract: Provided is an optical fiber which is provided with heat resistance and productivity and in which a transmission loss is suppressed even in a high-temperature environment. It has, on an outer periphery of a glass fiber composed of a core part and a cladding part, a coating layer made by crosslinking an energy-curable resin composition containing a silicon compound, in which the silicon compound contained in the energy-curable resin composition of the coating layer as an outermost layer has a specified structure having a cyclic silicone site having an epoxy group and a linear silicone site, with the content of the cyclic silicone site in the compound being from 10 to 30% by mass.

Abstract: A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra-Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y=C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.

Abstract: A curable composition which comprises at least one of the following (A), (B), and (C) and further contains (D) (provided that when (C) is not contained, both (A) and (B) are in the composition. (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A? and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A?, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst.

Abstract: A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra—Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y?C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.

Abstract: A high withstand voltage semiconductor chip mounted on a package or a board is covered with a sealing resin, and the resin is cured while a high voltage is applied between at least one of electrode terminals connected from a chip electrode or the chip via wiring of wires or the like and another electrode that necessitates a dielectric withstand voltage between the electrode and the electrode terminal during the curing. The sealing resin is provided by a synthetic high molecular compound structured in a manner that an organic silicon polymer C is constituted by alternately linearly linking an organic silicon polymer A having a crosslinking structure of siloxane with an organic silicon polymer B having a linear link structure of siloxane (Si—O—Si bond) by siloxane bond and the polymers are three-dimensionally linked together by covalent bond.

Abstract: A curable composition which comprises at least one of the following (A), (B), and (C) and further contains the following (D) (provided that when (C) is not contained, both (A) and (B) are contained). (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A? and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A?, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst.

Abstract: There is disclosed a scanning probe microscope capable of producing a topographic image at a high resolution with a cantilever of a large spring constant and, at the same time, a surface potential image at a high resolution. This microscope can take the form of an atomic force microscope that detects the surface potential of a sample, using a force gradient acting between the probe tip and the sample. The gradient is represented by the output from a frequency-to-voltage converter.

Abstract: There is disclosed a scanning probe microscope capable of producing a topographic image and a magnetic image of a surface of a sample in one measurement. The microscope has a probe tip made of a magnetic material. A physical force, such as an atomic force, is exerted between the probe tip and the sample. When this physical force does not act on the probe tip, it vibrates at a first vibrational frequency. Displacements of the probe tip are detected by a photodetector. A topographic information-extracting portion including a voltage-to-current converter, a phase shifter, an FM demodulator, a low-pass filter, and an error amplifier extracts a signal representative of topographic information from the output from the photodetector. A magnetic distribution-extracting portion, including an oscillator and a lock-in amplifier, extracts information about the magnetism of the sample from the output from the photodetector.